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LED DEVICE WITH BRAGG REFLECTOR AND METHOD OF SINGULATING LED WAFER SUBSTRATES INTO DICE WITH SAME

  • US 20150214439A1
  • Filed: 01/26/2015
  • Published: 07/30/2015
  • Est. Priority Date: 01/27/2014
  • Status: Active Grant
First Claim
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1. A method of dicing semiconductor devices from a substrate, comprising:

  • forming a Bragg reflector over a bottom side of the substrate, wherein the bottom side is opposite of a top side and the Bragg reflector comprises a first layer of dielectric material having a first index of refraction and a second dielectric material having a second index of refraction different from the first index of refraction;

    generating a pattern of defects in the substrate with a laser beam from the bottom side of the substrate; and

    applying pressure to the substrate to dice the substrate along the pattern of defects.

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