Power Conversion Apparatus

• US 20150223366A1
• Filed: 07/24/2013
• Published: 08/06/2015
• Est. Priority Date: 09/28/2012
• Status: Active Grant

• Current Assignee: Hitachi Automotive Systems Limited (Hitachi, Ltd.)
• Original Assignee: Hitachi Automotive Systems Limited (Hitachi, Ltd.)
• Inventors: Nishihara, Atsuo, Nakatsu, Kinya, Kuwano, Morio, Hara, Yosei, Horiuchi, Keisuke
• Granted Patent: US 9,510,487 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 7/20254 Cold plates transferring heat from heat source to coolant
• CPC Class Codes: H05K 7/2089 for power electronics, e.g. for inverters for controlling motor
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change

Abstract

A power conversion apparatus includes: a power semiconductor module (150a); a flow channel forming body (20) for housing the power semiconductor module (150a); and a cover (5) for fixing the power semiconductor module (150a) to the flow channel forming body (20), and the power semiconductor module (150a) includes a power semiconductor element, main terminals (157b, 158b) electrically connected to the power semiconductor element, and a case for housing the power semiconductor element, the cover (5) has a recessed portion (5c) and an opening (5a) provided in a bottom surface portion of the recessed portion (5c), the power semiconductor module (150a) is placed to be fitted into the recessed portion (5c), the power semiconductor module (150a) is fixed to the cover (5) so that the main terminals (157b, 158b) pass through the opening (5a), the case and an inner wall of the recessed portion (5c) have an airtight structure, and therefore prevents intrusion of a coolant into the power semiconductor module having a double-sided cooling structure and outflow of the coolant to outside of the module.

Claims

1. A power conversion apparatus, comprising:

a power semiconductor module for converting direct-current power into alternating-current power;

a first flow channel forming body for housing the power semiconductor module; and

a cover for fixing the power semiconductor module to the first flow channel forming body, wherein;

the power semiconductor module includes a power semiconductor element, main terminals electrically connected to the power semiconductor element, and a case for housing the power semiconductor element;

the cover has a recessed portion and an opening provided in a bottom surface portion of the recessed portion;

the power semiconductor module is placed to be fitted into the recessed portion;

the power semiconductor module is fixed to the cover so that the main terminals pass through the opening; and

the case and an inner wall of the recessed portion have an airtight structure.

2. The power conversion apparatus according to claim 1, wherein:

the first flow channel forming body includes a power semiconductor module accommodating part;

the power semiconductor module accommodating part has a module insertion port and a coolant introduction port;

the power semiconductor module is accommodated in the power semiconductor module accommodating part through the module insertion port; and

the case is directly contacted with a cooling coolant flown from the coolant introduction port.

3. The power conversion apparatus according to claim 1, wherein:

the case has a fin on an outer surface of the case;

the case is such that a thickness of a part in contact with the inner wall of the recessed portion is smaller than a thickness of a part on which the fin is provided, the thickness including a height of the fin.

4. The power conversion apparatus according to claim 1, wherein:

a side surface of the case for housing the power semiconductor element has a curved surface and has a substantially elliptical shape.

5. The power conversion apparatus according to claim 1, further comprising:

a capacitor module for smoothing the direct-current power;

a driver circuit substrate; and

a control circuit substrate, wherein

the capacitor module, the driver circuit substrate, and the control circuit substrate are provided in the first flow channel forming body.

6. The power conversion apparatus according to claim 1, further comprising:

a capacitor module for smoothing the direct-current power;

a boosting circuit for boosting the direct-current power; and

a housing for housing the power semiconductor module, the capacitor module, and the boosting circuit, wherein;

the housing has a second flow channel forming body integrally provided with the housing inside the housing;

the power semiconductor module and the capacitor module are placed on one side of the second flow channel forming body; and

the boosting circuit is placed on the other side of the second flow channel forming body.

7. The power conversion apparatus according to claim 1, wherein

a conductor plate for connecting the power semiconductor module to another member is closely attached to the case including a protrusion portion.