LOW TEMPERATURE POLY-SILICON THIN FILM TRANSISTOR AND MANUFACTURING METHOD THEREOF
First Claim
1. A method for manufacturing a low temperature poly-silicon thin film transistor, including the following steps:
- providing an insulating substrate,forming, on a buffer layer of the insulating substrate, at least one poly-silicon layer, on the surface of which a source region, a drain region, and a channel region of the low temperature poly-silicon thin film transistor are arranged,conducting a plasma enhanced chemical vapor deposition (PECVD) procedure for at least three times to form at least three dielectric layers on the channel region successively, such that a composite gate insulating layer is formed, wherein the compactness of each dielectric layer increases in order of the formation sequence thereof in the manufacturing method, andforming a gate electrode on the composite gate insulating layer.
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Abstract
The present disclosure relates to a low temperature poly-silicon thin film transistor which possesses electrical characteristics and reliability, and a method of manufacturing the thin film transistor. The low temperature poly-silicon thin film transistor at least includes a gate insulating layer which is a composite insulating layer comprising at least three dielectric layers, wherein the compactness of each dielectric layer successively increases in order of the formation sequence thereof in the manufacturing process. Because the relation between the compactness of each layer of the composite insulating layer and that of the others thereof is taken into account according to the present disclosure, each layer in the composite insulating layer of the low temperature poly-silicon thin film transistor manufactured by the method according to the present disclosure can have enhanced surface contact characteristic and thin film continuity. The thickness of each layer in the composite insulating layer is further considered, so that the parasitic capacitance can be effectively reduced, and thus the response rate of the transistor can be improved. Namely, by improving the GI film forming quality, the electrical characteristic and reliability of the low temperature poly-silicon thin film transistor can be improved
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Citations
10 Claims
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1. A method for manufacturing a low temperature poly-silicon thin film transistor, including the following steps:
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providing an insulating substrate, forming, on a buffer layer of the insulating substrate, at least one poly-silicon layer, on the surface of which a source region, a drain region, and a channel region of the low temperature poly-silicon thin film transistor are arranged, conducting a plasma enhanced chemical vapor deposition (PECVD) procedure for at least three times to form at least three dielectric layers on the channel region successively, such that a composite gate insulating layer is formed, wherein the compactness of each dielectric layer increases in order of the formation sequence thereof in the manufacturing method, and forming a gate electrode on the composite gate insulating layer. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A low temperature poly-silicon thin film transistor, at least including a gate insulating layer which is a composite insulating layer comprising at least three dielectric layers,
wherein the compactness of each dielectric layer successively increases in order of the formation sequence thereof in the manufacturing process.
Specification