Interposer For MEMS-On-Lid MIcirophone

• US 20150195659A1
• Filed: 01/06/2015
• Published: 07/09/2015
• Est. Priority Date: 01/09/2014
• Status: Active Grant

• Current Assignee: Knowles Electronics Llc (Knowles Corporation)
• Original Assignee: Knowles Electronics Llc (Knowles Corporation)
• Inventors: Szczech, John, Watson, Joshua, Servis, Gregory B.
• Granted Patent: US 9,307,328 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H04R 1/086 Protective screens, e.g. all weather or wind screens
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 2201/003 Mems transducers or their use
• CPC Class Codes: H04R 23/006 using solid state devices solid state devices per se H01L

Abstract

A microphone includes an interposer, a lid, and a base. The interposer includes at least one wall portion that forms a cavity. The wall portion includes a first side and a second side that are opposite from each other. The lid is coupled to the first side of the interposer and the base is coupled to the second side of the interposer such that the lid and the base enclose the cavity. A microelectromechanical system (MEMS) device is disposed in the cavity. The interposer structurally supports one or both of the lid and the base. The interposer includes a plurality of plated regions that are configured to electrically connect the lid and the base. The plated regions are configured to at least partially be exposed and open to the cavity.

Claims

1. A microphone, the microphone comprising:

an interposer, the interposer including at least one wall portion that forms a cavity, the wall portion including a first side and a second side, the first side and the second side being opposite from the other;

a lid coupled to the first side of the interposer;

a base coupled to the second side of the interposer such that the lid and the base enclose the cavity;

a microelectromechanical system (MEMS) device disposed in the cavity;

such that the interposer structurally supports one or both of the lid and the base, the interposer including a plurality of plated regions that are configured to electrically connect the lid and the base, the plated regions being configured to at least partially be exposed and open to the cavity.

2. The microphone of claim 1, wherein the at least one wall portion comprises a first wall and a second wall, and wherein the plurality of plated regions comprises a first plated region disposed at the first wall and a second plated region disposed at the second wall.

3. The microphone of claim 1, further comprising an application specific integrated circuit (ASIC) disposed in the cavity.

4. The microphone of claim 1, wherein the MEMS device is coupled to the lid.

5. The microphone of claim 1, wherein the lid comprises a multi-layer FR-4 printed circuit board.

6. The microphone of claim 1, wherein the base comprises a printed circuit board at least partially constructed of an insulating material.

7. The microphone of claim 1, wherein the at least one wall includes an RF shield.

8. The microphone of claim 7, wherein the RF shield comprises a Faraday shield or Faraday pads.

9. The microphone of claim 1, wherein the at least one wall portion comprises a first wall and a second wall, and wherein the plurality of plated regions comprises a first plated region disposed at the first wall and wherein an RF shield is disposed at the second wall.

10. The microphone of claim 1, wherein a port is disposed through the lid.