Packages with Thermal Management Features for Reduced Thermal Crosstalk and Methods of Forming Same
First Claim
Patent Images
1. A package comprising:
- a first die stack on a surface of a package component;
a second die stack on the surface of the package component; and
a heat-dissipating contour lid covering the first die stack, wherein the heat-dissipating contour lid comprises an opening over the second die stack.
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Abstract
An embodiment package includes a first die stack on a surface of a package component, a second die stack on the surface of the package component, and a contour lid over the first die stack and second die stack. The contour lid includes a first thermal conductive portion over the first die stack, a second thermal conductive portion over the second die stack, and a thermal barrier portion between the first thermal conductive portion and the second thermal conductive portion. The thermal barrier portion includes a low thermal conductivity material.
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Citations
20 Claims
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1. A package comprising:
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a first die stack on a surface of a package component; a second die stack on the surface of the package component; and a heat-dissipating contour lid covering the first die stack, wherein the heat-dissipating contour lid comprises an opening over the second die stack. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A package comprising:
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a first die stack on a surface of a package component; a second die stack on the surface of the package component; and a contour lid over the first die stack and second die stack, wherein the contour lid comprises; a first thermal conductive portion over the first die stack; a second thermal conductive portion over the second die stack; and a first thermal barrier portion between the first thermal conductive portion and the second thermal conductive portion, wherein the first thermal barrier portion comprises a low thermal conductivity material. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17)
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18. A method comprising:
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electrically connecting a first die stack to a substrate; electrically connecting a second die stack to the substrate; dispensing a first thermal interface material (TIM) on a top surface of the first die stack; forming a contour lid over the first die stack, wherein the contour lid comprises; a first thermal conductive portion physically contacting the first TIM; and a first thermal barrier adjacent to the first thermal conductive portion. - View Dependent Claims (19, 20)
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Specification