LIGHT EMITTING DEVICE WITH A HEAT SINK COMPOSED OF TWO MATERIALS

• US 20150219327A1
• Filed: 01/31/2014
• Published: 08/06/2015
• Est. Priority Date: 01/31/2014
• Status: Active Grant

• Current Assignee: Christie Digital Systems Canada Incorporated (Ushio Incorporated)
• Original Assignee: Christie Digital Systems USA Incorporated (Ushio Incorporated)
• Inventors: GUTHRIE, Simon, ADEMA, Daniel Robert, HILL, Graham, PASTRIK, Darren
• Granted Patent: US 9,651,236 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: F21V 13/08 the elements being filters or photoluminescent elements and reflectors
• CPC Class Codes: F21V 29/502 characterised by the adaptation for cooling of specific components
• CPC Class Codes: F21V 29/503 of light sources cooling arrangements structurally associated with gas-discharge or vapour-discharge lamps H01J61/52; cooling arrangements structurally associated with electric incandescent lamps H01K1/58; cooling arrangements structurally associated with light-emitting diodes H01L33/64
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/85 characterised by the material liquid coolants F21V29/56
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21V 9/38 Combination of two or more photoluminescent elements of different materials
• CPC Class Codes: F21V 9/45 by adjustment of photoluminescent elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: F21Y 2115/30 Semiconductor lasers
• CPC Class Codes: G03B 21/16 Cooling; Preventing overheating
• CPC Class Codes: G03B 21/204 using secondary light emission, e.g. luminescence or fluorescence using different colours G03B33/00; if related to video signals H04N9/3197
• CPC Class Codes: Y10T 29/49863 with prestressing of part
• CPC Class Codes: Y10T 29/49865 by temperature differential [e.g., shrink fit]

Abstract

A light emitting device with a heat sink composed of two materials is provided. The device comprises: a light emitting material; and, a heat sink comprising: a first material configured to cool the light emitting material, the first material comprising a first coefficient of thermal expansion (CTE); and, a second material bonded to the first material at an interface there between, the second material comprising a second CTE lower than the first CTE, the light emitting material bonded to the first material but not the second material.

Claims

1. A device comprising:

a light emitting material; and

,

a heat sink comprising;

a first material configured to cool the light emitting material, the first material comprising a first coefficient of thermal expansion (CTE); and

,

a second material bonded to the first material at an interface there between, the second material comprising a second CTE lower than the first CTE,

the light emitting material bonded to the first material but not the second material.

2. The device of claim 1, wherein the interface comprises one or more of:

a bond in stress between the first material and the second material;

a bond in tension between the first material and the second material;

a bond in shear between the first material and the second material;

a bond in peel between the first material and the second material; and

,

a bond in compression between the first material and the second material.

3. The device of claim 1, further comprising apparatus for bonding the first material to the second material, the apparatus comprising at least one of:

fasteners;

screws, dowels;

rivets;

epoxy;

adhesive;

a weld located at the interface;

solder located at the interface; and

brazing located at the interface.

4. The device of claim 1, wherein the first material comprises an aperture, and the second material is located in the aperture, the interface there between located at an edge of the aperture.

5. The device of claim 4, wherein the first material surrounds the second material.

6. The device of claim 1, wherein the first material comprises at least one planar surface, and the second material is bonded to the first material at the at least one planar surface.

7. The device of claim 1, wherein the second material is bonded to the first material at an outer edge of the first material, the interface there between located at the outer edge.

8. The device of claim 7, wherein the second material surrounds the first material.

9. The device of claim 1, wherein the first material is non-planar on a side opposite the light emitting material, and the second material is bonded to the side opposite the light emitting material.

10. The device of claim 1, wherein the heat sink comprises a cooling plate.

11. The device of claim 1, wherein the heat sink comprises a cooling drum.

12. The device of claim 1, wherein the first material comprises one or more of a first metal and aluminum, and the second material comprises one or more of a second metal, stainless steel, copper-tungsten, an alloy of iron-nickel-cobalt, ceramic, and glass.

13. The device of claim 1, further comprising a third material bonded to the second material at a respective interface there between, such that the second material is sandwiched between the first material and the third material, the third material comprising a third CTE lower than the second CTE.

15. The method of claim 13, wherein applying the stress comprises one or more of:

raising a temperature of one or more of the first material and the second material; and

applying mechanical stress to one or more of the first material and the second material.

14. A method comprising:

assembling a device comprising;

a light emitting material;

a heat sink configured to cool the light emitting material, the heat sink comprising;

a first material configured to cool the light emitting material, the first material comprising a first coefficient of thermal expansion (CTE); and

, a second material bonded to the first material at an interface there between, the second material comprising a second (CTE) lower than the first CTE, the light emitting material bonded to the first material but not the second material, by;

applying stress to one or more of the first material and the second material at the interface;

bonding the first material and the second material while the stress is being applied; and

,

bonding the light emitting material to the first material.