POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION

• US 20150219991A1
• Filed: 09/24/2012
• Published: 08/06/2015
• Est. Priority Date: 09/24/2012
• Status: Abandoned Application

• Current Assignee: Toray Industries Incorporated
• Original Assignee: Toray Industries Incorporated
• Inventors: Masuda, Yuki, Onishi, Hiroyuki, Tomikawa, Masao, Kamemoto, Satoshi
• Application Number:
  US14/422,572
• Publication Number:
  US 20150219991A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G03F 7/0226 characterised by the non-macromolecular additives
• CPC Class Codes: G03F 7/0233 characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
• CPC Class Codes: G03F 7/039 Macromolecular compounds which are photodegradable, e.g. positive electron resists G03F7/075 takes precedence; macromolecular quinonediazides G03F7/023
• CPC Class Codes: G03F 7/40 Treatment after imagewise removal, e.g. baking

Abstract

Disclosed is a positive-type photosensitive resin composition including (a) an alkali-soluble polyimide, (b) a compound having two or more epoxy groups in a molecule, and (c) a photo acid generator, wherein the content of the compound having two or more epoxy groups in a molecule (b) is within a range of 5 to 50 parts by weight based on 100 parts by weight of the alkali-soluble polyimide (a). The present invention provides a positive-type photosensitive resin composition capable of obtaining a high-resolution cured film which exhibits low warpage and also does not cause pattern embedment by reflow during a heating treatment at a low temperature of 200° C. or lower.

Claims

1. A positive-type photosensitive resin composition comprising (a) an alkali soluble polyimide, (b) a compound having two or more epoxy groups in a molecule, and (c) a photo acid generator, wherein the content of the compound having two or more epoxy groups in a molecule (b) is within a range of 5 to 50 parts by weight based on 100 parts by weight of the alkali-soluble polyimide (a).

2. The positive-type photosensitive resin composition according to claim 1, wherein the compound having two or more epoxy groups in a molecule (b) has a polyalkylene oxide group.

3. The positive-type photosensitive resin composition according to claim 1, wherein the alkali-soluble polyimide (a) includes a diamine residue having a polyalkylene oxide group and/or a carboxylic acid residue having a polyalkylene oxide group.

4. The positive-type photosensitive resin composition according to claim 3, wherein the proportion of total residues of the diamine residue having a polyalkylene oxide group and the carboxylic acid residue having a polyalkylene oxide group is within a range of 5 to 20 mol % based on 100 mol % of the total of all diamine residues and all carboxylic acid residues included in the alkali-soluble polyimide (a).

5. The positive-type photosensitive resin composition according to claim 2, wherein the polyalkylene oxide group is a polyethylene oxide group.

6. The positive-type photosensitive resin composition according to claim 1, further comprising (d) a thermally crosslinkable compound (d), the content of the component (d) being within a range of 1 to 15 parts by weight based on 100 parts by weight of the alkali-soluble polyimide (a).

7. The positive-type photosensitive resin composition according to claim 1, wherein a weight ratio of the compound having two or more epoxy groups in a molecule (b) to the thermally crosslinkable compound (d) is within a range of 15:

1 to 1;

1.

8. The positive-type photosensitive resin composition according to claim 6, wherein the thermally crosslinkable compound (d) is a compound having at least two alkoxymethyl groups or methylol groups.