METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
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Abstract
An object is to provide a semiconductor device including a semiconductor element which has favorable characteristics. A manufacturing method of the present invention includes the steps of: forming a first conductive layer which functions as a gate electrode over a substrate; forming a first insulating layer to cover the first conductive layer; forming a semiconductor layer over the first insulating layer so that part of the semiconductor layer overlaps with the first conductive layer; forming a second conductive layer to be electrically connected to the semiconductor layer; forming a second insulating layer to cover the semiconductor layer and the second conductive layer; forming a third conductive layer to be electrically connected to the second conductive layer; performing first heat treatment after forming the semiconductor layer and before forming the second insulating layer; and performing second heat treatment after forming the second insulating layer.
10 Citations
21 Claims
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1. (canceled)
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2. A manufacturing method of a semiconductor device comprising:
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forming an oxide semiconductor layer over a first insulating layer; forming a first conductive layer electrically connected to the oxide semiconductor layer; forming a second insulating layer over the oxide semiconductor layer and the first conductive layer; performing a first heat treatment before forming the second insulating layer; and performing a second heat treatment after forming the second insulating layer, wherein a hydrogen concentration in the second insulating layer is lower than a hydrogen concentration in the oxide semiconductor layer. - View Dependent Claims (3, 4, 5, 6, 7, 8)
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9. A manufacturing method of a semiconductor device comprising:
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forming an oxide semiconductor layer over a first insulating layer; forming a first conductive layer electrically connected to the oxide semiconductor layer; forming a second insulating layer over the oxide semiconductor layer and the first conductive layer; forming a second conductive layer over the second insulating layer, the second conductive layer being electrically connected to the first conductive layer; performing a first heat treatment before forming the second insulating layer; and performing a second heat treatment after forming the second insulating layer, wherein a hydrogen concentration in the second insulating layer is lower than a hydrogen concentration in the oxide semiconductor layer. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A semiconductor device comprising:
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an oxide semiconductor layer over a first insulating layer; a first conductive layer electrically connected to the oxide semiconductor layer; and a second insulating layer over the oxide semiconductor layer and the first conductive layer, wherein a hydrogen concentration in the second insulating layer is lower than a hydrogen concentration in the oxide semiconductor layer. - View Dependent Claims (17, 18, 19, 20, 21)
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Specification