Method and System for Improved Crosstalk Attenuation Within a Plug/Jack Connection and Between Nearby Plug/Jack Combinations
First Claim
Patent Images
1. A jack for improving crosstalk attenuation, comprising:
- a housing;
a metalized surface at least partially covering the housing;
a printed circuit board contained within the housing;
first and second insulation displacement contacts, the first insulation displacement contact being located closer to the metalized surface than the second insulation displacement contact, the first and second insulation displacement contacts being associated with a first differential signal; and
a first conductive trace stub electrically connected to the second insulation displacement contact routed proximate to an edge of the printed circuit board and proximate to the metalized surface, the first conductive trace stub configured to at least partially balance coupling from the first insulation displacement contact to the metalized surface with coupling from the second insulation displacement contact to the metalized surface for the first differential signal.
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Abstract
An RJ45 Communication jack has a housing with a top, bottom, front, and back. A foil is immediately adhered to and partially covers the housing. A top or bottom of the housing is covered by a first portion and a second portion of the foil wherein the first portion and the second portion are separated by a nonconductive gap. The gap extends from the front of the housing to the rear of the housing.
3 Citations
14 Claims
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1. A jack for improving crosstalk attenuation, comprising:
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a housing; a metalized surface at least partially covering the housing; a printed circuit board contained within the housing; first and second insulation displacement contacts, the first insulation displacement contact being located closer to the metalized surface than the second insulation displacement contact, the first and second insulation displacement contacts being associated with a first differential signal; and a first conductive trace stub electrically connected to the second insulation displacement contact routed proximate to an edge of the printed circuit board and proximate to the metalized surface, the first conductive trace stub configured to at least partially balance coupling from the first insulation displacement contact to the metalized surface with coupling from the second insulation displacement contact to the metalized surface for the first differential signal. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification