ELECTRONIC APPARATUS AND PROTECTIVE COVER OF MOBILE DEVICE

• US 20150162515A1
• Filed: 12/11/2013
• Published: 06/11/2015
• Est. Priority Date: 12/11/2013
• Status: Active Grant

• Current Assignee: HTC Corporation
• Original Assignee: HTC Corporation
• Inventors: SHIU, Yao-Wen, HSU, Chu-Yang, HU, Che-Chuan, TAN, Tzu-Chia, LIU, Chan-Hung
• Granted Patent: US 9,425,374 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H04B 1/3888 Arrangements for carrying or protecting transceivers
• CPC Class Codes: H10N 10/17 characterised by the structure or configuration of the cell or thermocouple forming the device

Abstract

An electronic apparatus and a protective cover for a mobile device are disclosed. The protective cover is removably attached on an outer surface of a mobile device. The protective cover comprises an outer protective layer, a thermo-conductive layer and a thermoelectric material layer. The thermo-conductive layer is attached on the outer surface of the mobile device. The thermoelectric material layer has a first side adjacent to the thermo-conductive layer and a second side adjacent to the outer protective layer. The thermoelectric material layer generates a current according to a temperature difference between the first side and the second side.

Claims

1. A protective cover, removably attached on an outer surface of a mobile device, the protective cover comprising:

an outer protective layer;

a thermo-conductive layer attached on the outer surface of the mobile device; and

a thermoelectric material layer having a first side adjacent to the thermo-conductive layer and a second side adjacent to the outer protective layer, the thermoelectric material layer being configured for generating a current according to a temperature difference between the first side and the second side.

2. The protective cover of claim 1, wherein the thermo-conductive layer is a metal layer configured for distributing heat from the outer surface and evenly dispersing the heat to different locations of the thermo-conductive layer.

3. The protective cover of claim 2, wherein the thermo-conductive layer adopts a material or an alloy selected from the group consisted of magnesium, aluminum and other metal material with high thermal conductivity.

4. The protective cover of claim 1, wherein a connection point is disposed on the outer surface of the mobile device, and the protective cover further comprises:

a circuit coupled between the connection point and the thermoelectric material layer, wherein the circuit is configured for transmitting the current to the connection point.

5. The protective cover of claim 1, wherein the outer protective layer is a plastic layer or a thermal-insulation material layer.

6. The protective cover of claim 1, wherein a shape of the protective cover fits the outer surface of the mobile device, such that the protective cover is closely attached onto the mobile device and the outer protective layer is configured for buffering an external force and protecting the mobile device.

7. An electronic apparatus, comprising:

a mobile device comprising an outer surface, a connection point being disposed on the outer surface; and

a protective cover removably attached on the outer surface of the mobile device, the protective cover comprising;

an outer protective layer;

a thermo-conductive layer attached on the outer surface of the mobile device; and

a thermoelectric material layer having a first side adjacent to the thermo-conductive layer and a second side adjacent to the outer protective layer, the thermoelectric material layer being configured for generating a current according to a temperature difference between the first side and the second side,

wherein, when the protective cover is attached on the outer surface of the mobile device, the thermo-conductive layer is coupled to the connection point, and the mobile device receives the current through the connection point.

8. The electronic apparatus of claim 7, wherein the thermo-conductive layer is a metal layer configured for distributing heat from the outer surface and evenly dispersing the heat to different locations of the thermo-conductive layer.

9. The electronic apparatus of claim 8, wherein the thermo-conductive layer adopts a material or an alloy selected from the group consisted of magnesium, aluminum and other metal material with high thermal conductivity.

10. The electronic apparatus of claim 8, wherein the protective cover further comprises:

a circuit coupled between the connection point and the thermoelectric material layer, wherein the circuit is configured for transmitting the current to the connection point.

11. The electronic apparatus of claim 8, wherein the outer protective layer is a plastic layer or a thermal-insulation material layer.

12. The electronic apparatus of claim 8, wherein a shape of the protective cover fits the outer surface of the mobile device, such that the protective cover is closely attached onto the mobile device and the outer protective layer is configured for buffering an external force and protecting the mobile device.

13. The electronic apparatus of claim 8, wherein the mobile device further includes a power module, a processing unit and a displaying unit, the power module is coupled to the processing unit, the displaying unit and the connection point, the power module provides a power to the processing unit and the displaying unit, when the thermo-conductive layer is coupled to the power module via the connection point, the thermo-conductive layer is utilized to charge the power module by the current generated by the thermo-conductive layer.

14. The electronic apparatus of claim 8, wherein an orientation of the outer surface is opposite to an orientation of the displaying unit.