ATOMIC SOURCE WITH HEATER ON THERMAL ISOLATION DIE
First Claim
1. A chip scale atomic sensor comprising:
- a body that defines at least one sensing chamber;
a thermal isolation die mounted to the body, the thermal isolation die disposed in a location that communicates with the at least one sensing chamber, the thermal isolation die including;
a substrate defining a frame portion and an isolated portion;
a plurality of tethers mechanically coupling the isolated portion of the substrate to the frame portion;
an atomic source mounted on the isolated portion of the substrate; and
a heating element on the isolated portion and configured to heat the atomic source.
1 Assignment
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Accused Products
Abstract
In one embodiment, a chip scale atomic sensor is provided. The chip scale atomic sensor includes a body that defines at least one sensing chamber. The body includes a thermal isolation die mounted to the body. The thermal isolation die is disposed in a location that communicates with the at least one sensing chamber. The thermal isolation die includes a substrate defining a frame portion and an isolated portion and a plurality of tethers mechanically coupling the isolated portion of the substrate to the frame portion. The thermal isolation die also includes an atomic source mounted on the isolated portion of the substrate, and a heating element mounted on the isolated portion and configured to heat the atomic source.
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Citations
20 Claims
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1. A chip scale atomic sensor comprising:
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a body that defines at least one sensing chamber; a thermal isolation die mounted to the body, the thermal isolation die disposed in a location that communicates with the at least one sensing chamber, the thermal isolation die including; a substrate defining a frame portion and an isolated portion; a plurality of tethers mechanically coupling the isolated portion of the substrate to the frame portion; an atomic source mounted on the isolated portion of the substrate; and a heating element on the isolated portion and configured to heat the atomic source. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of controlling a vapor pressure in a chip scale atomic sensor, the method comprising:
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sensing a temperature proximate an atomic source; controlling a heating element proximate the atomic source based on the sensed temperature to maintain the temperature proximate the atomic source at a temperature set point; emitting light from a laser toward a vapor cloud of alkali atoms in a sensing chamber of the chip scale atomic sensor; sensing light in the sensing chamber, the light indicative of a vapor pressure of alkali atoms in the sensing chamber; and adjusting the temperature set point based on the sensed light in the sensing chamber to maintain the vapor pressure in the sensing chamber at a desired level. - View Dependent Claims (16)
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17. A chip scale atomic sensor comprising:
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a body that defines a sensing chamber; a thermal isolation die mounted to the body, the thermal isolation die disposed in a location that communicates with the sensing chamber, the thermal isolation die including; a substrate composed of silicon, the substrate defining a frame portion, an isolated portion, and a plurality of tethers mechanically extending between the isolated portion and the frame portion, wherein plurality of tethers extend through a gap in the substrate between the frame portion and the isolated portion; an atomic source mounted on the isolated portion of the substrate; a heating element on the isolated portion of the substrate; and a plurality of electrical leads disposed in part on the plurality of tethers, the plurality of leads electrically coupled to the heater. - View Dependent Claims (18, 19, 20)
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Specification