BALL GRID ARRAY SYSTEM
First Claim
1. A ball grid array system, comprising:
- a circuit board having a circuit board surface, the circuit board including;
a plurality of pads that are located on the circuit board surface; and
at least one spacer member extending from the circuit board surface and located adjacent the plurality of pads; and
a ball grid array component including;
a plurality of solder balls;
wherein the at least one spacer member is configured such that, during a solder reflow process, the at least one spacer member provides a mechanical stop to the ball grid array component and a minimum height for a plurality of soldered connections that are each produced by a respective one of the plurality of solder balls and a respective one of the plurality of pads as a result of the solder reflow process.
14 Assignments
0 Petitions
Accused Products
Abstract
Systems and methods for providing a ball grid array connection include providing a circuit board having a circuit board surface including a plurality of pads. A ball grid array component includes a plurality of solder balls. The ball grid array component is coupled to the circuit board to position each of the plurality of solder balls adjacent a respective one of the plurality of pads. A solder reflow process is then performed to produce a plurality of soldered connections from each of the plurality of solder balls and a respective one of the plurality of pads. At least one spacer member is provided between the ball grid array component and the circuit board during the solder reflow process to provide a mechanical stop between the ball grid array component and the circuit board and a minimum height for each of the plurality of soldered connections.
29 Citations
20 Claims
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1. A ball grid array system, comprising:
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a circuit board having a circuit board surface, the circuit board including; a plurality of pads that are located on the circuit board surface; and at least one spacer member extending from the circuit board surface and located adjacent the plurality of pads; and a ball grid array component including; a plurality of solder balls; wherein the at least one spacer member is configured such that, during a solder reflow process, the at least one spacer member provides a mechanical stop to the ball grid array component and a minimum height for a plurality of soldered connections that are each produced by a respective one of the plurality of solder balls and a respective one of the plurality of pads as a result of the solder reflow process. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An information handling system (IHS), comprising:
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an IHS chassis; a circuit board located in the IHS chassis and having a circuit board surface, the circuit board including; a plurality of pads that are located on the circuit board surface; and a ball grid array component that is soldered to the circuit board, the ball grid array component including; a plurality of soldered connections between the ball grid array component and the circuit board, wherein each of the plurality of soldered connections is soldered to a respective one of the plurality of pads; at least one spacer member provided between the circuit board and the ball grid array component, wherein the at least one spacer member provides a mechanical stop between the ball grid array component and the circuit board, and a minimum height for each of the plurality of soldered connections. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14)
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15. A method for providing a ball grid array connection, comprising:
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providing a circuit board having a circuit board surface including a plurality of pads; coupling a ball grid array component to the circuit board, wherein the ball grid array component includes a plurality of solder balls, and wherein the coupling positions each of the plurality of solder balls adjacent a respective one of the plurality of pads; performing a solder reflow process on the coupled circuit board and ball grid array component, wherein the solder reflow process produces a plurality of soldered connections from each of the plurality of solder balls and a respective one of the plurality of pads; and providing at least one spacer member between the ball grid array component and the circuit board during the solder reflow process, wherein the at least one spacer member provides a mechanical stop between the ball grid array component and the circuit board and a minimum height for each of the plurality of soldered connections. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification