INTERPOSER FOR INTEGRATED CIRCUIT CHIP PACKAGE
First Claim
1. An interposer for an electronic circuit chip package, the interposer comprising:
- a substrate having a first surface, a second surface substantially parallel to and opposite the first surface, a third surface substantially parallel to the first surface and the second surface, and an orthogonal surface that is substantially orthogonal to and intersects the first surface and the third surface;
a recess formed in the substrate and defined by the third surface and the orthogonal surface;
a first plurality of conductive vias that pass from the second surface to the first surface; and
a second plurality of conductive vias that pass from the second surface to the third surface.
1 Assignment
0 Petitions
Accused Products
Abstract
An interposer for an electronic circuit chip package may include a substrate, a recess, first conductive vias, and second conductive vias. The substrate may have a first surface, a second surface substantially parallel to and opposite the first surface, a third surface substantially parallel to the first surface and the second surface, and an orthogonal surface that is substantially orthogonal to and intersects the first surface and the third surface. The recess may be formed in the substrate and defined by the third surface and the orthogonal surface. The first conductive vias may pass from the second surface to the first surface. The second conductive vias may pass from the second surface to the third surface.
11 Citations
20 Claims
-
1. An interposer for an electronic circuit chip package, the interposer comprising:
-
a substrate having a first surface, a second surface substantially parallel to and opposite the first surface, a third surface substantially parallel to the first surface and the second surface, and an orthogonal surface that is substantially orthogonal to and intersects the first surface and the third surface; a recess formed in the substrate and defined by the third surface and the orthogonal surface; a first plurality of conductive vias that pass from the second surface to the first surface; and a second plurality of conductive vias that pass from the second surface to the third surface. - View Dependent Claims (2, 3, 4, 5, 6)
-
-
7. A method comprising:
forming an interposer of an electronic circuit chip package, wherein forming the interposer includes; forming a substrate having a first surface and a second surface substantially parallel to and opposite the first surface; forming a plurality of conductive vias in the substrate; forming a recess in the substrate, the recess defined by a third surface of the substrate substantially parallel to the first surface and by an orthogonal surface that is substantially orthogonal to and intersects the first surface and the third surface, wherein a first of the plurality of conductive vias passes from the second surface to the third surface; and forming a first bond pad on the third surface that is electrically coupled to the first of the plurality of conductive vias. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14)
-
15. An electronic circuit chip package comprising:
-
a package substrate; an interposer including a substrate having a first surface and a second surface substantially parallel to and opposite the first surface, wherein the first surface is coupled to the package substrate; a first chip mounted to the second surface of the substrate, the substrate including a first plurality of conductive vias that electrically couple the first chip mounted to the second surface to the package substrate coupled to the first surface; and a second chip mounted in a recess to a third surface of the substrate that faces the substrate package, the recess defined by the third surface that is substantially parallel to the first surface and by an orthogonal surface of the substrate that is substantially orthogonal to and intersects the first surface and the third surface, the substrate including a second plurality of conductive vias that electrically couple the first chip mounted to the first surface to the second chip mounted to the third surface. - View Dependent Claims (16, 17, 18, 19, 20)
-
Specification