SHIELDED DEVICE PACKAGES HAVING ANTENNAS AND RELATED FABRICATION METHODS

• US 20150194388A1
• Filed: 01/07/2014
• Published: 07/09/2015
• Est. Priority Date: 01/07/2014
• Status: Active Grant

• Current Assignee: NXP USA, Inc. (NXP Semiconductors NV)
• Original Assignee: Sergio P. Pacheco
• Inventors: PABST, EDUARD J., YAP, WENG F., PACHECO, SERGIO P.
• Granted Patent: US 9,362,234 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 21/768 Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/12105 Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms

Abstract

Shielded device packages and related fabrication methods are provided. An exemplary device package includes one or more electrical components, a molding compound overlying the one or more electrical components, a conductive interconnect structure within the molding compound, a conductive frame structure laterally surrounding the one or more electrical components and the interconnect structure, and a shielding structure overlying the one or more electrical components. The shielding structure is electrically connected to the frame structure and at least a portion of the molding compound resides between the shielding structure and the one or more electrical components.

Claims

1. A device package comprising:

one or more electrical components;

a molding compound overlying the one or more electrical components;

a conductive interconnect structure within the molding compound;

a conductive frame structure laterally surrounding the one or more electrical components and the interconnect structure; and

a shielding structure overlying the one or more electrical components, wherein;

the shielding structure is electrically connected to the frame structure; and

at least a portion of the molding compound resides between the shielding structure and the one or more electrical components.

2. The device package of claim 1, wherein:

the shielding structure contacts a first surface of the frame structure; and

the first surface of the frame structure is aligned with a second surface of the portion of the molding compound.

3. The device package of claim 2, wherein a third surface of the interconnect structure is aligned with the first surface and the second surface.

4. The device package of claim 1, wherein the shielding structure comprises a planar structure having an opening aligned with the interconnect structure.

5. The device package of claim 1, wherein an intermediate portion of the frame structure resides between the interconnect structure and the one or more electrical components.

6. The device package of claim 5, the intermediate portion of the frame structure defining a first enclosed region and a second enclosed region, wherein:

the interconnect structure resides within the first enclosed region; and

the one or more electrical components reside within the second enclosed region.

7. The device package of claim 1, wherein the shielding structure contacts the frame structure.

8. The device package of claim 1, wherein the interconnect structure is electrically isolated from the shielding structure.

9. The device package of claim 1, wherein:

the shielding structure includes an opening concentrically aligned with the interconnect structure; and

a circumference of the opening is greater than a circumference of the interconnect structure.

10. The device package of claim 1, further comprising an antenna structure overlying the shielding structure, wherein the antenna structure is electrically connected to the interconnect structure.

11. The device package of claim 10, further comprising a dielectric material overlying the shielding structure, wherein the antenna structure overlies the dielectric material.

12. The device package of claim 11, further comprising a via within the dielectric material, the via overlying the interconnect structure, wherein the antenna structure is electrically coupled to the via.

13. The device package of claim 1, further comprising:

a routing structure, wherein the one or more electrical components, the frame structure, the interconnect structure, and the molding compound overlie the routing structure; and

a connection structure to receive a reference voltage, wherein the routing structure provides a first electrical connection between the connection structure and the frame structure.

14. The device package of claim 13, further comprising an antenna structure overlying the shielding structure, wherein:

the antenna structure is electrically connected to the interconnect structure; and

the interconnect structure provides a second electrical connection between the routing structure and the antenna structure.

15. The device package of claim 1, wherein:

a second portion of the molding compound resides laterally between the frame structure and the one or more electrical components; and

the frame structure resides laterally between the second portion of the molding compound and a third portion of the molding compound.

16. A method of fabricating a device package, the method comprising:

providing a frame structure circumscribing one or more electrical components, the frame structure having a first surface;

forming a molding compound overlying the one or more electrical components, the molding compound having a second surface aligned with the first surface, wherein a first portion of the molding compound resides between the frame structure and the one or more electrical components;

forming an interconnect structure within the molding compound, the frame structure circumscribing the interconnect structure; and

providing a shielding structure overlying the one or more electrical components, wherein the shielding structure is electrically connected to the frame structure and a second portion of the molding compound resides between the one or more electrical components and the shielding structure.

17. The method of claim 16, further comprising forming an antenna structure overlying the shielding structure, wherein the antenna structure is electrically connected to the interconnect structure.

18. The method of claim 17, further comprising:

forming a dielectric layer overlying the shielding structure and the interconnect structure; and

forming a conductive via within the dielectric layer, the conductive via contacting at least a portion of the interconnect structure, wherein forming the antenna structure comprises forming a conductive material on the dielectric layer, the conductive material being patterned to provide an electrical connection to the conductive via.

19. The method of claim 17, further comprising:

forming a routing structure on the frame structure and the one or more electrical components; and

forming a connection interface for receiving a ground reference voltage on the routing structure, wherein the routing structure is configured to provide a first electrical connection between the interconnect structure and an interface of an electrical component of the one or more electrical components and a second electrical connection between the frame structure and the connection interface.

20. A device package comprising:

one or more electrical components;

a molding compound overlying the one or more electrical components, the molding compound having a planar upper surface;

a conductive interconnect structure within the molding compound, the interconnect structure having a first surface aligned with the planar upper surface of the molding compound;

a conductive frame structure circumscribing the one or more electrical components and the interconnect structure, the frame structure having a second surface aligned with the planar upper surface of the molding compound, at least a first portion of the molding compound residing laterally between the frame structure and the one or more electrical components and a second portion of the molding compound circumscribes the frame structure;

a shielding structure overlying the one or more electrical components, the shielding structure contacting the second surface of the frame structure and at least a third portion of the molding compound residing between the shielding structure and the one or more electrical components; and

an antenna structure overlying the shielding structure, wherein the antenna structure is electrically coupled to the interconnect structure.