TAMPER-PROTECTED HARDWARE AND METHOD FOR USING SAME

• US 20150161415A1
• Filed: 02/17/2015
• Published: 06/11/2015
• Est. Priority Date: 03/11/2011
• Status: Active Grant

• Current Assignee: Emsycon GmbH
• Original Assignee: Emsycon GmbH
• Inventors: Kreft, Heinz
• Granted Patent: US 9,461,826 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G06F 21/335 for accessing specific resources, e.g. using Kerberos tickets
• CPC Class Codes: G06F 21/45 Structures or tools for the administration of authentication
• CPC Class Codes: G06F 21/57 Certifying or maintaining trusted computer platforms, e.g. secure boots or power-downs, version controls, system software checks, secure updates or assessing vulnerabilities
• CPC Class Codes: G06F 21/71 to assure secure computing or processing of information
• CPC Class Codes: G06F 21/73 by creating or determining hardware identification, e.g. serial numbers
• CPC Class Codes: G06F 21/87 by means of encapsulation, e.g. for integrated circuits
• CPC Class Codes: G06Q 20/223 based on the use of peer-to-peer networks
• CPC Class Codes: G06Q 20/3821 Electronic credentials
• CPC Class Codes: G06Q 20/3825 Use of electronic signatures
• CPC Class Codes: G09C 1/00 Apparatus or methods whereby a given sequence of signs, e.g. an intelligible text, is transformed into an unintelligible sequence of signs by transposing the signs or groups of signs or by replacing them by others according to a predetermined system cryptographic typewriters G09C3/00
• CPC Class Codes: H04L 2209/56 Financial cryptography, e.g. electronic payment or e-cash
• CPC Class Codes: H04L 63/0428 wherein the data content is protected, e.g. by encrypting or encapsulating the payload
• CPC Class Codes: H04L 63/0442 wherein the sending and receiving network entities apply asymmetric encryption, i.e. different keys for encryption and decryption cryptographic mechanisms or cryptographic arrangements for public-key encryption H04L9/30
• CPC Class Codes: H04L 63/0823 using certificates cryptographic mechanisms or cryptographic arrangements for entity authentication involving certificates H04L9/3263
• CPC Class Codes: H04L 9/0643 Hash functions, e.g. MD5, SHA, HMAC or f9 MAC
• CPC Class Codes: H04L 9/0861 Generation of secret information including derivation or calculation of cryptographic keys or passwords
• CPC Class Codes: H04L 9/14 using a plurality of keys or algorithms
• CPC Class Codes: H04L 9/30 Public key, i.e. encryption algorithm being computationally infeasible to invert or user's encryption keys not requiring secrecy
• CPC Class Codes: H04L 9/3239 involving non-keyed hash functions, e.g. modification detection codes [MDCs], MD5, SHA or RIPEMD
• CPC Class Codes: H04L 9/3247 involving digital signatures
• CPC Class Codes: H04L 9/3263 : involving certificates, e.g. public key certificate [PKC] or attribute certificate [AC]; Public key infrastructure [PKI] arrangements network architectures or network communication protocols for supporting authentication of entities using certificates in a packet data network H04L63/0823
• CPC Class Codes: H04L 9/3268 : using certificate validation, registration, distribution or revocation, e.g. certificate revocation list [CRL]
• CPC Class Codes: H04L 9/3278 : using physically unclonable functions [PUF]

Abstract

One of the various aspects of the invention is related to suggesting various techniques for improving the tamper-resistibility of hardware. The tamper-resistant hardware may be advantageously used in a transaction system that provides the off-line transaction protocol. Amongst these techniques for improving the tamper-resistibility are trusted bootstrapping by means of secure software entity modules, a new use of hardware providing a Physical Unclonable Function, and the use of a configuration fingerprint of a FPGA used within the tamper-resistant hardware.

Claims

1. A tamper-protected semiconductor module comprising:

a hardware module comprising one or more emitters for emitting a predetermined excitation that can be measured as a physical measurand, and one or more sensors for sensing the (back-) scatter of the excitation in form of the physical measurand in a contactless and/or contact-based manner, and

a cocoon housing the hardware module, the cocoon being adapted to influence the (back-) scatter of the predetermined excitation to be sensed by the sensors.

2. The tamper-protected semiconductor module according to claim 1, wherein the measured (back-) scatter of the predetermined excitation influenced by the cocoon provides a Physical Unclonable Function (PUF).

3. The tamper-protected semiconductor module according to claim 2, wherein hardware module is adapted to use the PUF provided by the measured (back-) scatter of the predetermined excitation influenced by the cocoon to detect a tampering of the tamper-protected semiconductor module.

4. The method according to claim 3, wherein the hardware module is adapted to make itself temporarily or permanently unusable, in case the hardware module detects a tampering of the tamper-protected semiconductor module.

5. The tamper-protected semiconductor module according to claim 3, being adapted to generate a digital measured fingerprint of the tamper-protected semiconductor module from the measured values of the (back-) scatter of the excitation provided by the respective sensors, and

further being adapted to detect an attempt to tamper the tamper-protected semiconductor module by comparing the digital measured fingerprint with a fingerprint of the un-tampered tamper-protected semiconductor module.

6. The tamper-protected semiconductor module according to claim 3, wherein the tamper-protected semiconductor module is adapted to generate a digital measured fingerprint of the tamper-protected semiconductor module from the measured values of (back-) scatter of the excitation provided by the sensors, and

further comprises a processor unit for receiving Helper-Data from a storage, and for generating a secret based on the digital measured fingerprint and the Helper-Data, wherein the secret, wherein in case the digital measured fingerprint is not corresponding to a fingerprint of the un-tampered tamper-protected semiconductor module, the generated secret is incorrect due to the PUF properties of the measured (back-) scatter of the predetermined excitation influenced by the cocoon.

7. The tamper-protected semiconductor module according to claim 1, wherein the one or more emitters is/are circuitry and/or integrated circuits of the hardware module.

8. The tamper-protected semiconductor module according to claim 1, wherein the one or more emitters are provided as one or more oscillators comprised by the hardware modules, wherein the oscillators in combination emit the predetermined excitation.

9. The tamper-protected semiconductor module according to claim 1, wherein the excitation is electromagnetic, electric, magnetic, acoustic and/or optical.

10. The tamper-protected semiconductor module according to claim 1, wherein the cocoon comprises a shielding to prevent interference with the predetermined excitation from the outside of the tamper-protected hardware.

11. The tamper-protected semiconductor module according to claim 10, wherein the shielding is at least one of an electromagnetic shielding, a magnetic shielding, an acoustic shielding and/or an optical shielding.

12. The tamper-protected semiconductor module according to claim 1, wherein the cocoon comprises a coating and/or a potting compound including a material or material mixture influencing the (back-) scatter of the predetermined excitation.

13. The tamper-protected semiconductor module according to claim 12, wherein granules of the material or the material mixture influence the (back-) scatter of the predetermined excitation.

14. The tamper-protected semiconductor module according to claim 13, wherein the granules of the material or the material mixture are non-regularly distributed in the potting material thereby influencing the (back-) scatter of the predetermined excitation in way unique to the tamper-protected semiconductor module.

15. The tamper-protected semiconductor module according to claim 12, wherein the material or the material mixture or the granules thereof is/are similar to chemical and physical character of the material mixture of the hardware module and/or its bonding.

16. The tamper-protected semiconductor module according to claim 1, wherein the tamper-protected semiconductor module deactivates integrated circuit parts of the hardware module during a measurement cycle in which the one or more sensors sense the (back-) scatter of the predetermined excitation.

17. The tamper-protected semiconductor module according to claim 16, wherein the deactivation is a deep power down to minimize the interference of the integrated circuit parts with the (back-) scatter of the predetermined excitation.