COOLED ELECTRONIC ASSEMBLY AND COOLING DEVICE
First Claim
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1. A cooled electronic assembly, comprising:
- a substrate having a first coefficient of thermal expansion;
at least one heat source operably coupled to the substrate;
a carrier plate operably coupled to the substrate and having a second coefficient of thermal expansion that matches the first coefficient of thermal expansion; and
a heat sink, comprising a base plate, operably coupled to the carrier plate;
wherein the heat sink, the carrier plate, and the substrate are configured to direct heat away from the at least one heat source.
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Abstract
A cooling device and a cooled electronic assembly having a substrate having a first coefficient of thermal expansion, at least one heat source operably coupled to the substrate, a carrier plate operably coupled to the substrate and a heat sink wherein the heat sink, carrier plate, and substrate are configured to direct heat away from the at least one heat source.
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Citations
15 Claims
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1. A cooled electronic assembly, comprising:
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a substrate having a first coefficient of thermal expansion; at least one heat source operably coupled to the substrate; a carrier plate operably coupled to the substrate and having a second coefficient of thermal expansion that matches the first coefficient of thermal expansion; and a heat sink, comprising a base plate, operably coupled to the carrier plate; wherein the heat sink, the carrier plate, and the substrate are configured to direct heat away from the at least one heat source. - View Dependent Claims (2, 3, 4, 5)
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6. A cooling device for cooling at least one heat source mounted on a substrate having a first coefficient of thermal expansion, comprising:
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a carrier plate operably coupled to the substrate and having a second coefficient of thermal expansion that matches the first coefficient of thermal expansion; and a heat sink, comprising a base plate, selectively operably coupled to the carrier plate; wherein the heat sink and the carrier plate are configured to direct heat away from the at least one heat source. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification