STACKED CONDUCTIVE INTERCONNECT INDUCTOR
First Claim
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1. An integrated circuit device, comprising:
- a first substrate supporting a first pair of conductive interconnects;
a second substrate on the first pair of conductive interconnects, the first pair of conductive interconnects arranged to operate as part of a first 3D solenoid inductor; and
a first conductive trace coupling the first pair of conductive interconnects to each other.
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Abstract
An integrated circuit device includes a first substrate supporting a pair of conductive interconnects, for example pillars. The device also includes a second substrate on the pair of conductive interconnects. The pair of conductive interconnects is arranged to operate as a first 3D solenoid inductor. The device further includes a conductive trace coupling the pair of conductive interconnects to each other.
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Citations
26 Claims
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1. An integrated circuit device, comprising:
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a first substrate supporting a first pair of conductive interconnects; a second substrate on the first pair of conductive interconnects, the first pair of conductive interconnects arranged to operate as part of a first 3D solenoid inductor; and a first conductive trace coupling the first pair of conductive interconnects to each other. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. An integrated circuit device, comprising:
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a first substrate supporting a first pair of conductive interconnects and a second pair of conductive interconnects; a second substrate stacked on the first and second pair of conductive interconnects, the second substrate supporting a third pair of conductive interconnects and a fourth pair of conductive interconnects, the second substrate including a pair of vias coupling the second pair of conductive interconnects to the fourth pair of conductive interconnects; a third substrate stacked on the third and fourth pairs of conductive interconnects; a first conductive trace coupling the first pair of conductive interconnects to each other to operate as a first stacked 3D solenoid inductor; a second conductive trace coupling the third pair of conductive interconnects to each other to operate as a second stacked 3D solenoid inductor; and a third conductive trace coupling one of the second or fourth pair of conductive interconnects to each other to operate as a third stacked 3D solenoid inductor.
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11. A back end of line processing method to fabricate an inductive device, comprising:
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fabricating a first pair of conductive interconnects on a first substrate; placing a second substrate on the first pair of conductive interconnects, the first pair of conductive interconnects arranged to operate as a first 3D solenoid inductor; and fabricating a first conductive trace coupling the first pair of conductive interconnects to each other. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18. An integrated circuit device, comprising:
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a first substrate supporting a first pair of means for interconnecting; a second substrate on the first pair of interconnecting means, the first pair of interconnecting means arranged to operate as a first 3D solenoid inductor; and a first conductive means coupling the first pair of interconnecting means to each other. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26)
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Specification