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TRANSPONDER LABEL RESISTANT TO HIGH TEMPERATURES

  • US 20150178613A1
  • Filed: 12/11/2014
  • Published: 06/25/2015
  • Est. Priority Date: 12/19/2013
  • Status: Active Grant
First Claim
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1. A temperature-resistant transponder label comprising:

  • (a) a transponder arrangement having a chip and an antenna structure connected to the chip;

    (b) a first adhesive layer for adhesively attaching the transponder label to an electronically conductive subsurface; and

    (c) a spacer layer for spacing the transponder arrangement apart from the conductive subsurface, wherein the spacer layer has an underside, the first adhesive layer is disposed on the underside, and the transponder arrangement is disposed on the spacer layer;

    wherein the spacer layer has a spacer layer material that is temperature-resistant so that a surface area of the transponder label covering the conductive subsurface after the transponder label has been adhesively attached to the conductive subsurface has a size that remains unchanged following heating of the transponder label from a starting temperature below 125°

    C. to a higher temperature between 125°

    C. and 400°

    C. and, after heating, cooling of the transponder label to the starting temperature; and

    wherein the first adhesive layer has a first adhesive layer material that is temperature-resistant so that loosening of the first adhesive layer from the conductive subsurface is prevented when the transponder label has been adhesively attached to the conductive subsurface and the transponder label, after having been adhesively attached to the conductive subsurface, is heated from the starting temperature to the higher temperature, and, after heating, is cooled down to the starting temperature.

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