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SHOWERHEAD-COOLER SYSTEM OF A SEMICONDUCTOR-PROCESSING CHAMBER FOR SEMICONDUCTOR WAFERS OF LARGE AREA

  • US 20150214009A1
  • Filed: 01/25/2014
  • Published: 07/30/2015
  • Est. Priority Date: 01/25/2014
  • Status: Active Grant
First Claim
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1. A showerhead-cooler system of a semiconductor-processing chamber of a CCP plasma processing apparatus intended for plasma processing of objects comprising:

  • a showerhead having a plurality of through gas holes;

    a gas-feeding cooler plate that is connected to an RF power supply, has electrical contact with the showerhead, and forms with the showerhead a gas-accumulation reservoir that communicates with the through gas holes of the showerhead;

    a gas-feeding cooler plate being connected to the source of a working gas and has a plurality of through gas-feeding passages that communicate with the gas-accumulating reservoir;

    a showerhead having a front side that faces the semiconductor-processing chamber, a back side that faces the cooler plate, a peripheral portion, which is in said electrical contact with the cooler plate, and a central area which is in the center of the showerhead;

    on the back side of the showerhead the through gas holes of the showerhead having conical nozzles with a cone angle θ

    that decreases in the direction from the peripheral portion to the central area of the showerhead.

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