STRENGTHENED LED PACKAGE AND METHOD THEREFOR

• US 20150162512A1
• Filed: 07/12/2013
• Published: 06/11/2015
• Est. Priority Date: 07/30/2012
• Status: Active Grant

• Current Assignee: Lumileds LLC (Apollo Global Management, Inc.)
• Original Assignee: Koninklijke Philips N.V.
• Inventors: Soong, Chee Weng, Ishikawa, Tomonari, Tan, Su Ping, Goh, Chiou Bee
• Granted Patent: US 10,367,125 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 23/495 Lead-frames or other flat leads H01L23/498 takes precedence; lead frame interconnections between components H01L23/52
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 23/49544 Deformation absorbing parts in the lead frame plane, e.g. meanderline shape H01L23/49562 takes precedence
• CPC Class Codes: H01L 23/49548 Cross section geometry H01L23/49562 takes precedence
• CPC Class Codes: H01L 23/49551 characterised by bent parts
• CPC Class Codes: H01L 23/49555 the bent parts being the outer leads
• CPC Class Codes: H01L 23/49575 Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Crimping of an LED leadframe to a subassembly may stress the leadframe. Flat leadframes cannot accommodate these stresses. Strain relief sections are added to the flat leadframe to accommodate crimping or other stresses on the leadframe. Strain relief sections are created in the leadframe in the form or openings, notches or bulges. The strain relief sections may be symetric or asymmetric.

Claims

1. A apparatus comprising:

an electronic device having a top surface, a bottom surface opposite the top surface and at least one side surface(s) connected to the top surface and the bottom surface;

a flat leadframe comprising at least one leadframe member;

at least one leadframe member(s) connected to the electronic component; and

,

at least one leadframe member clinched to a subassembly, wherein the leadframe member(s) includes a strain relief region.

2. The apparatus of claim 1 wherein the electronic component is an LED.

3. The apparatus of claim 1 wherein the leadframe member(s) are connected to the bottom surface.

4. The apparatus of claim 1 wherein the leadframe member(s) are connected to a least one side surface.

5. The apparatus of claim 1 wherein the electronic component has at least four side surfaces.

6. The apparatus of claim 5 wherein at least two leadframe members are connected to two different side surfaces.

7. The apparatus of claim 1 wherein the strain relief region comprises at least one opening(s).

8. The apparatus of claim 7 wherein the opening(s) are triangular.

9. The apparatus of claim 1 wherein the strain relief region comprises at least one notch(s).

10. The apparatus of claim 9 wherein the notches(s) are parallel to at least one side surface(s).

11. The apparatus of claim 1 wherein the strain relief region comprises at least one bulge(s).

12. The apparatus of claim 11 wherein the bulges(s) are parallel to at least one side surface(s).

13. A apparatus comprising:

an electronic device having a top surface, a bottom surface opposite the top surface and four side surfaces connected to the top surface and the bottom surface, wherein each of the four side surfaces are perpendicular to both of the top surface and the bottom surface;

a flat leadframe comprising at least one leadframe member;

at least one leadframe member(s) connected to the electronic component; and

,

at least one leadframe member clinched to a subassembly,

wherein the leadframe member(s) includes a strain relief region.

14. The apparatus of claim 13 wherein at least two of the leadframe members are connected to two different side surfaces.

15. The apparatus of claim 14 wherein the strain relief region comprises at least one opening(s).

16. The apparatus of claim 15 wherein the opening(s) are triangular.

17. The apparatus of claim 14 wherein the strain relief region comprises at least one notch(s).

18. The apparatus of claim 17 wherein the notches(s) are parallel to at least one side surface(s).

19. The apparatus of claim 14 wherein the strain relief region comprises at least one bulge(s).

20. The apparatus of claim 19 wherein the bulges(s) are parallel to at least one side surface(s).