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ATOMIC SOURCE WITH HEATER ON THERMAL ISOLATION DIE

  • US 20150226669A1
  • Filed: 04/09/2014
  • Published: 08/13/2015
  • Est. Priority Date: 02/12/2014
  • Status: Active Grant
First Claim
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1. A chip scale atomic sensor comprising:

  • a body that defines at least one sensing chamber;

    a thermal isolation die mounted to the body, the thermal isolation die disposed in a location that communicates with the at least one sensing chamber, the thermal isolation die including;

    a substrate defining a frame portion and an isolated portion;

    a plurality of tethers mechanically coupling the isolated portion of the substrate to the frame portion;

    an atomic source mounted on the isolated portion of the substrate; and

    a heating element on the isolated portion and configured to heat the atomic source.

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