Biometric Image Sensor Packaging and Mounting

• US 20150187707A1
• Filed: 03/16/2015
• Published: 07/02/2015
• Est. Priority Date: 10/14/2012
• Status: Abandoned Application

• Current Assignee: Synaptics Incorporated
• Original Assignee: Synaptics Incorporated
• Inventors: LEE, Young Seen, DUNLAP, Brett, WICKBOLDT, Paul
• Application Number:
  US14/659,026
• Publication Number:
  US 20150187707A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G01N 27/22 by investigating capacitance
• CPC Class Codes: G06V 20/66 Trinkets, e.g. shirt buttons or jewellery items recognising microscopic objects G06V20/69
• CPC Class Codes: G06V 40/1306 non-optical, e.g. ultrasonic or capacitive sensing
• CPC Class Codes: G06V 40/1329 Protecting the fingerprint sensor against damage caused by the finger
• CPC Class Codes: H01L 21/02112 characterised by the material of the layer
• CPC Class Codes: H01L 21/02118 carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC polymers per se C08G, photoresist per se G03F
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/562 Protection against mechanical damage H01L23/02, H01L23/28 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A method for providing a biometric sensor arrangement includes: forming the biometric sensor comprising sensor elements and a controller IC disposed on a substrate; at least partially enclosing the biometric sensor within a molded body; depositing capping material on the biometric sensor to form a capping layer on the biometric sensor; embossing the capping material of the capping layer; and curing the capping layer.

Claims

1. A method for providing a biometric sensor arrangement, the method comprising:

forming the biometric sensor comprising sensor elements and a controller integrated circuit (IC) disposed on a substrate;

at least partially enclosing the biometric sensor within a molded body;

depositing capping material on the biometric sensor to form a capping layer on the biometric sensor;

embossing the capping material of the capping layer; and

curing the capping layer.

2. The method of claim 1, wherein the biometric sensor comprises at least one of a ball grid array (“

BGA”

) type package and a chip on flex (“

COF”

) type IC mounting.

3. The method of claim 1, wherein the substrate is a flexible substrate comprising a polyimide film and/or a flexible printed circuit board.

4. The method of claim 1, wherein mold material of the molded body comprises a molding compound, polycarbonate, Nylon, and/or glass-fiber enforced Nylon.

5. The method of claim 1, wherein at least partially enclosing the biometric sensor within the molded body comprises:

forming sidewalls of the biometric sensor arrangement.

6. The method of claim 1, wherein the capping layer comprises poly(methyl methacrylate), urethane acrylate/acrylate blend, and/or an epoxy-based resin.

7. The method of claim 1, wherein a thickness of the capping layer is less than 200 microns.

8. The method of claim 1, wherein a thickness of the capping layer is based on mold structure, mold pressure and/or mold temperature.

9. The method of claim 1, wherein a thickness of the capping layer is based on viscosity of the capping material and/or curing properties of the capping material.

10. The method of claim 1, wherein the molded body comprises a soft mold and/or a hard mold, and wherein the molded body comprises a smooth surface and/or a textured pattern.

11. The method of claim 1, wherein the capping layer comprises a high dielectric material configured to increase permittivity between the biometric sensor and an object being sensed.

12. A biometric sensor arrangement, comprising:

a biometric sensor, the biometric sensor comprising;

a substrate,

sensor elements disposed on the substrate, and

a controller integrated circuit (IC) disposed on the substrate;

a molded body at least partially enclosing the biometric sensor; and

a capping material disposed on the biometric sensor forming a capping layer on the biometric sensor, wherein the capping material is embossed in the capping layer, and wherein the capping layer is cured.

13. A biometric sensor arrangement, comprising:

a biometric sensor, the biometric sensor comprising;

sensor elements in communication with a controller integrated circuit (IC);

a molded body at least partially enclosing the biometric sensor, the molded body having an opening corresponding to the sensor elements of the biometric sensor; and

a capping layer disposed on the biometric sensor at the opening, the capping layer comprising a capping material imprinted over the sensor elements.

14. The biometric sensor arrangement of claim 13, further comprising:

a decorative layer disposed over the sensor elements.

15. The biometric sensor arrangement of claim 14, further comprising:

a hard coat disposed over the sensor elements,

wherein the decorative layer is disposed over the capping layer and the hard coat is disposed over the decorative layer.

16. The biometric sensor arrangement of claim 14, wherein the capping layer is disposed over the decorative layer.

17. The biometric sensor arrangement of claim 13, wherein the capping layer has a smooth upper surface.

18. The biometric sensor arrangement of claim 13, wherein the capping layer has a textured upper surface.

19. The biometric sensor arrangement of claim 13, wherein the capping layer comprises:

a lower surface facing towards the sensor elements, the lower surface having a pattern conforming to a pattern formed by the sensor elements, and

an upper surface facing away from the sensor elements, the upper surface having a pattern different from the pattern formed by the sensor elements.

20. The biometric sensor arrangement of claim 13, wherein the capping layer comprises a cured resin.

21. The biometric sensor arrangement of claim 13, wherein the capping layer comprises poly(methyl methacrylate), urethane acrylate/acrylate blend, and/or an epoxy-based resin.

22. The biometric sensor arrangement of claim 13, wherein the sensor elements and the controller IC are disposed within the molded body.

23. The biometric sensor arrangement of claim 13, wherein the sensor elements are disposed within the molded body and the controller IC is disposed outside of the molded body.

24. The biometric sensor arrangement of claim 13,

wherein the biometric sensor further comprises a substrate, and

wherein the sensor elements and the controller IC are disposed on the substrate.

25. The biometric sensor arrangement of claim 24,

wherein the sensor elements include conductive traces formed on the substrate,

wherein the conductive traces include capacitive drive and pickup plates configured to capture an image of a fingerprint, and

wherein the controller IC is mounted to the substrate and connected to the conductive traces.