INTELLIGENT MODULE

• US 20150156878A1
• Filed: 02/10/2015
• Published: 06/04/2015
• Est. Priority Date: 09/04/2012
• Status: Abandoned Application

• Current Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Original Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Inventors: TOBA, Akio, HACHISU, Yasuaki
• Application Number:
  US14/619,060
• Publication Number:
  US 20150156878A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 7/1432 specially adapted for power drive units or power converters
• CPC Class Codes: H05K 7/14322 wherein the control and power circuits of a power converter are arranged within the same casing
• CPC Class Codes: H05K 7/14327 having supplementary functional units, e.g. data transfer modules or displays or user interfaces

Abstract

Provided is an intelligent module including a common section including at least one common printed substrate having mounted thereupon circuit components including a drive circuit, a control calculation circuit, and a communication circuit. The common section includes a switching element module. The at least one common printed substrate and switching element are integrally formed. The intelligent module includes a customized section separated from the common section. The customized section includes a printed customized substrate, and circuit components, including a board power circuit, mounted on the printed customized substrate and in compliance with customer specifications.

Claims

1. An intelligent module comprising:

a switching element module including semiconductor switching elements, the semiconductor switching elements forming a power converter circuit;

a drive circuit for driving the switching elements;

a control calculation circuit for controlling the drive circuit;

a communication circuit;

a board power circuit;

a common section including

at least one common printed substrate having mounted thereupon circuit components including the drive circuit, the control calculation circuit, and the communication circuit, and

the switching element module integrally formed with the at least one common printed substrate; and

a customized section separated from the common section, the customized section including

a printed customized substrate, and

circuit components, including the board power circuit, mounted on the printed customized substrate and being in compliance with customer specifications.

2. The intelligent module according to claim 1, further comprising an insulating resin, the common section being integrally formed by being integrally molded by the insulating resin.

3. The intelligent module according to claim 1, further comprising an insulating resin filling all of an entire area between the switching element module and one of the at least one common printed substrate.

4. The intelligent module according to claim 1, further comprising signal lines that allow for an exchange of signals between the common section and the customized section by serial communication.

5. The intelligent module according to claim 4, further comprising:

a central processing unit (CPU) in the common section; and

an input/output circuit in the customized section and including a plurality of input/output terminals,

wherein an exchange of signals between the CPU and the plurality of input/output terminals included in the customized section is carried out by serial communication between the CPU and the input/output circuit.

6. The intelligent module according to claim 5, wherein the CPU is the control calculation circuit.

7. The intelligent module according to claim 1, wherein the communication circuit communicates with an external device to transmit to the external device and receive from the external device control commands, and detection values of at least one selected from the group consisting of temperature, current and voltage.

8. The intelligent module according to claim 1, wherein the board power circuit supplies control power to the intelligent module.

9. An intelligent module comprising:

a switching element module including semiconductor switching elements, the semiconductor switching elements forming a power converter circuit;

a drive circuit for driving the switching elements;

a control calculation circuit for controlling the drive circuit;

a common section including

at least one common printed substrate having mounted thereon circuit components, including the drive circuit and the control calculation circuit, and

the switching element module; and

a user accessible section that is accessible to a user, the user accessible section being separated from the common section and including

a user accessible printed substrate, and

circuit components mounted on the user accessible printed substrate.

10. The intelligent module according to claim 9, further comprising an insulating resin that integrally connects the at least one common printed substrate and the switching element module.

11. The intelligent module according to claim 9, further comprising an insulating resin that fills all of an entire area between the switching element module and one of the at least one common printed substrate.

12. The intelligent module according to claim 9, further comprising signal lines that allow for an exchange of signals between the common section and the user accessible section by serial communication.

13. The intelligent module according to claim 12, further comprising:

a central processing unit (CPU) in the common section; and

an input/output circuit in the user accessible section and having a plurality of input/output terminals to allow the user to connect other components to the input/output terminals,

wherein an exchange of signals between the CPU and the plurality of input/output terminals is carried out by serial communication between the CPU and the input/output circuit.

14. The intelligent module according to claim 13, wherein the CPU is mounted on the at least one common printed substrate.

15. The intelligent module according to claim 9, further comprising a communication circuit that is one of the circuit components of the user accessible section, the communication circuit communicating with an external device to transmit to the external device and receive from the external device control commands and detection values of at least one selected from the group consisting of temperature, current and voltage.

16. The intelligent module according to claim 9, further comprising a board power circuit that is one of the circuit components of the user accessible section,

wherein the board power circuit supplies control power to the intelligent module.