Inductor for Post Passivation Interconnect and A Method of Forming
First Claim
Patent Images
1. A method of forming an inductor device, the method comprising:
- forming a coil over a substrate;
forming dummy pads over the substrate in a post passivation interconnect (PPI) layer, the dummy pads configured to shield the coil from electromagnetic interference; and
depositing first portions of an under bump metallization (UBM) layer over respective ones of the dummy pads.
0 Assignments
0 Petitions
Accused Products
Abstract
An inductor device and method of forming the inductor device are provided. In some embodiments the inductor device includes a post passivation interconnect (PPI) layer disposed and an under bump metallization (UBM) layer, each disposed over a substrate. The PPI layer forms a coil and dummy pads. The dummy pads are disposed around a substantial portion of the coil to shield the coil from electromagnetic interference. A first portion of the UBM layer is electrically coupled to the coil and configured to interface with an electrical coupling member.
-
Citations
20 Claims
-
1. A method of forming an inductor device, the method comprising:
-
forming a coil over a substrate; forming dummy pads over the substrate in a post passivation interconnect (PPI) layer, the dummy pads configured to shield the coil from electromagnetic interference; and depositing first portions of an under bump metallization (UBM) layer over respective ones of the dummy pads. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
-
8. A method of forming an inductor device, the method comprising:
-
forming a coil over a substrate; forming a post passivation interconnect (PPI) layer, the forming the PPI comprising patterning a conductive layer to form a plurality of dummy pads, the plurality of dummy pads being arranged around a perimeter of the coil in a plan view; and forming an under bump metallization (UBM) over respective ones of the plurality of dummy pads. - View Dependent Claims (9, 10, 11, 12, 13, 14)
-
-
15. A method of forming an inductor device, the method comprising:
-
forming a top metallization layer over a substrate; forming a first passivation layer over the top metallization layer; forming a coil over the first passivation layer; and forming dummy pads over the first passivation layer, the dummy pads being arranged around a perimeter of the coil in a plan view. - View Dependent Claims (16, 17, 18, 19, 20)
-
Specification