EMBEDDED HEAT SPREADER WITH ELECTRICAL PROPERTIES

• US 20150179542A1
• Filed: 12/20/2013
• Published: 06/25/2015
• Est. Priority Date: 12/20/2013
• Status: Active Grant

• Current Assignee: Globalfoundries US Incorporated (GlobalFoundries, Inc.)
• Original Assignee: International Business Machines Corporation
• Inventors: Graf, Richard S., West, David J., Wilson, Charles H., Leonard, Jay F.
• Granted Patent: US 9,368,425 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48235 connecting the wire to a via metallisation of the item
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73215 Layer and wire connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19042 being an inductor
• CPC Class Codes: H01L 2924/19104 on the semiconductor or solid-state device, i.e. passive-on-chip

Abstract

Embodiments of the invention relate to incorporating one or more antennas or inductor coils into a semi-conductor package. A heat spreader or metal sheet is embedded in the package and stamped or otherwise patterned into a spiral or serpentine form. The pattern enables the spreader to function as an inductor or antenna when connected to a semiconductor chip in communication with a printed circuit board.

Claims

1. A semiconductor package comprising:

a semiconductor chip, the chip having a first surface and an oppositely disposed second surface, the first surface in communication with a substrate;

a heat spreader disposed to be vertically adjacent to the chip and electrically connected thereto, the spreader having a first surface and an oppositely disposed second surface, the first surface of the spreader in electrical communication with the second surface of the chip; and

a non-conductive compound sealing the chip within an enclosure and in communication with the spreader.

2. The package of claim 1, further comprising the spreader in direct communication with the chip.

3. The package of claim 1, further comprising the spreader in indirect communication with the chip, including a non-conductive material mounted adjacent to the second surface of the chip, and the first surface of the spreader in communication with the material.

4. The package of claim 1, further comprising the spreader providing an electrical function.

5. The package of claim 4, wherein the spreader has a spiral pattern forming an inductor coil, the spiral including a continuous winding around an origin.

6. The package of claim 5, further comprising direct communication between the chip and the spreader, the direct communication consisting of the origin.

7. The package of claim 5, further comprising the winding having body having a first thickness and the origin having a second thickness, the first thickness being greater than the second thickness, and the second thickness having a wirebond connection with the chip.

8. The package of claim 1, further comprising the spreader having a surface area greater than the chip.

9. The package of claim 1, further comprising the spreader providing a function of an antenna.

10. The package of claim 9, wherein the spreader has a serpentine pattern.

11. The package of claim 1, wherein the spreader is exposed on a top side of the enclosure.

12. The package of claim 1, wherein the spreader is sealed within the enclosure.

19. The package of claim 1, wherein the spreader is sealed within the enclosure.

13. A method for fabricating a semiconductor package comprising:

providing a semi-conductor chip having a first surface and an oppositely disposed second surface, the first surface communication with a substrate;

forming at least one integrated antenna structure coupled to the chip, including vertically disposing a heat spreader adjacent to the chip and electrically interfacing the spreader to the chip, the spreader having a first surface and an oppositely disposed second surface, the first surface of the spreader electrically communicating with the second surface of the chip; and

forming the package, including sealing the chip within an enclosure with a non-conductive sealing compound, and the spreader in communication with the enclosure.

14. The method of claim 13, further comprising patterning the spreader in a spiral form.

15. The method of claim 14, wherein the spiral pattern forms an inductor coil, and the spiral pattern including a continuous winding around an origin.

16. The method of claim 13, further comprising patterning the spreader in a serpentine pattern.

17. The method of claim 16, wherein the serpentine pattern functions forms an antenna.

18. The method of claim 13, wherein the spreader is exposed on a top side of the enclosure.