New-Type Microphone Structure

• US 20150195656A1
• Filed: 06/18/2014
• Published: 07/09/2015
• Est. Priority Date: 01/03/2014
• Status: Abandoned Application

• Current Assignee: ZillTek Technology Corp.
• Original Assignee: ZillTek Technology Corp.
• Inventors: Ye, Jinghua
• Application Number:
  US14/308,522
• Publication Number:
  US 20150195656A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H04R 1/086 Protective screens, e.g. all weather or wind screens
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence

Abstract

The invention relates to the technical field of voice processing equipment, more specifically, to a microphone. A new-type microphone structure comprises a first layer structure, a second layer structure located on the first layer structure, a microphone acoustic cavity formed by the first layer structure and the second layer structure, at least one acoustic hole for acquiring sound signals, which is arranged on the microphone acoustic cavity, and a dustproof component which covers the inside of the acoustic hole. The invention can prevent most of the dust particles and the moisture and the siphoning effect in actual use, which does not need to change the size of the existing microphone. It can be used in thin structures, and can prolong the service life of the microphone.

Claims

1. A new-type microphone structure, comprising:

a first layer structure and a second layer structure located on the first layer structure, a microphone acoustic cavity formed by the first layer structure and the second layer structure, at least one acoustic hole for acquiring sound signals is arranged on the microphone acoustic cavity, and a dustproof component covers the inside of the acoustic hole.

2. A new-type microphone structure as disclosed in claim 1, wherein the dustproof component is located on the inner surface of the microphone acoustic cavity.

3. A new-type microphone structure as disclosed in claim 1, wherein at least one portion of the acoustic hole is covered with the dustproof component.

4. A new-type microphone structure as disclosed in claim 1, wherein the acoustic hole is located on the first layer or the second layer to enable the microphone acoustic cavity to be connected with the outside.

5. A new-type microphone structure as disclosed in claim 1, wherein the dustproof component is a monolayer structure or a multilayer structure.

6. A new-type microphone structure as disclosed in claim 5, wherein the dustproof component is made of silicon based materials.

7. A new-type microphone structure as disclosed in claim 1, wherein the dustproof component is provided with a plurality of filter holes which forms into an array structure after the rearrangement.

8. A new-type microphone structure as disclosed in claim 1, wherein a transducer and a special integrated circuit module are provided in the microphone acoustic cavity, the signal output end of the transducer is connected with the special integrated circuit module;

the transducer and the specific integrated circuit module are arranged on the first layer structure.

9. A new-type microphone structure as disclosed in claim 1, wherein the dustproof component is electrically connected with the first layer structure or the second layer structure.

10. A new-type microphone structure as disclosed in claim 1, wherein it is applied to MEMS microphone.