ELECTRONIC ARRAY AND CHIP PACKAGE
First Claim
1. An electronic array, comprisinga first electronic component having a first operation voltage,a second electronic component which has a second operation voltage, wherein the second operation voltage is different from the first operation voltage and wherein the first electronic component and the second electronic component are arranged over each other,an isolation layer between the first electronic component and the second electronic component, wherein the isolation layer electrically isolates the first electronic component from the second electronic component,at least one connection layer formed at least partially at least one of between the isolation layer and the first electronic component or between the isolation layer and the second electronic component,wherein the connection layer comprises a first portion and a second portion, wherein the first portion and the second portion each extend from the corresponding electronic component to the isolation layer, wherein the first portion comprises an electrically isolating material which fixes the isolation layer to the corresponding electronic component and wherein the second portion comprises an electrically conductive material which electrically couples the corresponding electronic component to the isolation layer.
1 Assignment
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Accused Products
Abstract
An electronic array may include a first electronic component which has a first operation voltage, a second electronic component which has a second operation voltage, wherein the second operation voltage is different from the first operation voltage and wherein the first electronic component and the second electronic component are arranged over each other, an isolation layer between the first electronic component and the second electronic component, wherein the isolation layer electrically isolates the first electronic component from the second electronic component, at least one connection layer formed at least partially between the isolation layer and the first electronic component or between the isolation layer and the second electronic component, wherein the connection layer includes a first portion and a second portion, wherein the first portion and the second portion each extend from the corresponding electronic component to the isolation layer, wherein the first portion includes an electrically isolating material which fixes the isolation layer to the corresponding electronic component and wherein the second portion includes an electrically conductive material which electrically couples the corresponding electronic component to the isolation layer.
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Citations
25 Claims
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1. An electronic array, comprising
a first electronic component having a first operation voltage, a second electronic component which has a second operation voltage, wherein the second operation voltage is different from the first operation voltage and wherein the first electronic component and the second electronic component are arranged over each other, an isolation layer between the first electronic component and the second electronic component, wherein the isolation layer electrically isolates the first electronic component from the second electronic component, at least one connection layer formed at least partially at least one of between the isolation layer and the first electronic component or between the isolation layer and the second electronic component, wherein the connection layer comprises a first portion and a second portion, wherein the first portion and the second portion each extend from the corresponding electronic component to the isolation layer, wherein the first portion comprises an electrically isolating material which fixes the isolation layer to the corresponding electronic component and wherein the second portion comprises an electrically conductive material which electrically couples the corresponding electronic component to the isolation layer.
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17. A chip package comprising
a first chip; -
a second chip, wherein the first chip is arranged over the second chip; an isolation layer, wherein the isolation layer electrically isolates the first chip from the second chip; at least one connection layer which is formed at least partially between the isolation layer and the first chip or between the isolation layer and the second chip; wherein the at least one connection layer comprises at least one first portion and at least one second portion of the connection layer, wherein the first portion and the second portion of the connection layer extend from the corresponding chip to the isolation layer, wherein the first portion of the connection layer comprises an electrically isolating material and fixes the isolation layer to the corresponding chip and wherein the second portion comprises an electrically conductive material and provides an electrical bridge from corresponding chip to the isolation layer. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25)
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Specification