Multi-Channel Backside Wafer Inspection
First Claim
1. A system inspecting a backside surface of a wafer with multi-channel focus control comprising:
- a plurality of inspection sub-systems including a first inspection sub-system positionable at a first wafer position and at least an additional inspection sub-system positionable at an additional wafer position,wherein the first inspection sub-system comprises;
an first optical assembly;
a first actuation assembly, wherein the first optical assembly is disposed on the first actuation assembly; and
a first positional sensor configured to sense a position characteristic between a portion of the first optical assembly and the backside surface of the wafer;
wherein the at least an additional inspection sub-system comprises;
at least an additional optical assembly;
at least an additional actuation assembly, wherein the at least an additional optical assembly is disposed on the at least an additional actuation assembly; and
at least an additional positional sensor configured to sense a position characteristic between a portion of the at least an additional optical assembly and the backside surface of the wafer; and
a controller, wherein the controller is communicatively coupled to the first actuation assembly, the at least an additional actuation assembly, the first positional sensor and the at least an additional positional sensor, wherein the controller is configured to execute a set of program instructions configured to cause one or more processors to;
acquire one or more wafer profile maps of the backside surface of the wafer; and
adjust at least one of a first focus position of the first inspection sub-system or at least an additional focus position of the at least an additional inspection sub-system based on the received one or more wafer profile maps.
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Accused Products
Abstract
A system for inspecting a backside surface of a wafer with multi-channel focus control includes a set of inspection sub-systems including a first inspection sub-system positioned and an additional inspection sub-system. The first and additional inspection sub-systems include an optical assembly, an actuation assembly, where the optical assembly is disposed on the actuation assembly, and a positional sensor configured to sense a position characteristic between a portion of the optical assembly and the backside surface of the wafer. The system also includes a controller configured to acquire one or more wafer profile maps of the backside surface of the wafer and adjust a first focus position of the first inspection sub-system or an additional focus position of the additional inspection sub-system based on the received one or more wafer profile maps.
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Citations
22 Claims
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1. A system inspecting a backside surface of a wafer with multi-channel focus control comprising:
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a plurality of inspection sub-systems including a first inspection sub-system positionable at a first wafer position and at least an additional inspection sub-system positionable at an additional wafer position, wherein the first inspection sub-system comprises;
an first optical assembly;
a first actuation assembly, wherein the first optical assembly is disposed on the first actuation assembly; and
a first positional sensor configured to sense a position characteristic between a portion of the first optical assembly and the backside surface of the wafer;wherein the at least an additional inspection sub-system comprises;
at least an additional optical assembly;
at least an additional actuation assembly, wherein the at least an additional optical assembly is disposed on the at least an additional actuation assembly; and
at least an additional positional sensor configured to sense a position characteristic between a portion of the at least an additional optical assembly and the backside surface of the wafer; anda controller, wherein the controller is communicatively coupled to the first actuation assembly, the at least an additional actuation assembly, the first positional sensor and the at least an additional positional sensor, wherein the controller is configured to execute a set of program instructions configured to cause one or more processors to; acquire one or more wafer profile maps of the backside surface of the wafer; and adjust at least one of a first focus position of the first inspection sub-system or at least an additional focus position of the at least an additional inspection sub-system based on the received one or more wafer profile maps. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A system for inspecting a backside surface of a wafer with multi-channel focus control comprising:
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a plurality of inspection sub-systems including a first inspection sub-system and at least an additional inspection sub-system, wherein the first inspection sub-system comprises;
an first optical assembly; and
a first actuation assembly, wherein the first optical assembly is disposed on the first actuation assembly;wherein the at least an additional inspection sub-system comprises;
at least an additional optical assembly; and
at least an additional actuation assembly, wherein the at least an additional optical assembly is disposed on the at least an additional actuation assembly;a wafer shape measurement system configured to measure a position of at least a portion of the backside surface of the wafer; and a controller, wherein the controller is communicatively coupled to the first actuation assembly, the at least an additional actuation assembly, the wafer shape measurement system, wherein the controller is configured to execute a set of program instructions configured to cause one or more processors to; acquire wafer shape data, from the wafer shape measurement system; acquire the measured position of at least a portion of the backside surface of the wafer, from the wafer shape measurement system, at least corresponding with at least one of the first inspection sub-system or the at least an additional inspection sub-system; and adjust at least one of a first focus position of the first inspection sub-system or at least an additional focus position of the at least an additional inspection sub-system based on the acquired wafer shape data and the acquired measured position of at least the portion of the backside surface of the wafer. - View Dependent Claims (14, 15, 16)
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17. A system for inspecting a backside surface of a wafer with multi-channel focus control comprising:
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a plurality of inspection sub-systems including a first inspection sub-system and at least an additional inspection sub-system, wherein the first inspection sub-system comprises;
an first optical assembly;
a first actuation assembly, wherein the first optical assembly is disposed on the first actuation assembly; and
a first focus measurement device configured to measure the focus of illumination from the first inspection sub-system;wherein the at least an additional inspection sub-system comprises;
at least an additional optical assembly;
at least an additional actuation assembly, wherein the at least an additional optical assembly is disposed on the at least an additional actuation assembly; and
an additional focus measurement device configured to measure the focus of illumination from the at least an additional inspection sub-system;a controller, wherein the controller is communicatively coupled to the first actuation assembly, the at least an additional actuation assembly, the first positional sensor and the at least an additional positional sensor, wherein the controller is configured to execute a set of program instructions configured to cause one or more processors to; receiving a measured first focus of illumination from the first inspection sub-system; receiving at least an additional focus of illumination from the at least an additional inspection sub-system; and adjust at least one of a first focus position of the first inspection sub-system or at least an additional focus position of the at least an additional inspection sub-system based on at least one of the measured first focus and the measured at least an additional focus. - View Dependent Claims (18, 19)
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20. A method for multi-channel focus control during backside wafer inspection comprising:
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acquiring one or more wafer profile maps of the backside surface of the wafer; measuring a first position characteristic between a portion of a first optical assembly of a first inspection sub-system and the backside surface of the wafer measuring a second position characteristic between a portion of second optical assembly of a second inspection sub-system and the backside surface of the wafer determining a first focus offset between the backside surface of the wafer and the portion of the first optical assembly by comparing the first position characteristic to the received one or more wafer profile maps; determining a second focus offset between the backside surface of the wafer and the portion of the second optical assembly by comparing the second position characteristic to the received one or more wafer profile maps; and adjusting a first focus position of the first inspection sub-system sufficient to correct the determined first focus offset; and adjusting a second focus position of the second inspection sub-system sufficient to correct the determined second focus offset.
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21. A method for multi-channel focus control during backside wafer inspection comprising:
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acquiring wafer shape data at least corresponding with a first wafer position of at least one of the first inspection sub-system or a second wafer position of the at least an additional inspection sub-system; measuring a first position characteristic between a portion of a first optical assembly of the first inspection sub-system and the backside surface of the wafer; measuring a second position characteristic between a portion of second optical assembly of the second inspection sub-system and the backside surface of the wafer; determining a first focus offset between the backside surface of the wafer and the portion of the first optical assembly by comparing the first position characteristic to profile values of the wafer shape data corresponding with the first wafer position; determining a second focus offset between the backside surface of the wafer and the portion of the second optical assembly by comparing the second position characteristic to profile values of the wafer shape data corresponding with the second wafer position; and adjust a first focus position of the first inspection sub-system sufficient to correct the determined first focus offset; and adjust a second focus position of the second inspection sub-system sufficient to correct the determined second focus offset.
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22. A method for multi-channel focus control during backside wafer inspection comprising:
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measuring a first focus of illumination directed to the backside surface of the wafer from a first inspection sub-system located at a first wafer position; measuring a second focus of illumination directed to the backside surface of the wafer from a second inspection sub-system located at a second wafer position; adjusting a first focus position of the first inspection sub-system based on the first measured focus at the first wafer position; and adjusting a second focus position of the second inspection sub-system based on the second measured focus at the second wafer position.
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Specification