LIGHT EMITTING DEVICE

• US 20150162509A1
• Filed: 12/04/2014
• Published: 06/11/2015
• Est. Priority Date: 12/05/2013
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: KURAMOTO, Masafumi, SHIMIZU, Yasunori, YAMASAKI, Akiko, ICHIKAWA, Hirofumi, OTA, Akihiro
• Granted Patent: US 9,653,662 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: C09K 11/025 non-luminescent particle coatings or suspension media
• CPC Class Codes: C09K 11/7774 Aluminates
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2933/0091 Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/0095 Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/501 characterised by the materials, e.g. binder
• CPC Class Codes: H01L 33/502 Wavelength conversion materials
• CPC Class Codes: H01L 33/508 having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting device (100) according to the present disclosure includes a base substrate (10) having a recessed portion (15) at its upper surface (11); a light emitting element (20) provided in the recessed portion (15); and a sealing member (30) provided in the recessed portion (15), in which the sealing member (30) contains surface-treated particles (40), or particles (40) coexisting with a dispersing agent, and at least a part of an edge portion of the sealing member (30) is a region located in the vicinity of an edge (17) of the recessed portion, and in which at least one of the particles (40) and aggregates (41) of particles are unevenly distributed.

Claims

1. A light emitting device, comprising:

a base substrate having a recessed portion at an upper surface thereof;

a light emitting element provided in the recessed portion; and

a sealing member provided in the recessed portion, wherein

the sealing member contains surface-treated particles, or particles coexisting with a dispersing agent, and

at least a part of an edge portion of the sealing member is a region located in the vicinity of an edge of the recessed portion, at least one of the particles and aggregates of particles being unevenly distributed in the region.

2. The light emitting device according to claim 1, wherein the particle is a nanoparticle.

3. The light emitting device according to claim 1, wherein a content of the particles and/or the aggregates of the particles is in a range of 0.05% by weight or more and 50% by weight or less.

4. The light emitting device according to claim 1, wherein a content of the particles and/or the aggregates of the particles is in a range of 0.1% by weight or more and 20% by weight or less.

5. The light emitting device according to claim 1, wherein at least one of the particles or the aggregates of the particles exist at an outer edge of the sealing member.

6. The light emitting device according to claim 1, wherein an end surface of the base substrate is a cut surface.

7. The light emitting device according to claim 6, wherein a base material of the sealing member is made of silicone resin, modified silicone resin, silicon-modified resin or hybrid silicone resin.

8. The light emitting device according to claim 1, wherein an upper surface of the sealing member is a surface extending upward in a convex shape.

9. The light emitting device according to claim 1, wherein an inorganic coating is formed over an upper surface of the base substrate.

10. The light emitting device according to claim 1, wherein a base material of the sealing member is phenyl silicone resin, and

the particles are made of zirconium oxide.

11. The light emitting device according to claim 1, wherein half or more the edge portion of the sealing member is the region located in the vicinity of the edge of the recessed portion, at least either one of the particles and aggregates of particles being unevenly distributed in the region.

12. The light emitting device according to claim 1, wherein the particle has a spherical shape.

13. The light emitting device according to claim 1, wherein the particle is an inorganic material.

14. The light emitting device according to claim 1, wherein the particle is an organic material.

15. The light emitting device according to claim 2, wherein the sealing member contains phosphors.

16. The light emitting device according to claim 15, wherein the phosphors are at least on selected from the group consisting of yttrium-aluminum-garnet activated by cerium, a nitrogen-containing calcium aluminosilicate activated by europium and/or chromium, a sialon activated by europium, a silicate activated by europium, and a potassium fluosilicate activated by manganese.

17. The light emitting device according to claim 2, wherein an end surface of the base substrate is a cut surface.

18. The light emitting device according to claim 17, wherein a base material of the sealing member is made of silicone resin, modified silicone resin, silicon-modified resin or hybrid silicone resin.

19. The light emitting device according to claim 18, wherein a base material of the sealing member is phenyl silicone resin, and

the particles are made of zirconium oxide.

20. The light emitting device according to claim 19, wherein a content of the particles and/or the aggregates of the particles is in a range of 0.1% by weight or more and 20% by weight or less.