LIGHT EMISSION DEVICE, AND ILLUMINATION DEVICE

• US 20150192281A1
• Filed: 06/10/2013
• Published: 07/09/2015
• Est. Priority Date: 07/09/2012
• Status: Abandoned Application

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Agatani, Makoto, Hata, Toshio, Nada, Tomokazu, Homma, Yuta
• Application Number:
  US14/413,083
• Publication Number:
  US 20150192281A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: F21V 19/002 the fastening means engaging the encapsulation or the packaging of the semiconductor device
• CPC Class Codes: F21V 21/00 Supporting, suspending, or attaching arrangements for lighting devices F21V17/00, F21V19/00 take precedence; arrangement of signalling or lighting devices, the mounting or supporting thereof or circuits therefor, for vehicles in general B60Q, stands for supporting apparatus or articles in general F16M11/00; Hand grips
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01L 33/0095 Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination

Abstract

The light emission device (1a) includes an insulating substrate (2) and a light-emitting section (5) which is provided on a main surface of the insulating substrate (2) and has an LED chip (3) and a wiring pattern (4). In an edge area of the main surface of the insulating substrate (2), a wall pattern (7a) made of an insulating material is provided so as to surround the light-emitting section (5).

Claims

1. A light emission device comprising:

an insulating substrate;

a light-emitting section provided on a main surface of the insulating substrate, the light-emitting section having a light-emitting element and a wiring pattern;

which are surrounded by a damming member; and

a wall section made of an insulating material, the wall section being provided in an edge area of the main surface of the insulating substrate so as to surround the light-emitting section,

the wall section being provided directly on the main surface of the insulating substrate.

2. The light emission device as set forth in claim 1, wherein:

the wall section is provided at a location at which a predetermined creepage distance is secured between the wall section and a part of the wiring pattern which part is nearest to a periphery of the main surface.

3. The light emission device as set forth in claim 1, wherein:

the wall section is not provided around a land electrode that is connected with the wiring pattern.

4. The light emission device as set forth in claim 1, wherein:

the wall section is not provided at a location in the edge area which location faces an area in which the wiring pattern of the light-emitting section is not provided.

5. The light emission device as set forth in claim 1, wherein:

the wall section is provided (i) at a location in the edge area which location faces an area in which the wiring pattern of the light-emitting section is provided and (ii) at a corner part of the main surface.

6. The light emission device as set forth in claim 1, wherein:

the wall section is provided in a whole circumference in the edge area of the main surface of the insulating substrate.

7. The light emission device as set forth in claim 1, wherein:

a shortest distance between the wall section and the periphery of the main surface is equal to a thickness of the insulating substrate.

8. The light emission device as set forth in claim 1, wherein:

the light-emitting section further has a sealant that covers the light-emitting element inside the damming member; and

a height of the wall section is equal to a height of the damming member.

9. The light emission device as set forth in claim 1, wherein:

the wall section includes multiple walls that are arranged in a surface direction of the main surface and surround the light-emitting section.

10. The light emission device as set forth in claim 1, wherein:

the wall section is made of a silicone resin or a solder resist.

11. An illumination device comprising:

a light emission device recited in claim 1; and

an illumination apparatus to which the light emission device is attached.

12. An illumination device comprising:

a light emission device recited in claim 3; and

a conductive base on which the light emission device is provided,

a hole being provided in a part of the conductive base which part corresponds to the location in the edge area of the insulating substrate at which location the wall section is not provided.

13. (canceled)