LIQUID-COOLING APPARATUS WITH INTEGRATED COOLANT FILTER
First Claim
1. A cooling apparatus comprising:
- a liquid-cooled heat sink configured to cool at least one electronic component, the liquid-cooled heat sink comprising;
a thermally conductive structure with a coolant-carrying compartment comprising, at least in part, a region of reduced cross-sectional coolant flow area through which coolant flows;
a coolant inlet and a coolant outlet associated with the thermally conductive structure and in fluid communication with the coolant-carrying compartment of the thermally conductive structure to facilitate coolant flow therethrough;
wherein the region of reduced cross-sectional coolant flow area of the coolant-carrying compartment provides an increased effective heat transfer coefficient between a main heat transfer surface of the thermally conductive structure and the coolant within the coolant-carrying compartment;
a coolant loop coupled to the coolant inlet and the coolant outlet of the liquid-cooled heat sink to facilitate flow of coolant through the coolant-carrying compartment thereof; and
a coolant filter positioned to filter contaminants from the coolant passing through the liquid-cooled heat sink, the coolant filter having a larger cross-sectional coolant flow area than the region of reduced cross-sectional coolant flow area of the coolant-carrying compartment within the thermally conductive structure of the liquid-cooled heat sink.
1 Assignment
0 Petitions
Accused Products
Abstract
Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from an electronic component(s). The cooling apparatus includes a liquid-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a region of reduced cross-sectional coolant flow area. The heat sink includes a coolant inlet and outlet in fluid communication with the compartment, and the region of reduced cross-sectional coolant flow area provides an increased effective heat transfer coefficient between a main heat transfer surface of the conductive structure and the coolant. The cooling apparatus further includes a coolant loop coupled to the coolant inlet and outlet to facilitate flow of coolant through the coolant-carrying compartment, and a coolant filter positioned to filter contaminants from the coolant passing through the heat sink. The coolant filter has a larger cross-sectional coolant flow area than the region of reduced cross-sectional coolant flow area.
17 Citations
20 Claims
-
1. A cooling apparatus comprising:
-
a liquid-cooled heat sink configured to cool at least one electronic component, the liquid-cooled heat sink comprising; a thermally conductive structure with a coolant-carrying compartment comprising, at least in part, a region of reduced cross-sectional coolant flow area through which coolant flows; a coolant inlet and a coolant outlet associated with the thermally conductive structure and in fluid communication with the coolant-carrying compartment of the thermally conductive structure to facilitate coolant flow therethrough; wherein the region of reduced cross-sectional coolant flow area of the coolant-carrying compartment provides an increased effective heat transfer coefficient between a main heat transfer surface of the thermally conductive structure and the coolant within the coolant-carrying compartment; a coolant loop coupled to the coolant inlet and the coolant outlet of the liquid-cooled heat sink to facilitate flow of coolant through the coolant-carrying compartment thereof; and a coolant filter positioned to filter contaminants from the coolant passing through the liquid-cooled heat sink, the coolant filter having a larger cross-sectional coolant flow area than the region of reduced cross-sectional coolant flow area of the coolant-carrying compartment within the thermally conductive structure of the liquid-cooled heat sink. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
-
-
12. A cooled electronic module comprising:
-
at least one electronic component to be cooled; and a cooling apparatus to facilitate cooling of the at least one electronic component, the cooling apparatus comprising; a liquid-cooled heat sink coupled to the at least one electronic component to be cooled, the liquid-cooled heat sink comprising; a thermally conductive structure with a coolant-carrying compartment comprising, at least in part, a region of reduced cross-sectional coolant flow area through which coolant flows; a coolant inlet and a coolant outlet associated with the thermally conductive structure and in fluid communication with the coolant-carrying compartment of the thermally conductive structure to facilitate coolant flow therethrough; wherein the region of reduced cross-sectional coolant flow area of the coolant-carrying compartment provides an increased effective heat transfer coefficient between a main heat transfer surface of the thermally conductive structure and the coolant within the coolant-carrying compartment; a coolant loop coupled to the coolant inlet and the coolant outlet of the liquid-cooled heat sink to facilitate flow of coolant through the coolant-carrying compartment thereof; and a coolant filter positioned to filter contaminants from the coolant passing through the liquid-cooled heat sink, the coolant filter having a larger cross-sectional coolant flow area than the region of reduced cross-sectional coolant flow area of the coolant-carrying compartment within the thermally conductive structure of the liquid-cooled heat sink. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19)
-
-
20. A method comprising:
-
providing a liquid-cooled heat sink configured to facilitate cooling at least one electronic component, the liquid-cooled heat sink comprising; a thermally conductive structure with a coolant-carrying compartment comprising, at least in part, a region of reduced cross-sectional coolant flow area through which coolant flows; a coolant inlet and a coolant outlet associated with the thermally conductive structure and in fluid communication with the coolant-carrying compartment of the thermally conductive structure to facilitate coolant flow therethrough; wherein the region of reduced cross-sectional coolant flow area of the coolant-carrying compartment provides an increased effective heat transfer coefficient between a main heat transfer surface of the thermally conductive structure and the coolant within the coolant-carrying compartment; coupling a coolant loop to the coolant inlet and the coolant outlet of the liquid-cooled heat sink to facilitate flow of coolant through the coolant-carrying compartment thereof; and providing a coolant filter positioned to filter contaminants from the coolant passing through the liquid-cooled heat sink, the coolant filter having a larger cross-sectional coolant flow area than the region of reduced cross-sectional coolant flow area of the coolant-carrying compartment within the thermally conductive structure of the liquid-cooled heat sink.
-
Specification