LIGHT EMITTING DEVICE

• US 20150228872A1
• Filed: 02/12/2015
• Published: 08/13/2015
• Est. Priority Date: 02/13/2014
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: NAGANO, Hiroto
• Granted Patent: US 9,666,567 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting device includes a base member; a light emitting element disposed on the base member via at least one first electrically conductive joining member such that a space is located between the light emitting element and a surface of the base member; and a protective element disposed on the base member via at least one second electrically conductive joining member. The protective element is located in the space. A light reflecting resin is located in the space and covers the protective element.

Claims

1. A light emitting device comprising:

a base member;

a light emitting element disposed on the base member via at least one first electrically conductive joining member such that a space is located between the light emitting element and a surface of the base member; and

a protective element disposed on the base member via at least one second electrically conductive joining member;

wherein the protective element is located in the space, and

wherein a light reflecting resin is located in the space and covers the protective element.

2. The light emitting device according to claim 1, wherein the light emitting element and the protective element are mounted on a same surface side of the base member.

3. The light emitting device according to claim 1, wherein the at least one first electrically conductive joining member includes a core and a coating outside of the core, and a melting point of the core is higher than a melting point of the coating.

4. The light emitting device according to claim 2, wherein the at least one first electrically conductive joining member includes a core and a coating outside of the core, and a melting point of the core is higher than a melting point of the coating.

5. The light emitting device according to claim 3, wherein the core comprises Cu and the coating is made of an alloy containing Au and at least one of Si, Ge, and Sn.

6. The light emitting device according to claim 4, wherein the core comprises Cu and the coating is made of an alloy containing Au and at least one of Si, Ge, and Sn.

7. The light emitting device according to claim 3, wherein the base member has an electrically conductive wiring on its surface, and the electrically conductive wiring and the coating are bonded through eutectic bonding.

8. The light emitting device according to claim 4, wherein the base member has an electrically conductive wiring on its surface, and the electrically conductive wiring and the coating are bonded through eutectic bonding.

9. The light emitting device according to claim 5, wherein the base member has an electrically conductive wiring on its surface, and the electrically conductive wiring and the coating are bonded through eutectic bonding.

10. The light emitting device according to claim 6, wherein the base member has an electrically conductive wiring on its surface, and the electrically conductive wiring and the coating are bonded through eutectic bonding.

11. The light emitting device according to claim 3, wherein a height of the core is higher than a height of the protective element.

12. The light emitting device according to claim 4, wherein a height of the core is higher than a height of the protective element.

13. The light emitting device according to claim 5, wherein a height of the core is higher than a height of the protective element.

14. The light emitting device according to claim 6, wherein a height of the core is higher than a height of the protective element.

15. A light emitting device comprising:

a base member;

a light emitting element disposed on the base member via at least one a first electrically conductive joining member; and

a protective element disposed on the base member via at least one second electrically conductive joining member,

wherein the at least one first electrically conductive joining member is a Cu-core ball, and

wherein in a height of the first electrically conductive joining member is greater than a height of the protective element.

16. The light emitting device according to claim 15, wherein the light emitting element and the protective element are mounted on a same surface side of the base member.

17. The light emitting device according to claim 15, wherein the at least one first electrically conductive joining member includes a Cu core and a coating outside of the Cu core.

18. The light emitting device according to claim 17, wherein a melting point of the Cu core is higher than a melting point of the coating.

19. The light emitting device according to claim 17, wherein the coating is made of an alloy containing Au and at least one of Si, Ge, and Sn.

20. The light emitting device according to claim 17, wherein the base member has an electrically conductive wiring on its surface, and the electrically conductive wiring and the coating are bonded through eutectic bonding.