COOLED ELECTRONIC ASSEMBLY AND COOLING DEVICE

• US 20150195951A1
• Filed: 01/06/2014
• Published: 07/09/2015
• Est. Priority Date: 01/06/2014
• Status: Abandoned Application

• Current Assignee: GE Aviation Systems LLC (GE Aerospace)
• Original Assignee: GE Aviation Systems LLC (GE Aerospace)
• Inventors: Long, Dan Scott, Ludwig, Michael Carl, Pietrantonio, Michael
• Application Number:
  US14/147,665
• Publication Number:
  US 20150195951A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/48139 with an intermediate bond, e.g. continuous wire daisy chain
• CPC Class Codes: H01L 2224/48195 the item being a discrete passive component
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/4903 Connectors having different sizes, e.g. different diameters
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change

Abstract

A cooling device and a cooled electronic assembly having a substrate having a first coefficient of thermal expansion, at least one heat source operably coupled to the substrate, a carrier plate operably coupled to the substrate and a heat sink wherein the heat sink, carrier plate, and substrate are configured to direct heat away from the at least one heat source.

Claims

1. A cooled electronic assembly, comprising:

a substrate having a first coefficient of thermal expansion;

at least one heat source operably coupled to the substrate;

a carrier plate operably coupled to the substrate and having a second coefficient of thermal expansion that matches the first coefficient of thermal expansion; and

a heat sink, comprising a base plate, operably coupled to the carrier plate;

wherein the heat sink, the carrier plate, and the substrate are configured to direct heat away from the at least one heat source.

2. The cooled electronic assembly of claim 1 wherein the heat sink is a liquid-cooled heat sink.

3. The cooled electronic assembly of claim 2 wherein the liquid cooled heat sink further comprises millichannels configured to deliver a coolant to the carrier plate for cooling the at least one heat source.

4. The cooled electronic assembly of claim 3 wherein the carrier plate further comprises millichannels configured to deliver the coolant for cooling the at least one heat source.

5. The cooled electronic assembly of claim 1 wherein the heat sink is an air-cooled heat sink having a plurality of heat dissipating fins.

6. A cooling device for cooling at least one heat source mounted on a substrate having a first coefficient of thermal expansion, comprising:

a carrier plate operably coupled to the substrate and having a second coefficient of thermal expansion that matches the first coefficient of thermal expansion; and

a heat sink, comprising a base plate, selectively operably coupled to the carrier plate;

wherein the heat sink and the carrier plate are configured to direct heat away from the at least one heat source.

7. The cooling device of claim 6 wherein the heat sink is a liquid-cooled heat sink that utilizes a coolant for transferring heat from the at least one heat source.

8. The cooling device of claim 7 wherein the liquid cooled heat sink further comprises millichannels configured to deliver the coolant to the carrier plate for cooling the at least one heat source.

9. The cooling device of claim 8 wherein the carrier plate further comprises millichannels configured to deliver the coolant for cooling the at least one heat source.

10. The cooling device of claim 7, further comprising a seal for sealing the carrier plate to the heat sink.

11. The cooling device of claim 10 wherein the seal is an o-ring suitable for use with coolants including ethylene glycol, propylene glycol, and polyalphaolefin.

12. The cooling device of claim 6 wherein the substrate is composed of aluminum nitride and the carrier plate is composed of a molybdenum copper alloy.

13. The cooling device of claim 12 wherein the heat sink is composed of aluminum and does not have a coefficient of thermal expansion that matches the first coefficient of thermal expansion.

14. The cooling device of claim 6 wherein the heat sink is an air-cooled heat sink having a plurality of heat dissipating fins.

15. The cooling device of claim 6 wherein the carrier plate is bonded directly to the substrate.