SUPPORTING BASE FOR SEMICONDUCTOR CHIP

• US 20150176800A1
• Filed: 12/25/2013
• Published: 06/25/2015
• Est. Priority Date: 12/25/2013
• Status: Abandoned Application

• Current Assignee: I-Chiun Precision Industry Company Limited
• Original Assignee: I-Chiun Precision Industry Company Limited
• Inventors: CHEN, CHIEN-YU, WU, CHING-AN
• Application Number:
  US14/140,509
• Publication Number:
  US 20150176800A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: F21V 7/00 Reflectors for light sources characterised by cooling arrangements F21V29/505
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48245 the item being metallic
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements

Abstract

A supporting base for a semiconductor chip comprises a substrate, a surrounding wall and a reflection plate. The surrounding wall is formed on the substrate, and an accommodating space is formed between the surrounding wall and the substrate and is provided for receiving the semiconductor chip therein. The semiconductor chip is electrically connected to the substrate. The surrounding wall includes a cut-out portion on one side thereof. The reflection plate is extend to be bent from the substrate, and the reflection plate is configured to correspond to the cut-out portion and the semiconductor and is formed of an obtuse angle with the substrate. Therefore, with such structure, the present invention is able to achieve the effect of an increased illumination range.

Claims

1. A supporting base 1 for a semiconductor chip, comprising:

a substrate (10);

a surrounding wall (20) formed on the substrate (10), an accommodating space (21) formed between the surrounding wall (20) and the substrate (10) and provided for receiving the semiconductor chip (9) therein, the semiconductor chip (9) electrically connected to the substrate (10), the surrounding wall (20) having one side formed of an cut-out portion (22); and

a reflection plate (30) extended to be bent from the substrate (10) and formed within the cut-out portion (22), the reflection plate (30) configured to correspond with the semiconductor chip (9) and formed of an obtuse angle (31) with the substrate (10).

2. The supporting base for a semiconductor chip according to claim 1, wherein the obtuse angle (31) is of an angle between 91 degrees and 179 degrees.

3. The supporting base for a semiconductor chip according to claim 2, wherein the obtuse angle (31) is of an angle between 110 degrees and 160 degrees.

4. The supporting base for a semiconductor chip according to claim 1, wherein the substrate (10) comprises a metal board member (11) and an insulation member (12);

the metal board member (11) includes an opening slot (111);

the insulation member (12) is fixed within the opening slot (111) and divides the metal board member (11) into a heat dissipating portion (112) and a conductive portion (113);

the heat dissipating portion (112) and a part of the conductive portion (113) are exposed in the accommodating space (21);

the semiconductor (9) is attached to the heat dissipating portion (112) and electrically connected to the conductive portion (113).

5. The supporting base for a semiconductor chip according to claim 4, wherein the surrounding wall (20) is fixed onto the metal board member (11) and the insulation member (12) the surrounding wall (20) and the insulation member (12) divide the conductive portion (113) within the accommodating space (21) into a plurality of electrodes (1131);

the semiconductor (9) is electrically connected to each one of the electrodes (1131).

6. The supporting base for a semiconductor chip according to claim 5, wherein the conductive portion (113) includes an insertion terminal (1132) extended from each electrode (1131) and protruded out of the surrounding wall (20).

7. The supporting base for a semiconductor chip according to claim 4, wherein the cut-out portion (22) is at one side of the heat dissipating portion (112) away from the conductive portion (113);

the reflection plate (30) is at one end of the heat dissipating portion (112) adjacent to the cut-out portion (22).

8. The supporting base for a semiconductor chip according to claim 4, wherein the opening slot (111) and the insulation member (12) are both of a W-resembling shape.

9. The supporting base for a semiconductor chip according to claim 8, wherein the opening slot (111) includes an inner wall having a plurality of first corner surfaces (1111);

the insulation member (12) includes an outer circumferential surface having a plurality of second corner surfaces (121);

each first corner surface (111) is firmly attached to each corresponding second corner surface (121).

10. The supporting base for a semiconductor chip according to claim 4, wherein the insulation member (12) is an insulation plastic unit.

11. The supporting base for a semiconductor chip according to claim 1, wherein the reflection board (30) includes a surface facing the accommodating space (21) and coated with a reflection coating layer (32).

12. The supporting base for a semiconductor chip according to claim 1, wherein the semiconductor chip (9′

) comprises a conductive ceramic plate (91) and two chip units (92, 92′

);

the conductive ceramic plate (91) is a rectangular elongated body, and the rectangular elongated body includes a flat top surface and a flat front surface with the chip units (92) attached thereon, respectively;

the chip unit (92) at the front surface is configured to correspond to a location of the reflection plate (30).