ELECTRONIC ARRAY AND CHIP PACKAGE

• US 20150214297A1
• Filed: 01/29/2014
• Published: 07/30/2015
• Est. Priority Date: 01/29/2014
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Strutz, Volker, Theuss, Horst, Tan, Chee Voon, Wang, Hui Teng
• Granted Patent: US 9,111,772 B1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/133 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/1339 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/134 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/2612 Auxiliary members for layer connectors, e.g. spacers
• CPC Class Codes: H01L 2224/29194 with a principal constituent of the material being a liquid not provided for in groups H01L2224/291 - H01L2224/29191
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29339 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/60 Protection against electrostatic charges or discharges, e.g. Faraday shields
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/16 : the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 29/0649 : Dielectric regions, e.g. SiO2 regions, air gaps
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 : Solder alloys

Abstract

An electronic array may include a first electronic component which has a first operation voltage, a second electronic component which has a second operation voltage, wherein the second operation voltage is different from the first operation voltage and wherein the first electronic component and the second electronic component are arranged over each other, an isolation layer between the first electronic component and the second electronic component, wherein the isolation layer electrically isolates the first electronic component from the second electronic component, at least one connection layer formed at least partially between the isolation layer and the first electronic component or between the isolation layer and the second electronic component, wherein the connection layer includes a first portion and a second portion, wherein the first portion and the second portion each extend from the corresponding electronic component to the isolation layer, wherein the first portion includes an electrically isolating material which fixes the isolation layer to the corresponding electronic component and wherein the second portion includes an electrically conductive material which electrically couples the corresponding electronic component to the isolation layer.

Claims

1. An electronic array, comprising

a first electronic component having a first operation voltage,

a second electronic component which has a second operation voltage, wherein the second operation voltage is different from the first operation voltage and wherein the first electronic component and the second electronic component are arranged over each other,

an isolation layer between the first electronic component and the second electronic component, wherein the isolation layer electrically isolates the first electronic component from the second electronic component,

at least one connection layer formed at least partially at least one of between the isolation layer and the first electronic component or between the isolation layer and the second electronic component,

wherein the connection layer comprises a first portion and a second portion, wherein the first portion and the second portion each extend from the corresponding electronic component to the isolation layer, wherein the first portion comprises an electrically isolating material which fixes the isolation layer to the corresponding electronic component and wherein the second portion comprises an electrically conductive material which electrically couples the corresponding electronic component to the isolation layer.

2. The electronic array of claim 1,

wherein the at least one connection layer comprises:

a first connection layer formed at least partially between the isolation layer and the first electronic component, wherein the first connection layer comprises a first portion and a second portion of the first connection layer, wherein the first portion and the second portion of the first connection layer extend from the first electronic component to the isolation layer, wherein the first portion of the first connection layer comprises an electrically isolating material which fixes the isolation layer to the first electronic component and wherein the second portion of the first connection layer comprises an electrically conductive material which electrically couples the first electronic component to the isolation layer and/or

a second connection layer formed at least partially between the isolation layer and the second electronic component, wherein the second connection layer comprises a first portion and a second portion of the second connection layer, wherein the first portion and the second portion of the second connection layer extend from the second electronic component to the isolation layer, wherein the first portion of the second connection layer comprises an electrically isolating material which fixes the isolation layer to the second electronic component and wherein the second portion of the second connection layer comprises an electrically conductive material which electrically couples the second electronic component to the isolation layer.

3. The electronic array of claim 2, further comprising:

a first charge distribution layer formed between the first connection layer and the isolation layer, wherein the first and the second portion of the first connection layer extend from the first electronic component to the first charge distribution layer.

4. Electronic array according to claim 3,

wherein the first charge distribution layer contacts the isolation layer.

5. The electronic array of claim 2, further comprising:

a second charge distribution layer formed between the second connection layer and the isolation layer, wherein the first and the second portion of the second connection layer extend from the second electronic component to the second charge distribution layer.

6. The electronic array of claim 5,

wherein the second charge distribution layer contacts the isolation layer.

7. The electronic array of claim 2,

wherein at least one of the second portion of the first connection layer is embedded in the first portion of the first connection layer in a lateral direction or the second portion of the second connection layer is embedded in the first portion of the second connection layer in a lateral direction.

8. The electronic array of claim 2,

wherein at least one of the first portion or the second portion of the first connection layer are partially formed outside of the space between the first electronic component and the isolation layer.

9. The electronic array of claim 2,

wherein at least one of the first portion or the second portion of the second connection layer are partially formed outside of the space between the second electronic component and the isolation layer.

10. The electronic array of claim 2,

wherein at least one of the first portion of the first connection layer or the first portion of the second connection layer comprises at least one material selected from a group consisting of:

an adhesive;

a mold material; and

an embedding material.

11. The electronic array of claim 2,

wherein at least one of the second portion of the first connection layer or the second portion of the second connection layer comprises at least one of the following which extends from the corresponding electronic component to the isolation layer:

a conductive adhesive;

a conductive spacer;

a solid metal; and

one or more conductive particles.

12. The electronic array of claim 3,

wherein the first charge distribution layer comprises at least one of titanium nitride or doped silicon.

13. The electronic array of claim 5,

wherein the second charge distribution layer comprises at least one of titanium nitride or doped silicon.

14. The electronic array of claim 1,

wherein the second operation voltage is higher than the first operation voltage.

15. The electronic array of claim 1,

wherein the first electronic component comprises a first chip.

16. The electronic array of claim 1,

wherein the second electronic component comprises one of the following:

a carrier;

a second chip; and

a substrate.

17. A chip package comprising

a first chip;

a second chip, wherein the first chip is arranged over the second chip;

an isolation layer, wherein the isolation layer electrically isolates the first chip from the second chip;

at least one connection layer which is formed at least partially between the isolation layer and the first chip or between the isolation layer and the second chip;

wherein the at least one connection layer comprises at least one first portion and at least one second portion of the connection layer, wherein the first portion and the second portion of the connection layer extend from the corresponding chip to the isolation layer, wherein the first portion of the connection layer comprises an electrically isolating material and fixes the isolation layer to the corresponding chip and wherein the second portion comprises an electrically conductive material and provides an electrical bridge from corresponding chip to the isolation layer.

18. The chip package of claim 17,

wherein the at least one connection layer comprises:

a first connection layer which is formed at least partially between the isolation layer and the first chip, wherein the first connection layer comprises a first portion and a second portion of the first connection layer, wherein the first portion and the second portion of the first connection layer extend from the first chip to the isolation layer, wherein the first portion of the first connection layer comprises an electrically isolating material which fixes the isolation layer to the first chip and wherein the second portion of the first connection layer comprises an electrically conductive material which electrically couples the first chip to the isolation layer and/or

a second connection layer which is formed at least partially between the isolation layer and the second chip, wherein the second connection layer comprises a first portion and a second portion of the second connection layer, wherein the first portion and the second portion of the second connection layer extend from the second chip to the isolation layer, wherein the first portion of the second connection layer comprises an electrically isolating material which fixes the isolation layer to the second chip and wherein the second portion of the second connection layer comprises an electrically conductive material which electrically couples the second chip to the isolation layer.

19. The chip package of claim 18, further comprising:

a first charge distribution layer between the first connection layer and the isolation layer, wherein the first and the second portion of the first connection layer extend from the first chip to the first charge distribution layer.

20. The chip package of claim 18, further comprising:

a second charge distribution layer between the second connection layer and the isolation layer, wherein the first and the second portion of the second connection layer extend from the second chip to the second charge distribution layer.

21. The chip package of claim 18,

wherein at least one of the first portion of the first connection layer surrounds the second portion of the first connection layer in a lateral direction or the first portion of the second connection layer surrounds the second portion of the second connection layer in a lateral direction.

22. The chip package of claim 18,

wherein at least one of the first portion or the second portion of the first connection layer protrude from the space between the first chip and the isolation layer.

23. The chip package of claim 18,

wherein at least one of the first portion or the second portion of the second connection layer protrude from the space between the second chip and the isolation layer.

24. The chip package of claim 17,

wherein an operation voltage of the second chip is higher than an operation voltage of the first chip.

25. The chip package of claim 17,

wherein the chip package is configured as a current sensor.