INERTIAL FORCE SENSOR

• US 20150192602A1
• Filed: 03/17/2015
• Published: 07/09/2015
• Est. Priority Date: 09/30/2011
• Status: Abandoned Application

• Current Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Inventors: Yoshiuchi, Shigehiro, Ohuchi, Satoshi, Fujii, Tsuyoshi, Yamamoto, Kensaku, Ohkoshi, Hideo
• Application Number:
  US14/660,353
• Publication Number:
  US 20150192602A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B81B 2201/0242 Gyroscopes
• CPC Class Codes: B81B 2201/025 Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
• CPC Class Codes: B81B 2203/0118 Cantilevers
• CPC Class Codes: B81B 2203/0315 Cavities
• CPC Class Codes: B81B 2207/07 Interconnects
• CPC Class Codes: B81B 7/0048 between the MEMS die and the substrate
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: B81C 1/00238 Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
• CPC Class Codes: G01C 19/5769 Manufacturing; Mounting; Housings
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2225/06506 Wire or wire-like electrical connections between devices
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H10N 30/302 : Sensors

Abstract

An inertial force sensor that can suppress fluctuation of detection sensitivity even if an external stress is applied to the inertial force sensor. Angular velocity sensor (1), that is, an inertial force sensor includes ceramic substrate (6), lower lid (4) adhering to ceramic substrate (6) with adhesives (11a and 11b) (first adhesives), and sensor element (2) adhering to lower lid (4) with adhesives (10a and 10b) (second adhesives). The elastic moduli of adhesives (11a and 11b) are smaller than those of adhesives (10a and 10b).

Claims

1. An angular velocity sensor comprising:

a substrate;

a circuit chip having first chip electrodes at a first side of the circuit chip and second chip electrodes at a second side of the circuit chip, the first side of the circuit chip being opposite to the second side of the circuit chip; and

a sensor element having

first sensor electrodes at a first side of the sensor element, the first sensor electrodes being electrically connected to the first chip electrodes at the first side of the circuit chip, and

second sensor electrodes at a second side of the sensor element, the second sensor electrodes being electrically connected to the second chip electrodes at the second side of the circuit chip,

wherein

the first side of the sensor element being opposite to the second side of the sensor element,

wherein

the sensor element having a center beam part being parallel to the first side of the sensor element and the second side of the sensor element, the sensor element having at least four beam parts connected to the center beam part,

wherein

the circuit chip has third chip electrodes, being electrically connected to first substrate electrodes on the substrate, at a third side of the circuit chip, and

wherein

the third chip electrodes at the third side of the circuit chip are aligned perpendicular to the first side of the circuit chip and the second side of the circuit chip.

2. The angular velocity sensor according to claim 1, wherein

the circuit chip has fourth chip electrodes, being electrically connected to second substrate electrodes on the substrate, at a fourth side of the circuit chip, and

the fourth chip electrodes at the fourth side of the circuit chip are aligned perpendicular to the first side of the circuit chip and the second side of the circuit chip.

3. The angular velocity sensor according to claim 1, wherein

the first sensor electrodes at the first side of the sensor element are electrically connected to the first chip electrodes at the first side of the circuit chip via metal bumps, and

the second sensor electrodes at the second side of the sensor element are electrically connected to the second chip electrodes at the second side of the circuit chip via further metal bumps.

4. The angular velocity sensor according to claim 1, wherein

the circuit chip has a rectangular shape in which a longer side is longer by 10-20% than a shorter side.

5. The angular velocity sensor according to claim 1, wherein

the third chip electrodes at the third side of the circuit chip are disposed outside of a region located between the first chip electrodes at the first side of the circuit chip and the second chip electrodes at the second side of the circuit chip.

6. The angular velocity sensor according to claim 2, wherein

the fourth chip electrodes at the fourth side of the circuit chip are disposed outside of a region located between the first chip electrodes at the first side of the circuit chip and the second chip electrodes at the second side of the circuit chip.