×

FINFET WITH BACKGATE, WITHOUT PUNCHTHROUGH, AND WITH REDUCED FIN HEIGHT VARIATION

  • US 20150228795A1
  • Filed: 02/12/2014
  • Published: 08/13/2015
  • Est. Priority Date: 02/12/2014
  • Status: Active Grant
First Claim
Patent Images

1. A FinFET comprising:

  • a substrate;

    a backgate comprising a first layer formed in the substrate, the first layer comprising a first semiconductor;

    a second layer formed over the first layer, the second layer comprising a second semiconductor;

    a fin channel formed over the second layer, the fin channel comprising a third semiconductor;

    a backgate contact through the second layer and in electrical contact with the first layer;

    a deep trench isolation region formed down into the substrate; and

    wherein the first semiconductor has a first bandgap and the third semiconductor has a third bandgap, wherein the second semiconductor has a second bandgap greater than the first bandgap and the second bandgap.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×