SUBSTRATE ALIGNING APPARATUS, SUBSTRATE BONDING APPARATUS, SUBSTRATE ALIGNING METHOD AND SUBSTRATE BONDING METHOD

• US 20150231873A1
• Filed: 04/24/2015
• Published: 08/20/2015
• Est. Priority Date: 10/26/2012
• Status: Active Grant

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: OKAMOTO, Kazuya, Sugaya, Isao
• Granted Patent: US 9,919,508 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B32B 37/0046 characterised by constructional aspects of the apparatus
• CPC Class Codes: B32B 37/18 involving the assembly of discrete sheets or panels only
• CPC Class Codes: B32B 38/18 Handling of layers or the laminate
• CPC Class Codes: B32B 41/00 Arrangements for controlling or monitoring lamination processes; Safety arrangements
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: H01L 21/681 using optical controlling means

Abstract

A substrate aligning apparatus comprising: an aligning section that aligns a first substrate and a second substrate together; an acquiring section that acquires positional information on at least one of the first substrate and the second substrate, by the time the first substrate and the second substrate which have been aligned in the aligning section are carried out from the aligning section; a judging that judges misalignment of the first substrate and the second substrate, based on information acquired by the acquiring section.

Claims

1. A substrate aligning apparatus comprising:

an aligning section that aligns a first substrate and a second substrate together;

an acquiring section that acquires positional information on at least one of the first substrate and the second substrate, by the time the first substrate and the second substrate which have been aligned in the aligning section are carried out from the aligning section;

a judging section that judges misalignment of the first substrate and the second substrate, based on information acquired by the acquiring section.

2. The substrate aligning apparatus according to claim 1, wherein

the judging section compares the positional information and a threshold for judging occurrence of misalignment to judge whether misalignment has occurred.

3. The substrate aligning apparatus according to claim 2, further comprising:

a holding section that holds at least one of the first substrate and the second substrate, wherein

the positional information includes information on a position of the holding section.

4. The substrate aligning apparatus according to claim 3, wherein

the positional information includes information on a signal that shows light intensity due to interference of light reflected from a reflective member fixed to the holding section or the substrate.

5. The substrate aligning apparatus according to claim 4, wherein

the judging section judges whether a maximum value of amplitude of the signal is not less than the threshold, and judges that misalignment will occur, if the maximum value is not less than the threshold.

6. The substrate aligning apparatus according to claim 4, wherein

the positional information includes a waveform of the signal, and

the judging section judges that misalignment will occur by comparing the waveform and a waveform that is seen when misalignment occurs.

7. The substrate aligning apparatus according to claim 1, wherein

based on the positional information, the judging section presumes at least one of whether misalignment will occur on the first substrate and the second substrate after detecting the positional information, and a factor of occurrence of the misalignment.

8. The substrate aligning apparatus according to claim 1, wherein

the judging section judges misalignment from the positional information in at least one of timings:

when the first substrate and the second substrate which have been aligned gets in contact with each other;

when a carrying section carrying out the first substrate and the second substrate which have been aligned from the aligning section gets in contact with at least one of the first substrate and the second substrate; and

when the first substrate and the second substrate which have been aligned are clamped by a clamping section.

9. The substrate aligning apparatus according to claim 1, comprising:

a moving section which moves at least one of the first substrate and the second substrate; and

a drive control section that drives the moving section to align the first substrate and the second substrate, wherein

the drive control section aligns the first substrate and the second substrate again, if the judging section judges that the misalignment has occurred, or judges that the misalignment will occur.

10. The substrate aligning apparatus according to claim 1, wherein

information on the first substrate and the second substrate includes information on temporal change in positions of the first substrate and the second substrate.

12. The substrate aligning apparatus according to claim 1, wherein

the aligning section temporarily stacks the first substrate and the second substrate.

13. The substrate aligning apparatus according to claim 1, wherein

the aligning section electrically stacks a first circuit provided on the first substrate and a second circuit provided on the second substrate.

14. A substrate bonding apparatus comprising:

the substrate aligning apparatus according to claim 1; and

a stacking section that stacks the first substrate and the second substrate together which have been aligned on the aligning apparatus.

11. A substrate aligning apparatus comprising:

an aligning section that aligns a pair of substrates;

a holding section that holds at least one of the pair of substrates; and

a judging section that judges whether there is misalignment of the pair of substrates which has been aligned by the aligning section, based on positional information of the holding section.

15. A substrate aligning method comprising:

aligning a first substrate and a second substrate together in an aligning section;

acquiring positional information on at least one of the first substrate and the second substrate, by the time the first substrate and the second substrate which have been aligned in the alignment are carried out from the aligning section; and

judging misalignment of the first substrate and the second substrate based on information acquired in the acquisition.

16. The substrate aligning method according to claim 15, wherein

the judging compares the positional information and a threshold for judging occurrence of misalignment to judge whether misalignment will occur.

17. The substrate aligning method according to claim 16, wherein

the positional information includes information on at least one of a position of a holding section that holds at least one of the first substrate and the second substrate, and a signal that shows light intensity due to interference of light reflected from a reflective member fixed to the holding section or the substrate.

18. The substrate aligning method according to claim 17, wherein

the judging judges whether a maximum value of amplitude of the signal is not less than the threshold, and judges that misalignment will occur, if the maximum value is net less than the threshold.

19. The substrate aligning method according to claim 17, wherein

the positional information includes a waveform of the signal, and

the judging judges that misalignment will occur by comparing the waveform and a waveform that is seen when misalignment occurs.

20. The substrate aligning method according to claim 15, wherein

based on the positional information, the judging presumes whether misalignment will occur on the first substrate and the second substrate after detecting the positional information.

21. The substrate aligning method according to claim 15, wherein

the judging judges misalignment from the positional information in at least one of timings:

when the first substrate and the second substrate which have been aligned get in contact with each other;

when a carrying section carrying out the first substrate and the second substrate which have been aligned from the aligning section gets in contact with at least one of the first substrate and the second substrate; and

when the first substrate and the second substrate which have been aligned are clamped by a clamping section.

22. The substrate aligning method according to claim 15, further comprising:

drive controlling by driving a moving section to move at least one of the first substrate or the second substrate to align the first substrate and the second substrate, wherein

if the judging judges that the misalignment has occurred, or judges that the misalignment will occur, the first substrate and the second substrate are aligned again by the drive controlling.

23. The substrate aligning method according to claim 15, wherein

information on the first substrate and the second substrate in the aligning section includes information on temporal change in positions of the first substrate and the second substrate.

25. The substrate aligning method according to claim 15, wherein

the aligning includes temporarily stacking the first substrate and the second substrate.

26. The substrate aligning method according to claim 15, wherein

the aligning includes electrically stacking a first circuit provided on the first substrate and a second circuit provided on the second substrate.

27. A substrate bonding method comprising:

the substrate aligning method according to claim 15; and

stacking the first substrate and the second substrate together that have been aligned by the aligning method.

24. A substrate aligning method comprising:

aligning a first substrate and second substrate in an aligning section;

judging whether there is misalignment of the first substrate and the second substrate that have been aligned in the aligning, based on positional information of a holding section that holds at least one of the first substrate and the second substrate.