LIGHT EMITTING DIODE CHIP HAVING ELECTRODE PAD
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Accused Products
Abstract
Disclosed herein in an LED chip including electrode pads. The LED chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer, a first electrode pad located on the second conductive type semiconductor layer opposite to the second conductive type semiconductor layer, a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer, a second electrode pad electrically connected to the second conductive type semiconductor layer, and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer. The LED chip includes the first electrode pad on the second conductive type semiconductor layer, thereby increasing a light emitting area.
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Citations
71 Claims
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1-44. -44. (canceled)
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45. A light emitting diode (LED) comprising:
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a substrate having a first edge, a second edge opposite to the first edge, a third edge connecting the first edge to the second edge, and a fourth edge opposite to the third edge; a semiconductor stack disposed over a first surface of the substrate, the semiconductor stack comprising; a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer; a first electrode pad electrically connected to the first conductivity-type semiconductor layer and disposed over the second conductivity-type semiconductor layer and on at least a portion of the first edge of the substrate; a first electrode extension extending from the first electrode pad along at least a portion of the first edge and at least a portion of the third edge, the first electrode extension electrically connected to the first conductivity-type semiconductor layer; a second electrode pad electrically connected to the second conductivity-type semiconductor layer, wherein the second electrode pad is disposed over the second conductively-type semiconductor layer and on at least a portion of the second edge of the substrate; a first insulation layer interposed between the first electrode pad and the second conductivity-type semiconductor layer; a second insulation functional layer interposed between the second electrode pad and the second conductivity type semiconductor layer; and a transparent conductive layer disposed over the second conductivity-type semiconductor layer and between the second electrode extension and the second conductivity type semiconductor layer, wherein the transparent conductive layer is separated from the first insulation layer. - View Dependent Claims (46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60)
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61. A light emitting diode (LED) comprising:
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a substrate; a semiconductor stack disposed over a surface of the substrate, the semiconductor stack including; a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer, wherein the semiconductor stack is disposed to include a plurality of through-holes extending through the second conductivity-type semiconductor layer to expose a portion of the first conductivity-type semiconductor layer; a first electrode pad disposed over the second conductivity-type semiconductor layer and electrically connected to the first conductivity-type semiconductor layer through at least one of the through-holes of the semiconductor stack; a second electrode pad disposed over and electrically connected to the second conductively-type semiconductor layer, wherein the second electrode pad and the first electrode pad are disposed on opposing regions on the surface of the substrate; a first electrode extension extending from the first electrode pad towards the second electrode pad, wherein the first electrode extension is electrically connected to the first conductivity-type semiconductor layer through at least some of the through-holes of the semiconductor stack; and a second electrode extension extending from the second electrode pad towards the first electrode pad. - View Dependent Claims (62, 63, 64, 65, 66, 67)
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68. A light emitting diode (LED) comprising:
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a substrate; a semiconductor stack disposed over a surface of the substrate, the semiconductor stack including; a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer, wherein the semiconductor stack is disposed to include means for providing electrical connections to the first conductivity-type semiconductor layer through the second conductivity-type semiconductor layer; a transparent conductive layer disposed over a portion of the second conductivity-type semiconductor layer; a first electrode pad disposed over the second conductivity-type semiconductor layer and electrically connected to the first conductivity-type semiconductor layer through the means for providing electrical connections to the first conductivity-type semiconductor layer; a second electrode pad disposed over the transparent conductive layer and electrically connected to the second conductively-type semiconductor layer, wherein the second electrode pad and the first electrode pad are disposed on opposing regions on the surface of the substrate; a first electrode extension extending from the first electrode pad towards the second electrode pad; a second electrode extension extending from the second electrode pad towards the first electrode pad; a first insulation means interposed between the first electrode pad and the second conductivity-type semiconductor layer; and a second insulation means interposed between the transparent conductive layer and the second conductivity type semiconductor layer. - View Dependent Claims (69, 70, 71)
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Specification