Power Conversion Apparatus

• US 20150163961A1
• Filed: 07/24/2013
• Published: 06/11/2015
• Est. Priority Date: 09/28/2012
• Status: Abandoned Application

• Current Assignee: Hitachi Automotive Systems Limited (Hitachi, Ltd.)
• Original Assignee: Hitachi Automotive Systems Limited (Hitachi, Ltd.)
• Inventors: Hara, Yosei, Kuwano, Morio
• Application Number:
  US14/419,997
• Publication Number:
  US 20150163961A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 7/1432 specially adapted for power drive units or power converters
• CPC Class Codes: H05K 7/14322 wherein the control and power circuits of a power converter are arranged within the same casing
• CPC Class Codes: H05K 7/20218 using a liquid coolant without phase change in electronic enclosures in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change

Abstract

A power conversion apparatus includes power semiconductor modules (300U, 300V, 300W), a first flow path forming body (110) that forms a first flow path, a second flow path forming body (401) that forms a second flow bath, a first base plate (400) for mounting the second flow path forming body thereon, a drive circuit board (200), and a case (101). The drive circuit board (200) is provided so that a mounting surface of the drive circuit faces a side wall of the second flow bath forming body (401). The second flow path forming body (401) forms a housing space for housing the power semiconductor modules (300U, 300V, 300W). Further, the second flow path forming body (401) forms an insertion opening that leads to the housing space, on a side wall facing the mounting surface of the drive circuit. The power semiconductor modules (300U, 300V, 300W) have a control terminal that is connected to the &rive circuit board (200) by passing through the insertion opening. Then, the first flow path forming body (110) is fixed to the case (101). Because of this structure, it is possible to achieve further improvement in the ease of assembly of the power conversion apparatus.

Claims

1. A power conversion apparatus comprising:

a power semiconductor module including a power semiconductor element designed to convert a direct current to an alternating current;

a first flow path forming body that forms a first flow path for allowing cooling refrigerant to flow therethrough;

a second flow path forming body that forms a second flow path for allowing cooling refrigerant to flow therethrough;

a first base plate for mounting the second flow path forming body thereon;

a drive circuit board mounted with a drive circuit to output a drive signal to drive the power semiconductor element; and

a case for housing the power semiconductor module, the first flow path forming body, the second flow path forming body, the first base plate, and the drive circuit board,

wherein the drive circuit board is provided so that the mounting surface of the drive circuit faces a side wall of the second flow path forming body,

wherein the second flow path forming body forms a housing space for housing the power semiconductor module,

wherein the second flow path forming body further forms an insertion opening that leads to the housing space on the side wall facing the mounting surface of the drive circuit,

wherein the power semiconductor module has a control terminal that is connected to the drive circuit board by passing through the insertion opening,

wherein the first flow path forming body is fixed to the case,

wherein the first flow path forming body further forms an opening portion leading to the first flow path,

wherein the first base plate is designed to close the opening portion and to be connected to the first flow path forming body, and

wherein the first base plate further forms a first through hole connecting the first flow path and the second flow path.

2. The power conversion apparatus according to claim 1, comprising a capacitor module for smoothing the DC voltage,

wherein the capacitor module is provided on the first base plate.

3. The power conversion apparatus according to claim 2,

wherein the first flow path is formed to a position facing the capacitor module.

4. The power conversion apparatus according to claim 2,

wherein the capacitor module comprises a capacitor element, a capacitor side terminal electrically coupled to the capacitor element, and a capacitor case for housing the capacitor element and the capacitor side terminal,

wherein the capacitor case forms a capacitor side opening portion with the capacitor side terminal protruding outward, and

wherein the capacitor case is also provided on the first base plate so that the capacitor side opening portion faces the second flow path forming body.

5. The power conversion apparatus according to claim 1,

wherein the power semiconductor module is configured by a first power semiconductor module and a second power semiconductor module,

wherein the second power semiconductor module is provided at a position facing the first base plate with the first power semiconductor module interposed therebetween, and

wherein a flow path space through which the cooling refrigerant flows is formed between the first power semiconductor module and the second power semiconductor module.

6. The power conversion apparatus according to claim 1,

wherein a second through hole for connecting the first flow path and the second flow path is formed on the first base plate, and

wherein the first flow path forming body has a partition wall provided between the first through hole and the second through hole so as to be brought into contact with the first base plate.

7. The power conversion apparatus according to claim 1,

wherein the power conversion apparatus includes a DC-DC converter circuit for converting a DC voltage,

wherein the case is divided into a first housing space and a second housing space by the first flow path forming body,

wherein the power semiconductor module, the second flow path forming body, and the first base plate are housed in the first housing space, and

wherein the DC-DC converter circuit is housed in the second housing space and is provided in the second flow path forming body.

8. The power conversion apparatus according to claim 1, comprising:

a second base plate of metal provided at a position facing the first base with the power semiconductor module interposed therebetween, the second base plate being fixed to the case; and

a control circuit board mounted with a control circuit to output a control signal to the drive circuit in order to control the power semiconductor element,

wherein the control circuit board is provided at a position facing the power semiconductor module with the second base plate interposed therebetween.

9. The power conversion apparatus according to claim 1,

wherein the first flow path forming body is integrally formed with the case.