SUPPORTING BASE FOR SEMICONDUCTOR CHIP
First Claim
1. A supporting base 1 for a semiconductor chip, comprising:
- a substrate (10);
a surrounding wall (20) formed on the substrate (10), an accommodating space (21) formed between the surrounding wall (20) and the substrate (10) and provided for receiving the semiconductor chip (9) therein, the semiconductor chip (9) electrically connected to the substrate (10), the surrounding wall (20) having one side formed of an cut-out portion (22); and
a reflection plate (30) extended to be bent from the substrate (10) and formed within the cut-out portion (22), the reflection plate (30) configured to correspond with the semiconductor chip (9) and formed of an obtuse angle (31) with the substrate (10).
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Accused Products
Abstract
A supporting base for a semiconductor chip comprises a substrate, a surrounding wall and a reflection plate. The surrounding wall is formed on the substrate, and an accommodating space is formed between the surrounding wall and the substrate and is provided for receiving the semiconductor chip therein. The semiconductor chip is electrically connected to the substrate. The surrounding wall includes a cut-out portion on one side thereof. The reflection plate is extend to be bent from the substrate, and the reflection plate is configured to correspond to the cut-out portion and the semiconductor and is formed of an obtuse angle with the substrate. Therefore, with such structure, the present invention is able to achieve the effect of an increased illumination range.
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Citations
12 Claims
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1. A supporting base 1 for a semiconductor chip, comprising:
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a substrate (10); a surrounding wall (20) formed on the substrate (10), an accommodating space (21) formed between the surrounding wall (20) and the substrate (10) and provided for receiving the semiconductor chip (9) therein, the semiconductor chip (9) electrically connected to the substrate (10), the surrounding wall (20) having one side formed of an cut-out portion (22); and a reflection plate (30) extended to be bent from the substrate (10) and formed within the cut-out portion (22), the reflection plate (30) configured to correspond with the semiconductor chip (9) and formed of an obtuse angle (31) with the substrate (10). - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification