WAFER-LEVEL PACKAGING FOR SOLID-STATE TRANSDUCERS AND ASSOCIATED SYSTEMS AND METHODS

• US 20150171292A1
• Filed: 02/04/2015
• Published: 06/18/2015
• Est. Priority Date: 07/26/2011
• Status: Active Grant

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Odnoblyudov, Vladimir
• Granted Patent: US 10,008,647 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 27/15 including semiconductor components having potential barriers, specially adapted for light emission
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/0095 Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: H01L 33/46 Reflective coating, e.g. dielectric Bragg reflector
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

Wafer-level packaging of solid-state transducers (“SSTs”) is disclosed herein. A method in accordance with a particular embodiment includes forming a transducer structure having a first surface and a second surface opposite the first surface, and forming a plurality of separators that extend from at least the first surface of the transducer structure to beyond the second surface. The separators can demarcate lateral dimensions of individual SSTs. The method can further include forming a support substrate on the first surface of the transducer structure, and forming a plurality of discrete optical elements on the second surface of the transducer structure. The separators can form barriers between the discrete optical elements. The method can still further include dicing the SSTs along the separators. Associated SST devices and systems are also disclosed herein.

Claims

1. A solid-state transducer (SST) assembly comprising:

a plurality of SSTs, wherein individual SSTs include a support substrate, first contacts, a transducer structure, and second contacts stacked sequentially, and wherein the transducer structure has a first surface proximate to the support substrate and a second surface opposite the first surface;

a plurality of separators demarcating the individual SSTs, wherein the separators project from the first surface of the transducer structure beyond the second surface; and

a plurality of discrete optical elements over the second surface of the transducer structure, wherein the separators form barriers between the discrete optical elements.

2. The SST assembly of claim 1 wherein the separators comprise a dielectric isolator proximate to the transducer structure and at least one metal material.

3. The SST assembly of claim 1 wherein the support substrate comprises a plated metal substrate.

4. The SST assembly of claim 3 wherein the plated metal substrate forms a portion of the separators.

5. The SST assembly of claim 3 wherein the plated metal substrate has a thickness between approximately 50 μ

m and approximately 300 μ

m.

6. The SST assembly of claim 1 wherein the plurality of discrete optical elements comprise at least one of a plurality of discrete converter elements and a plurality of discrete cover elements, and wherein the separators form barriers between the discrete converter elements and the discrete cover elements.

7. The SST assembly of claim 1 wherein the separators are aligned with dicing lanes.

8. The SST assembly of claim 1 wherein SSTs are configured to emit electromagnetic radiation in at least one of the ultraviolet spectrum, the visible spectrum, and the infrared spectrum.

9. A solid state transducer (SST), comprising:

a transducer structure having a first surface opposite a second surface;

a support substrate on the first surface;

a protrusion around a periphery of the transducer structure, the projections extending above the second surface of the transducer structure; and

an optical element over the second surface of the transducer structure, wherein the projection confines the optical element.

10. The SST of claim 9 wherein the support substrate comprises a plated metal substrate.

11. The SST of claim 10 wherein the plated metal substrate defines a portion of the protrusion.

12. The SST of claim 9 wherein the SST is configured to emit electromagnetic radiation in at least one of the ultraviolet spectrum, the visible spectrum, and the infrared spectrum.

13. The SST of claim 9 wherein the optical element comprises at least one of a converter element and a cover element confined within the projection.