WAFER OR RETICLE THERMAL DEFORMATION MEASURING TECHNIQUES

• US 20150204665A1
• Filed: 01/21/2014
• Published: 07/23/2015
• Est. Priority Date: 01/21/2014
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Lee, Tsung-Hsun, Ho, Kai-Fa
• Granted Patent: US 9,574,875 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G01B 21/32 for measuring the deformation in a solid
• CPC Class Codes: G01N 25/16 by investigating thermal coefficient of expansion

Abstract

A system includes a wafer stage adapted to hold a semiconductor wafer thereon. A moveable temperature sensor array is configured to move to a plurality of different positions over a surface of the wafer stage and to take a plurality of temperature measurements at the plurality of positions, respectively. Based on the plurality of temperature measurements, a controller is adapted to determine an expected thermal deformation for the semiconductor wafer or for a reticle arranged over the semiconductor wafer.

Claims

1. A system, comprising:

a wafer stage adapted to hold a semiconductor wafer thereon;

a moveable temperature sensor array configured to move to a plurality of different positions over a surface of the wafer stage and to take a plurality of temperature measurements at the plurality of different positions, respectively; and

a controller adapted to, based on the plurality of temperature measurements, determine an expected thermal deformation for the semiconductor wafer or for a reticle arranged over the semiconductor wafer.

2. The system of claim 1, wherein the moveable temperature sensor array comprises:

a first pair of parallel rails which extend over the wafer stage;

a mounting element that engages the first pair of parallel rails and which moves along the first pair of parallel rails to move between the plurality of different positions under direction of the controller; and

an array of temperature sensors mounted on the mounting element and adapted to take temperature measurements under direction of the controller.

3. The system of claim 2, wherein the array of temperature sensors comprises a plurality of infrared photo diodes to detect thermal radiation.

4. The system of claim 2, further comprising:

a chemical vapor deposition (CVD) or physical vapor deposition (PVD) element;

wherein the controller is configured to tune deposition characteristics of the CVD or PVD element based on the plurality of temperature measurements.

5. The system of claim 1, further comprising:

an illumination source adapted to provide light along an optical axis, where the optical axis intersects a location on the wafer stage at which the semiconductor wafer is to be held; and

a reticle stage aligned on the optical axis and adapted to hold the reticle thereon, wherein the reticle and the illumination source collectively provide a reticle image at a location near the wafer stage where the semiconductor wafer is to be held;

wherein the controller is adapted to determine a temperature gradient profile and corresponding thermal deformation for the reticle based on the plurality of temperature measurements.

6. The system of claim 5, wherein the reticle stage is moveable under direction of the controller and comprises:

a pair of parallel rails which extend over the wafer stage; and

a reticle mounting element which engages the pair of parallel rails and which is configured to receive the reticle thereon.

7. The system of claim 5, wherein the wafer stage, reticle stage, and moveable temperature sensor array are configured to be concurrently aligned on the optical axis so the moveable temperature sensor array can determine a first temperature gradient profile for the wafer and a second temperature gradient profile for the reticle while in concurrent alignment.

8. The system of claim 5, wherein the reticle and temperature sensor array are moved concurrently in coordinated fashion.

9. The system of claim 5, further comprising:

a moveable optical assembly configured to selectively move from a first optical assembly position off the optical axis to a second optical assembly position on the optical axis under direction of the controller, wherein the moveable optical assembly is configured to focus light that has passed through the reticle onto a location on the wafer stage where the semiconductor wafer is to be held.

10. The system of claim 9, wherein the wafer stage, the reticle stage, and the moveable temperature sensor array are configured to be concurrently at least substantially aligned on the optical axis while the movable optical assembly is off the optical axis so the moveable temperature sensor array can concurrently determine a first temperature gradient profile for the semiconductor wafer and a second temperature gradient profile for the reticle.

11. A system, comprising:

a wafer stage adapted to hold a semiconductor wafer thereon;

an illumination source adapted to provide light along an optical axis, where the light is to strike the wafer stage at a location at which the semiconductor wafer is to be held;

a moveable reticle stage configured to selectively move a reticle from a first reticle position off the optical axis to a second position on the optical axis;

an optical assembly configured to focus light that has passed through the reticle onto a location on the wafer stage where the semiconductor wafer is to be held;

a moveable temperature sensor array configured to move to a plurality of different positions over a surface of the wafer stage and to take a plurality of temperature measurements at the plurality of positions, respectively; and

a controller adapted to, based on the plurality of temperature measurements, determine an expected thermal deformation for the reticle or the semiconductor wafer.

12. The system of claim 11, where the optical assembly is configured to selectively move from a first optical assembly position off the optical axis to a second optical assembly position on the optical axis under direction of the controller.

13. The system of claim 12, wherein the wafer stage, the moveable reticle stage, and the moveable temperature sensor array are configured to be concurrently at least substantially aligned on the optical axis while the optical assembly is off the optical axis so the moveable temperature sensor array can determine a first temperature gradient profile for the wafer and a second temperature gradient profile for the reticle.

14. The system of claim 11, wherein the moveable temperature sensor comprises:

a first pair of parallel rails which extend over the wafer stage;

a mounting element that engages the first pair of parallel rails and which moves along the first pair of parallel rails to move between the plurality of different positions under direction of the controller; and

an array of temperature sensors mounted on the mounting element and adapted to take temperature measurements under direction of the controller.

15. The system of claim 14, wherein the reticle stage is moveable under direction of the controller and comprises:

a second pair of parallel rails which extend over the wafer stage; and

a reticle mounting element which engages the second pair of parallel rails and which is configured to receive the reticle thereon.

17. The system of claim 15, wherein the reticle and temperature sensor array are moved concurrently in coordinated fashion.

18. A method, comprising:

providing a semiconductor wafer;

moving a reticle to a plurality of different positions over a surface of the semiconductor wafer and providing a reticle image on the surface of the semiconductor wafer for each of the plurality of different positions;

moving a temperature sensor array to a plurality of different positions over a surface of the semiconductor wafer and taking a plurality of temperature measurements at the plurality of positions, respectively; and

based on the plurality of temperature measurements, determining an expected thermal deformation for the wafer or the reticle.

19. The method of claim 18, wherein the reticle and temperature sensor array are moved concurrently in coordinated fashion.

20. The method of claim 18, wherein the temperature sensor array includes a plurality of temperature sensor elements that are spread over a length that is approximately equal to a diameter of the semiconductor wafer.