Contact Bump Connection and Contact Bump and Method for Producing a Contact Bump Connection

• US 20150208508A1
• Filed: 08/09/2013
• Published: 07/23/2015
• Est. Priority Date: 08/10/2012
• Status: Active Application

• Current Assignee: Smartrac Technology GmbH (Avery Dennison Corporation)
• Original Assignee: Smartrac Technology GmbH (Avery Dennison Corporation)
• Inventors: Nieland, Carsten, Kriebel, Frank
• Granted Patent: US 10,292,270 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 21/76885 By forming conductive members before deposition of protective insulating material, e.g. pillars, studs
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05552 in top view
• CPC Class Codes: H01L 2224/05567 the external layer being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/11462 Electroplating
• CPC Class Codes: H01L 2224/11622 Photolithography
• CPC Class Codes: H01L 2224/13006 Bump connector larger than the underlying bonding area, e.g. than the under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/13011 comprising apertures or cavities, e.g. hollow bump
• CPC Class Codes: H01L 2224/13012 in top view
• CPC Class Codes: H01L 2224/13019 at the bonding interface of the bump connector, i.e. on the surface of the bump connector
• CPC Class Codes: H01L 2224/13022 the bump connector being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/16113 the whole bump connector protruding from the surface
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73104 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/81191 wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81201 Compression bonding
• CPC Class Codes: H01L 2224/81206 Direction of oscillation
• CPC Class Codes: H01L 2224/81345 Shape, e.g. interlocking features
• CPC Class Codes: H01L 2224/81898 : Press-fitting, i.e. pushing the parts together and fastening by friction, e.g. by compression of one part against the other
• CPC Class Codes: H01L 2224/83 : using a layer connector
• CPC Class Codes: H01L 2224/83862 : Heat curing
• CPC Class Codes: H01L 2224/9211 : Parallel connecting processes
• CPC Class Codes: H01L 2224/92125 : the second connecting process involving a layer connector
• CPC Class Codes: H01L 23/49811 : Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H05K 1/18 : Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 2201/1059 : Connections made by press-fit insertion
• CPC Class Codes: H05K 2201/10674 : Flip chip
• CPC Class Codes: H05K 2201/10954 : Other details of electrical connections
• CPC Class Codes: H05K 2203/0415 : Small preforms other than balls, e.g. discs, cylinders or pillars
• CPC Class Codes: H05K 3/301 : by means of a mounting structure H05K3/325 takes precedence
• CPC Class Codes: H05K 3/3431 : Leadless components
• CPC Class Codes: Y10T 29/49018 : with other electrical component
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

The invention relates to a contact bump connection (24) and to a method for producing a contact bump connection between an electronic component being provided with at least one terminal face (11) and a contact substrate (26) being contacted with the component and having at least one second terminal face (25), wherein the first terminal face is provided with a contact bump (10), which has a raised edge (15) and has at least one displacement pin (16) in a displacement compartment (18) being surrounded by the raised edge and being open towards a head end of the contact bump, and wherein, in a contact region (31) with the first terminal face, the second terminal face has a contact bead (30), which is formed by displacement of a contact material (29) of the second terminal face into the displacement compartment and which surrounds the displacement pin, said contact bead having a bead crown (33) which is oriented to a bottom (17) of the displacement compartment and is raised relative to a level contact surface (32) of the second terminal face surrounding the contact region.

Claims

1. A contact bump connection between an electronic component being provided with at least one terminal face and a contact substrate being contacted with the component and having at least one second terminal face, said contact bump connection comprising:

a contact bump provided on a first terminal face of one of an electronic component or a contact substrate, said contact bump having a raised edge and at least one displacement pin in a displacement compartment being at least partially surrounded by the raised edge and being open towards a head end of the contact bump; and

a contact bead on a second terminal face of the other of the electronic component or the contact substrate, in a contact region with the first terminal face, the contact bead, being formed by displacement of a contact material of the second terminal face into the displacement compartment and which surrounds the displacement pin, said contact bead having a bead crown oriented to a bottom of the displacement compartment and raised relative to a level contact surface of the second terminal face surrounding the contact region.

2. The contact bump connection according to claim 1, in which the raised edge is formed circumferentially and limits the displacement compartment peripherally.

3. The contact bump connection according to claim 1, in which a free end of the displacement pin is arranged beneath an upper edge of the raised edge, in such a manner that the displacement compartment is divided into a displacement compartment section extending from the free end of the displacement pin up to the upper edge of the raised edge, said displacement compartment section not resisting displacement, and into a displacement compartment section extending from the bottom of the displacement compartment up to the free end of the displacement pin, said displacement compartment section being provided with the displacement pin serving as a displacement resistance and resisting displacement.

4. The contact bump connection according to claim 3, in which the displacement compartment section resisting displacement is formed as an annular compartment.

5. The contact bump connection according to claim 1, in which the first terminal face is formed from a terminal face of a chip or of a chip module and in that the second terminal face is formed from a terminal end of an antenna conductor.

6. A contact bump for producing a contact bump connection according to claim 1, in which the contact bump has a raised edge and has at least one displacement pin in a displacement compartment being at least partially surrounded by the raised edge and being open to a head end of the contact bump.

7. The contact bump according to claim 6, in which the raised edge is formed circumferentially and limits the displacement compartment peripherally.

8. The contact bump according to claim 6, in which the free end of the displacement pin is arranged beneath an upper edge of the raised edge.

9. The contact bump according to claim 6, in which by arranging the displacement pin in the displacement compartment between the raised edge and the displacement pin, an annular compartment is formed.

10. A method for producing a contact bump connection, said method comprising:

pressing a contact bump arranged on a first terminal face into a contact surface of a contact material of a second terminal face in a press-in direction, said contact bump having a raised edge and at least one displacement pin in a displacement compartment being at least partially surrounded by the raised edge and being open towards a head end of the contact bump, wherein said pressing occurring in such a manner that, in the displacement compartment of the contact bump, while the raised edge and the displacement pin penetrate into the contact material of the second terminal face, in relation to the press-in direction, said contact material is exposed to pressure both by the raised edge radially inwardly and by the displacement pin radially outwardly.

11. The method according to claim 10, in which in a first phase of producing the connection, the contact material of the second terminal face, in the displacement compartment of the contact bump, is exposed to pressure radially inwardly by the raised edge of the contact bump until reaching the free end of the connection pin, and in that, in a second phase of producing the connection, when the contact bump continues to penetrate into the contact material of the second terminal face, the contact material is exposed to pressure radially inwardly by the raised edge and radially outwardly by the connection pin.

12. The method according to claim 10, in which during pressing of the contact bump into the contact material said pressing is superposed with vibrations.

13. The method according to claim 12, in which the superposition with vibrations is effected in a transverse plane with respect to the press-in direction.

14. The method according to claim 12, in which the superposition with vibrations is effected in the press-in direction.

15. An application of the method according to claim 10 for producing a transponder comprising a chip and an antenna, the first terminal faces forming part of the chip being arranged on a chip substrate, said first terminal faces being provided with the contact bumps, are contacted with a second terminal faces of an antenna being arranged on an antenna substrate, said second terminal faces being formed by a terminal ends of an antenna conductor.