Touch Screen Integrated Organic Light Emitting Display Device and Method for Fabricating the Same

• US 20150155526A1
• Filed: 12/24/2014
• Published: 06/04/2015
• Est. Priority Date: 12/07/2011
• Status: Active Grant

• Current Assignee: LG Display Co., Ltd.
• Original Assignee: LG Display Co., Ltd.
• Inventors: Lee, Jae-Do, Choi, Ho-Won
• Granted Patent: US 9,196,876 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 3/0412 Digitisers structurally integrated in a display
• CPC Class Codes: H10K 59/12 Active-matrix OLED [AMOLED] displays
• CPC Class Codes: H10K 59/40 OLEDs integrated with touch screens
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass

Abstract

Disclosed are a touch screen integrated organic light emitting display device which has a thin profile and is implemented in a flexible type and a method for fabricating the same. The touch screen integrated organic light emitting display device includes a film substrate, a first etch stopper layer and a first buffer layer sequentially formed on the film substrate, a thin film transistor array including thin film transistors formed on the first buffer layer, organic light emitting diodes connected to the thin film transistors, a passivation layer covering the thin film transistor array and the organic light emitting diodes, a touch electrode layer contacting the passivation layer, a second buffer layer and a second etch stopper layer sequentially formed on the touch electrode layer, and a polarizing plate formed on the second etch stopper layer.

Claims

1. A method for fabricating a touch screen integrated organic light emitting display device, comprising:

sequentially forming a first etch stopper layer, a first buffer layer, a thin film transistor array including thin film transistors, organic light emitting diodes connected to the thin film transistors, and a passivation layer covering the thin film transistor array and the organic light emitting diodes on a first substrate;

sequentially forming a second etch stopper layer, a second buffer layer, and a touch electrode layer on a second substrate;

attaching the touch electrode layer to the passivation layer such that the touch electrode layer and the passivation layer are opposite each other;

removing the first substrate and the second substrate; and

attaching a film substrate to a surface of the first etch stopper layer which is exposed after the removal of the first substrate.

2. The method according to claim 1, further comprising attaching a polarizing plate to a surface of the second etch stopper layer which is exposed after the removal of the second substrate.

3. The method according to claim 1, wherein the step of removing the first substrate and the second substrate is carried out by etching or irradiating a laser to the first substrate and the second substrate.

4. The method according to claim 1, wherein the step of forming the first buffer layer and the second buffer layer is carried out by depositing at least one of an oxide layer and a nitride layer.

5. The method according to claim 1, wherein the first substrate protrudes more outwardly than the second substrate.

6. The method according to claim 5, wherein the step of forming the touch electrode layer includes forming first touch electrodes and second touch electrodes intersecting each other and touch pad electrodes respectively transmitting signals to the first and second touch electrodes.

7. The method according to claim 6, wherein, in the step of attaching the touch electrode layer to the passivation layer, the touch pad electrodes are connected to dummy metal formed in the same layer as the thin film transistor array.

8. The method according to claim 7, wherein the touch pad electrodes and the dummy metal are connected by applying a sealant including conductive metal balls.

9. The method according to claim 1, wherein the step of attaching the film substrate to the surface of the first etch stopper layer is carried out by intervening an adhesive layer between the first etch stopper layer and the film substrate.

10. The method according to claim 6, further comprising providing a touch drive IC (integrated circuit) and an organic light emitting diode (OLED) IC at a portion of the first buffer layer protruding more outwardly than the touch electrode layer, wherein the touch drive IC transmits and receives signals to and from the first touch electrodes and the second touch electrodes and wherein the OLED IC transmits signals to the thin film transistor array and the organic light emitting diodes.

11. The method according to claim 10, further comprising forming a flexible printed circuit at the portion of the first buffer layer protruding more outwardly than the touch electrode layer, wherein the flexible printed circuit is to be connected to the touch drive IC and the OLED IC.

12. The method according to claim 1, further comprising forming a transparent cover on the polarizing plate, wherein the transparent cover is formed of a plastic insulating film or a glass.