Method for Aligning Micro-Electronic Components

• US 20150179605A1
• Filed: 12/19/2014
• Published: 06/25/2015
• Est. Priority Date: 12/19/2013
• Status: Active Grant

• Current Assignee: IMEC International, Katholieke Universiteit Leuven
• Original Assignee: IMEC International, Katholieke Universiteit Leuven KU Leuven R&D
• Inventors: De Wolf, Ingrid, Beyne, Eric, Dubey, Vikas
• Granted Patent: US 9,601,459 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2223/54426 for alignment
• CPC Class Codes: H01L 2224/0213 Alignment aids
• CPC Class Codes: H01L 2224/0214 Structure of the auxiliary member
• CPC Class Codes: H01L 2224/02145 Shape of the auxiliary member
• CPC Class Codes: H01L 2224/0217 Alignment aids
• CPC Class Codes: H01L 2224/02175 Flow barrier
• CPC Class Codes: H01L 2224/0218 Structure of the auxiliary member
• CPC Class Codes: H01L 2224/02185 Shape of the auxiliary member
• CPC Class Codes: H01L 2224/0224 Alignment aids
• CPC Class Codes: H01L 2224/0225 Structure of the auxiliary member
• CPC Class Codes: H01L 2224/02255 Shape of the auxiliary member
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/08145 the bodies being stacked
• CPC Class Codes: H01L 2224/08225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/0903 Bonding areas having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/10135 Alignment aids
• CPC Class Codes: H01L 2224/10145 Flow barriers
• CPC Class Codes: H01L 2224/10165 Alignment aids
• CPC Class Codes: H01L 2224/10175 Flow barriers
• CPC Class Codes: H01L 2224/13147 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/16145 : the bodies being stacked
• CPC Class Codes: H01L 2224/16147 : the bump connector connecting to a bonding area disposed in a recess of the surface
• CPC Class Codes: H01L 2224/16148 : the bump connector connecting to a bonding area protruding from the surface
• CPC Class Codes: H01L 2224/16225 : the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 : the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/16237 : the bump connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/1703 : Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/80004 : being a removable or sacrificial coating
• CPC Class Codes: H01L 2224/80007 : involving a permanent auxiliary member being left in the finished device, e.g. aids for protecting the bonding area during or after the bonding process
• CPC Class Codes: H01L 2224/80121 : Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
• CPC Class Codes: H01L 2224/8013 : using marks formed on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/80132 : using marks formed outside the semiconductor or solid-state body, i.e. "off-chip"
• CPC Class Codes: H01L 2224/80143 : Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
• CPC Class Codes: H01L 2224/80203 : Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
• CPC Class Codes: H01L 2224/80894 : Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces
• CPC Class Codes: H01L 2224/80895 : between electrically conductive surfaces, e.g. copper-copper direct bonding, surface activated bonding
• CPC Class Codes: H01L 2224/80896 : between electrically insulating surfaces, e.g. oxide or nitride layers
• CPC Class Codes: H01L 2224/80907 : Intermediate bonding, i.e. intermediate bonding step for temporarily bonding the semiconductor or solid-state body, followed by at least a further bonding step
• CPC Class Codes: H01L 2224/81002 : being a removable or sacrificial coating
• CPC Class Codes: H01L 2224/81007 : involving a permanent auxiliary member being left in the finished device, e.g. aids for holding or protecting the bump connector during or after the bonding process
• CPC Class Codes: H01L 2224/81121 : Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
• CPC Class Codes: H01L 2224/8113 : using marks formed on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81132 : using marks formed outside the semiconductor or solid-state body, i.e. "off-chip"
• CPC Class Codes: H01L 2224/81141 : Guiding structures both on and outside the body
• CPC Class Codes: H01L 2224/81143 : Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
• CPC Class Codes: H01L 2224/81191 : wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81193 : wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81815 : Reflow soldering
• CPC Class Codes: H01L 2224/81894 : Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces
• CPC Class Codes: H01L 2224/81907 : Intermediate bonding, i.e. intermediate bonding step for temporarily bonding the semiconductor or solid-state body, followed by at least a further bonding step
• CPC Class Codes: H01L 2224/83143 : Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
• CPC Class Codes: H01L 2225/06513 : Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 2225/06517 : Bump or bump-like direct electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06541 : Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
• CPC Class Codes: H01L 2225/06593 : Mounting aids permanently on device; arrangements for alignment
• CPC Class Codes: H01L 23/3157 : Partial encapsulation or coating mask layer used as insulation layer H01L21/31
• CPC Class Codes: H01L 23/3192 : Multilayer coating
• CPC Class Codes: H01L 23/528 : Geometry or layout of the interconnection structure H01L27/0207 takes precedence; algorithms G06F30/00
• CPC Class Codes: H01L 23/544 : Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 24/02 : Bonding areas on insulating substrates, e.g. chip carriers, H01L23/49816, H01L23/49838, H01L23/5389; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/08 : of an individual bonding area
• CPC Class Codes: H01L 24/09 : of a plurality of bonding areas
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/17 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/33 : of a plurality of layer connectors
• CPC Class Codes: H01L 24/80 : Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/3511 : Warping

Abstract

Alignment of a first micro-electronic component to a receiving surface of a second micro-electronic component is realized by a capillary force-induced self-alignment, combined with an electrostatic alignment. The latter is accomplished by providing at least one first electrical conductor line along the periphery of the first component, and at least one second electrical conductor along the periphery of the location on the receiving surface of the second component onto which the component is to be placed. The contact areas surrounded by the conductor lines are covered with a wetting layer. The electrical conductor lines may be embedded in a strip of anti-wetting material that runs along the peripheries to create a wettability contrast. The wettability contrast helps to maintain a drop of alignment liquid between the contact areas so as to obtain self-alignment by capillary force. By applying appropriate charges on the conductor lines, electrostatic self-alignment is realized, which improves the alignment obtained through capillary force and maintains the alignment during evaporation of the liquid.

Claims

1. A method for aligning a first micro-electronic component to a second micro-electronic component, wherein each component includes a contact area covered by a wetting layer, wherein each component includes a means for containing an alignment liquid on the respective wetting layer, and wherein each component is further provided with one or more conductor lines running along a circumference of the respective contact area, the method comprising:

applying an amount of the alignment liquid to the contact area of the second component;

placing the first component with its contact area facing the contact area of the second component so that the alignment liquid contacts both wetting layers, thereby establishing self-alignment of the contact areas through capillary force;

applying an electric potential such as to charge the conductor lines of at least one of the components in a manner to realize an electrostatic alignment of the contact areas; and

maintaining the electrostatic alignment while the alignment liquid evaporates.

2. The method according to claim 1, wherein on at least one of the components, the means for containing a liquid on the wetting layers comprise at least one strip of anti-wetting material running along the circumference of the contact area.

3. The method according to claim 2, wherein the conductor lines are embedded in or located on top of the strip of anti-wetting material.

4. The method according to claim 1, wherein on at least one of the components, the means for maintaining a liquid on the wetting layers comprise a vertical sidewall surrounding the contact areas.

5. The method according to claim 1, wherein on at least one of the components, the means for maintaining a liquid on the wetting layers comprises the conductor lines themselves, and wherein the conductor lines have been provided with anti-wetting properties.

6. The method according to claim 1, wherein one of the components comprises a pair of conductor lines while the other component comprises a single conductor line, and wherein opposite electric potentials are applied to charge the pair of conductor lines, while no potential is applied to the single conductor line.

7. The method according to claim 6, wherein the pair of conductor lines comprises interdigitated lateral extensions.

8. The method according to claim 1, wherein each of the first and second components comprises at least one conductor line, and wherein first and second potentials are applied to charge the conductor line(s) of the first and second components, the first and second potentials being mutually opposite.

9. The method according to claim 1, wherein the conductor lines on at least one of the components are present on top of the component.

10. The method according to claim 1, wherein the conductor lines on at least one of the components are incorporated in a passivation layer that is a part of the component.

11. The method according to claim 1, wherein the conductor lines of one of the components are located in a recess running around the circumference of the contact area of the component, and wherein the conductor lines of the other component are extending outwardly from the surface of the component, so that the alignment is further enhanced through a conformal lock and key mechanism.

12. The method for bonding a first micro-electronic component to a second micro-electronic component, wherein the first and second components are aligned according to the method of claim 1, followed by the step of establishing a permanent bond between the components.

13. An assembly of two or more micro-electronic components, comprising:

at least one first micro-electronic component aligned to a second micro-electronic component, wherein both the first and second components comprises a contact area, the contact areas being covered by a wetting layer, each of the components being provided with means for containing an alignment liquid on the wetting layers, wherein each of the components is further provided with one or more conductor lines running along a circumference of the respective contact areas, wherein the conductor lines of the first and second components face each other, and wherein at least one of the components is provided with means for applying an electrical charge to its conductor line(s).

14. The assembly according to claim 13, wherein on at least one of the components, the means for containing a liquid on the wetting layers includes at least one strip of anti-wetting material running along the circumference of the contact area.

15. The assembly according to claim 14, wherein on at least one of the components, the means for maintaining a liquid on the wetting layers includes consist of a vertical sidewall surrounding the contact areas.