MMWAVE ANTENNAS AND TRANSMISSION LINES ON STANDARD SUBSTRATE MATERIALS

• US 20150188218A1
• Filed: 12/27/2013
• Published: 07/02/2015
• Est. Priority Date: 12/27/2013
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Adel A. Elsherbini
• Inventors: Kamgaing, Telesphor, Haney, Sarah K., ELSHERBINI, Adel A.
• Granted Patent: US 10,033,093 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142

Abstract

A method including disposing a transmission line or an antenna on dielectric material; and removing a portion of the dielectric material from a region adjoining the transmission line or the antenna where the electromagnetic radiation from the transmission line or the antenna is predetermined to be greater than another portion of the dielectric material. An apparatus including a package substrate including a transmission line coupled to an antenna, the transmission line and the antenna disposed on a dielectric layer including an organic dielectric material having a first dielectric constant and a second material having a dielectric constant less than the first dielectric constant, wherein the second dielectric material adjoins a portion of the transmission line or the antenna.

Claims

1. A method comprising:

disposing at least one of a transmission line or an antenna on an organic dielectric material on a microelectronic substrate; and

removing a portion of the dielectric material from a region adjoining the transmission line or the antenna where the electromagnetic radiation from the transmission line or the antenna is predetermined to be greater than another portion of the dielectric material.

2. The method of claim 1, wherein the transmission line or the antenna are disposed in a package substrate.

3. The method of claim 1, wherein removing a portion of the dielectric material from a region adjoining a transmission line comprises removing a portion of the dielectric material adjoining a length of the transmission line with the transmission line serving as a mask.

4. The method of claim 3, wherein etching comprises etching the dielectric material adjoining opposing sides of the transmission line.

5. The method of claim 4, wherein the transmission line is disposed between two coplanar ground planes.

6. The method of claim 3, wherein etching comprises isotropic etching.

7. The method of claim 3, wherein removing a portion of the dielectric material adjoining the length of the transmission line comprises removing less than the entire portion adjoining the length.

8. The method of claim 7, wherein removing comprises periodically removing dielectric material along the length.

9. The method of claim 1, wherein the antenna comprises a first side on the dielectric material and a second side opposite the first side and removing a portion of the dielectric material from a region adjoining the antenna comprises removing a portion of dielectric material adjoining the second side of the antenna.

10. The method of claim 9, wherein removing a portion of the dielectric material adjoining the second side of the antenna comprises removing less than the entire portion of dielectric material adjoining the second side of the antenna.

11. The method of claim 9, wherein disposing an antenna comprises forming an antenna comprising a planar body defined by the first side and the second side and at least one opening disposed through the planar body and removing a portion of the dielectric material comprises etching the dielectric material through the at least one opening.

12. The method of claim 11, wherein forming an antenna comprises forming a plurality of openings disposed through the planar body of the antenna.

13. The method of claim 1, wherein after removing a portion of the dielectric material from a region adjoining the transmission line or the antenna, the method comprises passivating the substrate with a dielectric material.

14. A method comprising:

forming a dielectric layer on a package substrate; and

disposing at least one of a transmission line or an antenna on the dielectric layer,

wherein the dielectric layer comprises an organic dielectric material having a first dielectric constant and a second material comprising a second dielectric constant that is less than the first dielectric constant and the second material adjoins at least one of the transmission line or the antenna.

15. The method of claim 14, wherein the second material comprises air and forming a dielectric layer comprises etching a portion of the organic dielectric material from a region adjoining the transmission line or the antenna.

16. The method of claim 15, etching comprises isotropic etching.

17. The method of claim 15, wherein etching comprises etching the organic dielectric material adjoining opposing sides of the transmission line.

18. The method of claim 15, wherein etching a portion of the dielectric material adjoining the transmission line comprises removing less than the entire portion adjoining a length of the transmission line.

19. The method of claim 18, wherein etching comprises periodically etching dielectric material from along the length of the transmission line.

20. The method of claim 15, wherein the antenna comprises a first side on the dielectric layer and a second side opposite the first side and etching a portion of the organic dielectric material from a region adjoining the antenna comprises removing a portion of dielectric material adjoining the second side of the antenna.

21. The method of claim 20, wherein etching a portion of the organic dielectric material adjoining the second side of the antenna comprises removing less than the entire portion of dielectric material adjoining the second side of the antenna.

22. The method of claim 20, wherein disposing an antenna comprises forming an antenna comprising a planar body defined by the first side and the second side and at least one opening disposed through the planar body and etching a portion of the organic dielectric material comprises etching the dielectric material through the at least one opening.

23. The method of claim 14, wherein the second material comprises a lower dissipation factor than a dissipation factor of the organic dielectric material.

24. An apparatus comprising:

a package substrate comprising a transmission line coupled to an antenna and a transmitter or transceiver, the transmission line and the antenna disposed on a dielectric layer comprising an organic dielectric material having a first dielectric constant and a second material having a dielectric constant less than the first dielectric constant, wherein the second dielectric material adjoins a portion of the transmission line or the antenna.

25. The apparatus of claim 24, wherein the second dielectric material comprises air.

26. The apparatus of claim 24, wherein the second dielectric materials adjoins less than an entire length of the transmission line.

27. The apparatus of claim 24, wherein the second dielectric material periodically adjoins the entire length of the transmission line.

28. The apparatus of claim 24, wherein the antenna comprises a first side on the dielectric layer and a second side opposite the first side and the second dielectric material adjoins a portion of the second side of the antenna.

29. The apparatus of claim 28, wherein the antenna comprises a plurality of openings between the first side and the second side.