SYSTEMS AND METHODS FOR CREATING ALTERED ADHESIVE BONDS
First Claim
1. A method for creating a plurality of altered adhesive bonds between a plurality of first substrates and a plurality of second substrates, the method comprising:
- selecting a manufacturing process having a plurality of steps, wherein the manufacturing process is configured to produce a reference adhesive bond between one of the plurality of first substrates and one of the plurality of second substrates, the reference adhesive bond having a reference bond strength;
selectively altering at least one of the plurality of steps of the manufacturing process during each of a plurality of performances of the manufacturing process, thereby producing the plurality of altered adhesive bonds, each of the plurality of altered adhesive bonds being formed between one of the plurality of first substrates and one of the plurality of second substrates, wherein at least a portion of the plurality of altered adhesive bonds have a strength that is equal to or less than an altered bond strength, wherein the altered bond strength is different from the reference bond strength; and
utilizing the plurality of altered adhesive bonds to develop a non-destructive testing method to detect a weakened adhesive bond.
1 Assignment
0 Petitions
Accused Products
Abstract
Disclosed are systems and methods of creating altered adhesive bonded joints between metal or composite substrates, including bonds that are weaker in strength than selected reference bonds. One method of creating an altered adhesive bond includes providing a first substrate and a second substrate, selecting a manufacturing process having a plurality of steps designed to produce a desired, or reference, adhesive bond having a desired strength, and selectively altering at least one of the plurality of steps during performance of the manufacturing process to produce an altered bond between the first substrate and the second substrate, the altered bond having an altered strength that is weaker than the strength of the desired adhesive bond. The systems may include systems that may be utilized to create the altered adhesive bonds and/or test standards.
8 Citations
20 Claims
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1. A method for creating a plurality of altered adhesive bonds between a plurality of first substrates and a plurality of second substrates, the method comprising:
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selecting a manufacturing process having a plurality of steps, wherein the manufacturing process is configured to produce a reference adhesive bond between one of the plurality of first substrates and one of the plurality of second substrates, the reference adhesive bond having a reference bond strength; selectively altering at least one of the plurality of steps of the manufacturing process during each of a plurality of performances of the manufacturing process, thereby producing the plurality of altered adhesive bonds, each of the plurality of altered adhesive bonds being formed between one of the plurality of first substrates and one of the plurality of second substrates, wherein at least a portion of the plurality of altered adhesive bonds have a strength that is equal to or less than an altered bond strength, wherein the altered bond strength is different from the reference bond strength; and utilizing the plurality of altered adhesive bonds to develop a non-destructive testing method to detect a weakened adhesive bond. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A test standard manufacturing apparatus, comprising:
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an abrading apparatus comprising a plurality of sanding means; a primer application apparatus comprising an apparatus configured to spray at least one of an adhesive primer and a paint primer onto at least one of a first substrate and a second substrate; a compaction assembly comprising a vacuum assembly; and a heating apparatus, wherein the heating apparatus is configured to heat the compaction assembly to a temperature of at least 120°
C., and wherein the test standard manufacturing apparatus is configured to produce a test standard, the test standard comprising an adhesive bonded joint between the first substrate and the second substrate, wherein at least one of the abrading apparatus, the primer application apparatus, the compaction assembly, and the heating apparatus is configured to alter a selected step of a manufacturing process to produce an altered adhesive bonded joint between the first substrate and the second substrate. - View Dependent Claims (17)
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18. A test standard, comprising:
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a first metallic substrate; a second metallic substrate; and an altered adhesive bond formed by joining the first metallic substrate and the second metallic substrate, wherein the altered adhesive bond comprises a film adhesive, a conversion coating mixture, and a urethane-based primer, and wherein the altered adhesive bond is measurably weaker than a desired strength of a reference adhesive bond. - View Dependent Claims (19)
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20. A test standard, comprising:
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a first composite substrate; a second composite substrate; an altered adhesive bond formed by joining the first composite substrate and the second composite substrate, wherein the altered adhesive bond has been intentionally produced to include at least one of; (i) at least 0.3% pre-bond moisture, (ii) an undercured adhesive, and (iii) a hydrocarbon contaminant, and wherein the altered adhesive bond is altered with respect to at least one quantitative property relative to a reference adhesive bond.
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Specification