Biometric Image Sensor Packaging and Mounting
First Claim
Patent Images
1. A method for providing a biometric sensor arrangement, the method comprising:
- forming the biometric sensor comprising sensor elements and a controller integrated circuit (IC) disposed on a substrate;
at least partially enclosing the biometric sensor within a molded body;
depositing capping material on the biometric sensor to form a capping layer on the biometric sensor;
embossing the capping material of the capping layer; and
curing the capping layer.
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Abstract
A method for providing a biometric sensor arrangement includes: forming the biometric sensor comprising sensor elements and a controller IC disposed on a substrate; at least partially enclosing the biometric sensor within a molded body; depositing capping material on the biometric sensor to form a capping layer on the biometric sensor; embossing the capping material of the capping layer; and curing the capping layer.
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Citations
25 Claims
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1. A method for providing a biometric sensor arrangement, the method comprising:
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forming the biometric sensor comprising sensor elements and a controller integrated circuit (IC) disposed on a substrate; at least partially enclosing the biometric sensor within a molded body; depositing capping material on the biometric sensor to form a capping layer on the biometric sensor; embossing the capping material of the capping layer; and curing the capping layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A biometric sensor arrangement, comprising:
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a biometric sensor, the biometric sensor comprising; a substrate, sensor elements disposed on the substrate, and a controller integrated circuit (IC) disposed on the substrate; a molded body at least partially enclosing the biometric sensor; and a capping material disposed on the biometric sensor forming a capping layer on the biometric sensor, wherein the capping material is embossed in the capping layer, and wherein the capping layer is cured.
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13. A biometric sensor arrangement, comprising:
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a biometric sensor, the biometric sensor comprising; sensor elements in communication with a controller integrated circuit (IC); a molded body at least partially enclosing the biometric sensor, the molded body having an opening corresponding to the sensor elements of the biometric sensor; and a capping layer disposed on the biometric sensor at the opening, the capping layer comprising a capping material imprinted over the sensor elements. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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Specification