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MAGNET PLACEMENT FOR INTEGRATED SENSOR PACKAGES

  • US 20150185247A1
  • Filed: 12/27/2013
  • Published: 07/02/2015
  • Est. Priority Date: 12/27/2013
  • Status: Active Grant
First Claim
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1. A method comprising:

  • applying a terminal to a magnet;

    placing the magnet on a top layer of a substrate with solder between the terminal and the top layer; and

    reflowing the solder to attach the magnet to the substrate.

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