Biometrics Sensor Having Flat Contact Surface Formed by Signal Extending Structure and Method of Manufacturing Such Sensor

• US 20150235071A1
• Filed: 02/13/2015
• Published: 08/20/2015
• Est. Priority Date: 02/17/2014
• Status: Abandoned Application

• Current Assignee: J-Metrics Technology Co., Ltd.
• Original Assignee: J-Metrics Technology Co., Ltd.
• Inventors: CHANG, Jer-Wei
• Application Number:
  US14/622,384
• Publication Number:
  US 20150235071A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G06V 40/1312 direct reading, e.g. contactless acquisition
• CPC Class Codes: G06V 40/1329 Protecting the fingerprint sensor against damage caused by the finger
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 2224/24137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2224/92244 the second connecting process involving a build-up interconnect
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1815 Shape

Abstract

A biometrics sensor comprises: a base; a biometrics sensing module disposed on the base and comprising a biometrics sensing chip and a signal extending structure, both of which functionally link with each other to sense a fine biometrics characteristic of an organism to obtain a biometrics signal; a signal transmission structure disposed on the base and one side or sides of the biometrics sensing module and having a first connection end electrically connected to the signal extending structure, and a second connection end near the base, so that the biometrics signal is transmitted from the biometrics sensing module to the second connection end; and a molding layer, connected to the base, the biometrics sensing module and the signal transmission structure, with an upper surface of the signal extending structure being exposed from the molding layer. A method of manufacturing the biometrics sensor is also disclosed.

Claims

1. A biometrics sensor, comprising:

a base;

a biometrics sensing module, which is disposed on an upper surface of the base, and comprises a biometrics sensing chip and a signal extending structure, wherein the signal extending structure is disposed on and electrically connected to the biometrics sensing chip, the signal extending structure and the biometrics sensing chip functionally link with each other to sense a fine biometrics characteristic of an organism, contacting or approaching the biometrics sensor, to obtain a biometrics signal;

a signal transmission structure, which is disposed on the base and one side or sides of the biometrics sensing module, and has a first connection end electrically connected to the signal extending structure, and a second connection end near the base, so that the biometrics signal is transmitted from the biometrics sensing module to the second connection end, wherein the signal extending structure comprises a horizontally outwardly expanded connection structure electrically connecting connection pads of the biometrics sensing chip to the signal transmission structure; and

a molding layer, connected to the base, the biometrics sensing module and the signal transmission structure, so that a sensing surface and an electrical signal interface of the biometrics sensor are disposed on a front side and a back side of the biometrics sensor, respectively.

2. The biometrics sensor according to claim 1, further comprising:

a signal output structure, electrically connected to the second connection end and disposed on the base.

3. The biometrics sensor according to claim 2, wherein the signal transmission structure comprises a conductor layer and a redistribution layer, and the conductor layer is electrically connected to the signal output structure through traces of the redistribution layer.

4. The biometrics sensor according to claim 1, further comprising:

an external protection layer covering the signal extending structure and the molding layer.

5. The biometrics sensor according to claim 1, wherein the biometrics sensing module is disposed on the base through a stopper layer.

6. The biometrics sensor according to claim 1, wherein the biometrics sensing chip further comprises:

a substrate, on which the connection pads is formed; and

a chip protection layer, which is formed on the substrate, partially covers the connection pads, and has windows through which the connection pads are partially exposed from the chip protection layer.

7. The biometrics sensor according to claim 6, wherein the signal extending structure further comprises:

a second molding layer; and

first outward extending electrodes, which are embedded into the second molding layer and disposed on the connection pads, respectively.

8. The biometrics sensor according to claim 1, wherein:

the biometrics sensing chip further comprises;

a substrate, on which the connection pads are formed;

sensing electrodes formed on the substrate;

and a chip protection layer, which is formed on the substrate, partially covers the sensing electrodes and the connection pads, and has windows through which the connection pads and the sensing electrodes are partially exposed from the chip protection layer; and

the signal extending structure further comprises;

a second molding layer; and

first outward extending electrodes, which are embedded into the second molding layer and second outward extending electrodes, and are disposed on the connection pads, respectively, wherein the second outward extending electrodes are disposed on the sensing electrodes, respectively.

9. A method of manufacturing a biometrics sensor, the method comprising the steps of:

(a) providing a biometrics sensing chip;

(b) forming one portion of a signal extending structure on the biometrics sensing chip to constitute one portion of a biometrics sensing module;

(c) providing a base structure having a base and a signal transmission structure disposed on the base;

(d) disposing the one portion of the biometrics sensing module on an upper surface of the base with the signal transmission structure being disposed on one side or sides of the biometrics sensing module;

(e) utilizing a molding layer connected to the base, the one portion of the biometrics sensing module and the signal transmission structure with the one portion of the signal extending structure being exposed from the molding layer; and

(f) forming the other portion of the signal extending structure to electrically connect the one portion of the signal extending structure to the signal transmission structure, wherein the signal extending structure comprises a horizontally outwardly expanded connection structure, which electrically connects connection pads of the biometrics sensing chip to the signal transmission structure, the signal extending structure and the biometrics sensing chip functionally link with each other to sense a fine biometrics characteristic of an organism, contacting or approaching the signal extending structure, to obtain a biometrics signal transmitted to the signal transmission structure, so that a sensing surface and an electrical signal interface of the biometrics sensor are disposed on a front side and a back side of the biometrics sensor, respectively.

10. The method according to claim 9, wherein the signal transmission structure has a first connection end electrically connected to the signal extending structure, and a second connection end near the base, and the method further comprises the step of:

(g) forming a signal output structure, electrically connected to the second connection end, on the base.

11. The method according to claim 9, wherein the biometrics sensing chip comprises:

a substrate, on which the connection pads are formed; and

a chip protection layer, which is formed on the substrate, partially covers the connection pads and has windows through which the connection pads are partially exposed from the chip protection layer, and the step (b) comprises the following steps;

(b1) forming a seed layer on the chip protection layer and the connection pads;

(b2) forming a patterned resist layer on the seed layer to partially expose the seed layer;

(b3) performing electroplating using the partially exposed seed layer;

(b4) removing the patterned resist layer and a portion of the seed layer to form first outward extending electrodes; and

(b5) pouring a molding compound to form a second molding layer for embedding the first outward extending electrodes of the second molding layer.

12. The method according to claim 9, wherein the biometrics sensing chip comprises:

a substrate;

connection pads formed on the substrate; and

a chip protection layer, which is formed on the substrate, partially covers the connection pads and has windows, through which the connection pads are partially exposed from the chip protection layer, and the step (b) comprises the following steps;

(b1) forming a seed layer on the chip protection layer and the connection pads;

(b2) forming a patterned resist layer on the seed layer to partially expose the seed layer;

(b3) performing electroplating using the partially exposed seed layer;

(b4) removing the patterned resist layer and a portion of the seed layer to form first outward extending electrodes;

(b5) pouring a molding compound to form a second molding layer and a sacrificial protection layer of the biometrics sensing chip; and

(b6) removing the sacrificial protection layer with the second molding layer being left.

13. The method according to claim 9, wherein the step (c) comprises the following steps:

(c1) disposing the base on a carrier wafer;

(c2) forming a seed layer on the base;

(c3) forming a patterned resist layer on the seed layer to partially expose the seed layer;

(c4) performing electroplating using the partially exposed seed layer; and

(c5) removing the patterned resist layer and a portion of the seed layer to form the signal transmission structure.

14. The method according to claim 13, wherein the signal transmission structure has a first connection end electrically connected to the signal extending structure, and a second connection end exposed from the base, and the method further comprises the steps of:

(g) forming a signal output structure, electrically connected to the second connection end, on the base.

15. The method according to claim 9, wherein the step (c) comprises the following steps:

(c1) forming a redistribution layer on a carrier wafer, and disposing the base on the redistribution layer;

(c2) forming a seed layer, electrically connected to the redistribution layer, on the base;

(c3) forming a patterned resist layer on the seed layer to partially expose the seed layer;

(c4) performing electroplating using the partially exposed seed layer; and

(c5) removing the patterned resist layer and a portion of the seed layer to form the signal transmission structure.

16. The method according to claim 15, wherein the signal transmission structure has a first connection end electrically connected to the signal extending structure, and a second connection end near the base, and the method further comprises the step of:

(g) forming a signal output structure, electrically connected to the redistribution layer, on the base.

17. A biometrics sensor, comprising:

a base;

a biometrics sensing module, which is disposed on an upper surface of the base and comprises a biometrics sensing chip, a signal processing chip and a signal extending structure, wherein the signal extending structure is disposed on and electrically connected to the biometrics sensing chip and the signal processing chip, the signal extending structure functionally links with the biometrics sensing chip and the signal processing chip to sense a fine biometrics characteristic of an organism, contacting or approaching the biometrics sensor, to obtain a biometrics signal, and the signal processing chip receives and processes a sensing signal coming from the biometrics sensing chip to obtain the biometrics signal;

a signal transmission structure, which is disposed on the base and one side or sides of the biometrics sensing module, and has a first connection end electrically connected to the signal extending structure, a second connection end near the base and a middle connection portion electrically connected to the biometrics sensing chip and the signal processing chip, wherein the signal transmission structure transmits the biometrics signal from the biometrics sensing module to the second connection end, wherein the signal extending structure comprises a horizontally outwardly expanded connection structure electrically connecting output connection pads of the signal processing chip to the signal transmission structure; and

a molding layer connected to the base, the biometrics sensing module and the signal transmission structure with a sensing surface and an electrical signal interface of the biometrics sensor being disposed on a front side and a back side of the biometrics sensor, respectively.

18. The biometrics sensor according to claim 17, further comprising:

a signal output structure electrically connected to the second connection end and disposed on the base.

19. The biometrics sensor according to claim 18, wherein the signal transmission structure comprises a conductor layer and a redistribution layer, and the conductor layer is electrically connected to the signal output structure through traces of the redistribution layer.

20. The biometrics sensor according to claim 17, further comprising:

an external protection layer covering the signal extending structure and the molding layer.

21. The biometrics sensor according to claim 17, wherein the biometrics sensing module is disposed on the base through a stopper layer.

22. The biometrics sensor according to claim 17, wherein:

the biometrics sensing chip comprises;

a substrate;

connection pads, formed on the substrate; and

a chip protection layer, which is formed on the substrate, partially covers the connection pads, and has windows, through which the connection pads are partially exposed from the chip protection layer; and

the signal processing chip further comprises;

a substrate;

the output connection pads and input connection pads formed on the substrate; and

a chip protection layer, which is formed on the substrate, partially covers the input connection pads and the output connection pads, and has windows, through which the input connection pads and the output connection pads are partially exposed from the chip protection layer.

23. The biometrics sensor according to claim 22, wherein the signal extending structure further comprises:

a second molding layer and a third molding layer; and

first outward extending electrodes embedded into the second molding layer, and third outward extending electrodes and fourth outward extending electrodes embedded into the third molding layer, wherein the first outward extending electrodes are disposed on the connection pads, respectively, the third outward extending electrodes are disposed on the output connection pads, respectively, and the fourth outward extending electrodes are disposed on the input connection pads, respectively.

24. A method of manufacturing a biometrics sensor, the method comprising the steps of:

(a) providing a biometrics sensing chip and a signal processing chip;

(b) forming one portion of a signal extending structure on the biometrics sensing chip and the signal processing chip to constitute one portion of a biometrics sensing module;

(c) providing a base structure having a base and a signal transmission structure disposed on the base;

(d) disposing the one portion of the biometrics sensing module on an upper surface of the base with the signal transmission structure being disposed on one side or sides of the biometrics sensing module;

(e) utilizing a molding layer connected to the base, the one portion of the biometrics sensing module and the signal transmission structure with the one portion of the signal extending structure being exposed from the molding layer; and

(f) forming the other portion of the signal extending structure to electrically connect the one portion of the signal extending structure to the signal transmission structure, and to electrically connect the biometrics sensing chip to the signal processing chip, wherein the signal extending structure functionally links with the biometrics sensing chip and the signal processing chip to sense a fine biometrics characteristic of an organism, contacting or approaching the signal extending structure, to obtain a biometrics signal transmitted to the signal transmission structure, so that a sensing surface and an electrical signal interface of the biometrics sensor are disposed on a front side and a back side of the biometrics sensor, respectively, wherein the signal processing chip receives and processes a sensing signal coming from the biometrics sensing chip to obtain the biometrics signal.

25. The method according to claim 24, wherein the signal transmission structure has a first connection end electrically connected to the signal extending structure, a second connection end near the base and a middle connection portion electrically connected to the biometrics sensing chip and the signal processing chip, wherein the signal extending structure comprises a horizontally outwardly expanded connection structure electrically connecting connection pads of the biometrics sensing chip to the signal transmission structure, and the method further comprises the step of:

(g) forming a signal output structure, electrically connected to the second connection end, on the base.