Backlight Module And Heat-Dissipating Device

• US 20150185407A1
• Filed: 01/07/2014
• Published: 07/02/2015
• Est. Priority Date: 12/20/2013
• Status: Active Grant

• Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Original Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Inventors: Lv, Chengling, Zhang, Pangling, Tang, Guofu
• Granted Patent: US 9,377,577 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G02B 6/0085 Means for removing heat created by the light source from the package heat extraction or cooling elements for semiconductor light sources in general H01L33/64
• CPC Class Codes: G02B 6/0088 of the light guide or other optical sheets in the package

Abstract

The present invention relates to a technology of displaying device, and more particularly to a heat-dissipating device of a backlight module, and which is arranged between a backframe and a waveguide of the backlight module for dissipating heat generated from a light source disposed adjacent to the waveguide, wherein the heat dissipating device includes a master heatsink, and an auxiliary heatsink; and wherein the master heatsink has a sidewall extending from an end thereof to in connection to the waveguide, and the auxiliary heatsink is arranged between the master heatsink and the waveguide. The present invention further provides a backlight module incorporated with such a heat-dissipating device. With the combination of the master heatsink and the auxiliary heatsink, a novel heat-dissipating device is created and which effectively upgrades the heat-dissipating performance under the high power density, prolonging the service life of the light source, and the increases the optical characteristic of the displaying device.

Claims

1. A heat dissipating device for backlight module and which is arranged between a backframe and a waveguide of the backlight module for dissipating heat generated from a light source disposed adjacent to the waveguide, wherein the heat dissipating device includes a master heatsink, and an auxiliary heatsink;

and

wherein the master heatsink has a sidewall extending from an end thereof to in connection to the waveguide, and the auxiliary heatsink is arranged between the master heatsink and the waveguide.

2. The heat dissipating device as recited in claim 1, wherein a distance between the auxiliary heatsink and the sidewall of the master heatsink is about 10˜

15 mm

3. The heat dissipating device as recited in claim 2, wherein the interconnection between the auxiliary heatsink and the master heatsink is by way of adhesive, welding or blot.

4. The heat dissipating device as recited in claim 1, wherein a heat conductive layer is arranged between the auxiliary heatsink and the master heatsink

5. The heat dissipating device as recited in claim 4, wherein the auxiliary heatsink is covered with a heat insulative layer so as to block a heat transfer to the waveguide.

6. The heat dissipating device as recited in claim 5, wherein the heat conductive layer is made from grapheme, and the heat insulative layer is made from plastic or rubber.

7. The heat-dissipating device as recited in claim 1, wherein there is a gap created between the auxiliary heatsink and the waveguide.

8. The heat dissipating device as recited in claim 7, wherein a non-heat-conductive support is arranged between the sidewall and a middle of the master heatsink so as to securely support the waveguide so as to keep the gap in uniform.

9. The heat-dissipating device as recited in claim 1, characterized in that the auxiliary heatsink is provided with a vent duct.

10. The heat-dissipating device as recited in claim 9, wherein the vent has a rectangular shape or polygonal shapes with closed contour, the vent has openings at ends for communication with atmosphere.

11. The heat dissipating device as recited in claim 1, wherein the master heatsink and/or auxiliary heatsink is made from aluminum sheet or aluminum extrusion.

12. A heat dissipating device for backlight module and which is arranged between a backframe and a waveguide of the backlight module for dissipating heat generated from a light source disposed adjacent to the waveguide, wherein the heat dissipating device includes a master heatsink, and an auxiliary heatsink;

wherein the master heatsink has a sidewall extending from an end thereof to in connection to the waveguide, and the auxiliary heatsink is arranged between the master heatsink and the waveguide; and

wherein a distance between the auxiliary heatsink and the sidewall of the master heatsink is about 10˜

15 mm

13. A backlight module including a backframe, and a light source, a heat dissipating device and a waveguide mounted on an internal side of the backframe, wherein the light source is arranged opposite to a side of the waveguide;

wherein the heat-dissipating device is arranged between the backframe and the waveguide for dissipating heat generated from a light source disposed adjacent to the waveguide, wherein the heat dissipating device includes a master heatsink, and an auxiliary heatsink; and

wherein the master heatsink has a sidewall extending from an end thereof to in connection to the waveguide, and the auxiliary heatsink is arranged between the master heatsink and the waveguide.