METHOD OF MANUFACTURING HIGH PERMITTIVITY LOW LEAKAGE CAPACITOR AND ENERGY STORING DEVICE

• US 20150206659A1
• Filed: 03/25/2015
• Published: 07/23/2015
• Est. Priority Date: 10/05/2007
• Status: Active Grant

• Current Assignee: Carver Scientific Inc.
• Original Assignee: Carver Scientific Inc.
• Inventors: Carver, David Reginald
• Granted Patent: US 9,928,958 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01G 13/00 Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
• CPC Class Codes: H01G 4/018 Dielectrics
• CPC Class Codes: H01G 4/04 Liquid dielectrics
• CPC Class Codes: H01G 4/206 inorganic and synthetic material
• CPC Class Codes: H02J 7/345 using capacitors as storage or buffering devices

Abstract

A method is provided for making a high permittivity dielectric material for use in capacitors. Several high permittivity materials in an organic nonconductive media with enhanced properties and methods for making the same are disclosed. A general method for the formation of thin films of some particular dielectric material is disclosed, wherein organic polymers are utilized to produce low conductivity dielectric coatings. Additionally, a method whereby the formation of certain transition metal salts as salt or oxide matrices is demonstrated at low temperatures utilizing mild reducing agents. Further, a circuit structure and associated method of operation for the recovery and regeneration of the leakage current from the long-term storage capacitors is provided in order to enhance the manufacturing yield and utility performance of such devices.

Claims

1. A method for creating a spreadable film of high permittivity dielectric material on a first substrate, said method comprising:

creating a first solution comprising a polymer;

combining said first solution with a high permittivity dielectric material;

mixing said first solution with the high permittivity dielectric material to create a second solution or slurry; and

spreading said second solution or slurry in a film onto the first substrate.

2. The method for creating a spreadable film of high permittivity dielectric material on a first substrate of claim 1, wherein the polymer comprises poly-p-xylylene, shellac, zein, silicone oil, or any combination thereof.

3. The method for creating a spreadable film of high permittivity dielectric material on a first substrate of claim 1, further comprising adding an iron salt to the polymer.

4. The method for creating a spreadable film of high permittivity dielectric material on a first substrate of claim 1, further comprising adding a reducing agent to said first solution.

5. The method for creating a spreadable film of high permittivity dielectric material on a first substrate of claim 4, wherein said reducing agent comprises sodium borohydride.

6. The method for creating a spreadable film of high permittivity dielectric material on a first substrate according to claim 1, said method further comprising removing particulate matter not dissolved into said first solution.

7. The method for creating a spreadable film of high permittivity dielectric material on a substrate according to claim 1, further comprising:

applying a permittivity enhancing field across said first substrate and said second solution or slurry, said permittivity enhancing field comprising

an electric field generated by a voltage source, or

a magnetic field provided by placing said first substrate and said second solution or slurry between magnetic north and south poles of a magnetic source.

8. The method for creating a spreadable film of high permittivity dielectric material on a substrate according to claim 7, wherein the electric field has a strength greater than 100 V/cm.

9. The method for creating a spreadable film of high permittivity dielectric material on a substrate according to claim 7, wherein the magnetic field has a strength greater than 1 Gauss.