Semiconductor Package and Methods of Forming Same
First Claim
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1. A package-on-package (PoP) device comprising:
- a first fan-out structure comprising;
a logic chip;
a first molding compound encircling the logic chip; and
a first plurality of conductive pillars extending through the first molding compound;
a second fan-out structure comprising;
one or more memory chips;
a second molding compound encircling the one or more memory chips; and
a second plurality of conductive pillars extending through the second molding compound; and
a first plurality of connectors bonding the first fan-out structure to the second fan-out structure.
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Abstract
An embodiment package-on-package (PoP) device includes a fan-out structure, one or more memory chips, and a plurality of connectors bonding the one or more memory chips to the fan-out structure. The fan-out structure includes a logic chip, a molding compound encircling the logic chip, and a plurality of conductive pillars extending through the molding compound.
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Citations
20 Claims
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1. A package-on-package (PoP) device comprising:
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a first fan-out structure comprising; a logic chip; a first molding compound encircling the logic chip; and a first plurality of conductive pillars extending through the first molding compound; a second fan-out structure comprising; one or more memory chips; a second molding compound encircling the one or more memory chips; and a second plurality of conductive pillars extending through the second molding compound; and a first plurality of connectors bonding the first fan-out structure to the second fan-out structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A package-on-package (PoP) device comprising:
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a fan-out structure comprising; a logic chip; a molding compound encircling the logic chip; and a plurality of through molding vias (TMVs) extending through the molding compound; one or more memory chips bonded to a first surface of the fan-out structure; and a first package substrate bonded to the first surface of the fan-out structure, wherein the first package substrate comprises a through hole, and wherein the one or more memory chips are disposed in the through hole. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A method for forming a package-on-package (PoP) device comprising:
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forming a first fan-out structure, wherein forming the first fan-out structure comprises; patterning a first plurality of openings in a photoresist layer over a carrier; filling the first plurality of openings with a conductive material to form a plurality of conductive pillars; removing the photoresist layer leaving a second plurality of openings between each of the plurality of conductive pillars; disposing a logic chip over the carrier in one of the second plurality of openings; and filling the second plurality of openings with a molding compound, wherein lateral surfaces of the molding compound and the logic chip are substantially level; and bonding one or more wide input/output (IO) chips to the first fan out structure, wherein the one or more wide IO chips is electrically connected to the logic chip. - View Dependent Claims (17, 18, 19, 20)
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Specification