Methods Of Selective Layer Deposition

• US 20150162214A1
• Filed: 12/04/2014
• Published: 06/11/2015
• Est. Priority Date: 12/09/2013
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Thompson, David, Dai, Huixiong, Michaelson, Timothy, Narendrnath, Kadthala R., Visser, Robert Jan, Xu, Jingjing, Zhang, Lin, Martin, Patrick M.
• Granted Patent: US 9,716,012 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: C23C 16/04 Coating on selected surface areas, e.g. using masks
• CPC Class Codes: C23C 16/18 from metallo-organic compounds
• CPC Class Codes: C23C 16/45551 for relative movement of the substrate and the gas injectors or half-reaction reactor compartments
• CPC Class Codes: C23C 16/45553 characterized by the use of precursors specially adapted for ALD
• CPC Class Codes: C23F 1/12 Gaseous compositions
• CPC Class Codes: H01L 21/28562 Selective deposition
• CPC Class Codes: H01L 21/32051 Deposition of metallic or metal-silicide layers
• CPC Class Codes: H01L 21/76849 the layer being positioned on top of the main fill metal

Abstract

Provided are methods for selective deposition. Certain methods describe providing a first substrate surface; providing a second substrate surface; depositing a first layer of film over the first and second substrate surfaces, wherein the deposition has an incubation delay over the second substrate surface such that the first layer of film over the first substrate surface is thicker than the first layer of film deposited over the second substrate surface; and etching the first layer of film over the first and second substrate surfaces, wherein the first layer of film over the second substrate surface is at least substantially removed, but the first layer of film over the first substrate is only partially removed.

Claims

1. A method of selective layer deposition, the method comprising:

providing a substrate comprising a first substrate surface and a second substrate surface;

depositing a first layer of film over the first and second substrate surfaces, wherein the deposition has an incubation delay over the second substrate surface such that the first layer of film over the first substrate surface is thicker than the first layer of film deposited over the second substrate surface; and

then

etching the first layer of film over the first and second substrate surfaces, wherein the first layer of film over the second substrate surface is at least substantially removed, but the first layer of film over the first substrate is only partially removed.

2. The method of claim 1, wherein etching the first layer of film over the first and second substrate comprises etching away a thickness of the film equivalent to the thickness of the first layer of film over the second substrate surface.

3. The method of claim 1, wherein the first substrate surface comprises a metal, and the second substrate surface comprises a dielectric.

4. The method of claim 1, wherein the first substrate surface comprises a dielectric, and the second substrate surface comprise a metal.

5. The method of claim 1, wherein the first layer of film consists essentially of one or more metals.

6. The method of claim 5, wherein the metal is selected from the group consisting of tungsten and cobalt.

7. The method of claim 1, wherein depositing the first layer of film over the first and second substrate surfaces comprises atomic layer deposition or chemical vapor deposition.

8. The method of claim 7, wherein atomic layer deposition of the first layer of film comprises alternately exposing the first and second substrates to a tungsten precursor and hydrogen.

9. The method of claim 7, wherein atomic layer deposition of the first layer of film comprises alternately exposing the first and second substrates to a cobalt precursor and ammonia.

10. The method of claim 1, wherein etching the first layer of film over the first and second substrate surfaces comprises atomic layer etching or chemical etch.

11. The method of claim 10, wherein etching the first layer of film over the first and second substrate surfaces comprises atomic layer etching.

12. The method of claim 11, wherein atomic layer etching comprises alternately exposing the first layer of film over the first and second substrate surfaces to Br₂ and TMEDA.

13. The method of claim 7, wherein the atomic layer deposition comprises a spatial atomic layer deposition process.

14. The method of claim 1, wherein depositing the first layer of film over the first and second substrates comprises atomic layer deposition, and etching the first layer of film over the first and second substrate surfaces comprises atomic layer etching.

15. The method of claim 1, further comprising depositing a second layer of film over the first layer of film.

16. The method of claim 1, further comprising

depositing a first layer of a second film over the first and second substrate surfaces, wherein the deposition has an incubation delay over the first substrate surface and/or the first layer of the first film such that the first layer of the second film over the second substrate surface is thicker than the first layer of the second film deposited over the first substrate surface;

and

etching the first layer of the second film over the first and second substrate surfaces, wherein the first layer of the second film over the first substrate surface is at least substantially removed, but the first layer of the second film over the second substrate is only partially removed.

17. A method of selective atomic layer deposition of cobalt, the method comprising:

providing a substrate having a first substrate surface comprising cobalt and a second substrate surface comprising a dielectric;

exposing the first and second substrate surface to a precursor comprising Co(TMSA)₂(THF) to provide a first layer consisting essentially of cobalt over the first and second substrate surfaces, wherein the first layer consisting essentially of cobalt has a greater thickness over the first substrate than the second substrate; and

exposing the first layer consisting essentially of cobalt over the first and second substrate surfaces to a compound having a structure represented by formula (I);

18. The method of claim 17, further comprising halogenating the first layer consisting essentially of cobalt prior to exposing the first layer of cobalt to the compound of formula (I).

19. The method of claim 17, wherein the compound having a structure represented by formula (I) chelates with cobalt atoms in the first layer consisting essentially of cobalt until the layer of cobalt is substantially removed from the second substrate surface.

20. A method of processing a substrate comprising:

laterally moving a substrate having a first substrate surface and second substrate surface beneath a gas distribution plate comprising a plurality of elongate gas ports including a first gas outlet to deliver a first reactive gas, a second gas outlet to deliver a second reactive gas and a third gas outlet to deliver a third reactive gas;

delivering the first reactive gas comprising Co(TMSA)₂(THF) to the first and second substrate surfaces to form a first reactive layer on the first and second substrate surfaces;

laterally moving the substrate from a first processing region adjacent the first gas outlet to a second processing region adjacent the second gas outlet;

delivering the second reactive gas comprising ammonia to the first and second substrate surfaces to react with the first reactive layer to form a first layer of film over the first and second substrate surfaces, wherein the deposition has an incubation delay over the second substrate surface such that the first layer of film over the first substrate surface is thicker than the first layer of film deposited over the second substrate surface;

laterally moving the substrate from the second processing region to a third processing region adjacent the third gas outlet; and

delivering the third reactive gas comprising TMEDA to the first and second substrate surfaces to etch the first layer of film over the first and second substrate surfaces, wherein the first layer of film over the second substrate surface is at least substantially removed, but the first layer of film over the first substrate is only partially removed.